F-215 (Rev 01JUL16) (1.27 mm) .050" SEAM SERIES HIGH-SPEED/HIGH-DENSITY OPEN-PIN-FIELD SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?SEAM Insulator Material: Black LCP Contact Material: Copper Alloy Operating Temp Range: -55 °C to +125 °C Current Rating (7 mm stack height): 1.8 A per pin (10 adjacent pins powered) Plating: Au or Sn over 50 µ" (1.27 µm) Ni Contact Resistance: 5.5 mW Working Voltage: 240 VAC RoHS Compliant: Yes Lead-Free Solderable: Yes RECOGNITIONS For complete scope of recognitions see www.samtec.com/quality FILE NO. E111594 STANDARDS • PISMO 2 • VITA 47 • VITA 57.1 PROTOCOLS • 100 GbE • FIbre Channel • Rapid I/O • PCI Express® • SATA • InfiniBand™ MATED HEIGHTS SEAF LEAD STYLE SEAM LEAD –06.0 –05.0 –06.5 STYLE –02.0 7 mm 8 mm 8.5 mm –03.0 9 mm 9.5 mm 8 mm –03.5 8.5 mm 9.5 mm 10 mm –06.5 11.5 mm 12.5 mm 13 mm –07.0 12 mm 13 mm 13.5 mm –09.0 14 mm 15 mm 15.5 mm –11.0 16 mm 17 mm 17.5 mm Notes: Patented IPC-A-610F and IPC J-STD-001F Class 3 solder joint. Some sizes, styles and options are non-standard, non-returnable. Mates with: SEAF, SEAFP Standoffs: JSO, JSOM (1.15 mm) .045" NOMINAL WIPE HIGH-SPEED CHANNEL PERFORMANCE SEAM/SEAF @ 10 mm Mated Stack Height Rating based on Samtec reference channel. For full SI performance data visit Samtec.com or contact SIG@samtec.com G b p s34 10 YEAR MFG WITH 30 µ" GOLD EXTENDED LIFE PRODUCT HIGH MATING CYCLES SEAM NO. PINS PER ROW LEAD STYLE PLATING OPTION NO. OF ROWS SOLDER TYPE A K TR Specify LEAD STYLE from chart –10, –15, – 20, – 30, –40, –50 (–10 only available in 04 row) (-15 is only available in 4 Row with -02.0 lead style and 10 row with any lead style) NO. OF ROWS –04 –05, –06 –08 –10 B (7.06) .278 (9.60) .378 (12.14) .478 (14.68) .578 01 08 No. of positions x (1.27) .050 + (4.98) .196 B (1.02) .040 (0.86) .034 DIA (1.27) .050 (1.12) .044 DIA No. of positions x (1.27) .050 + (3.58) .141 – L = 10 µ" (0.25 µm) Gold on contact area, Matte Tin on solder tail – S = 30 µ" (0.76 µm) Gold on contact area, Matte Tin on solder tail (1.27) .050 – 04 =Four Rows (–06.5 not available) – 05 =Five Rows (–06.5 not available) – 06 =Six Rows (–06.5 not available) – 08 =Eight Rows – 10 =Ten Rows (1.02) .040 (1.27) .050 A (0.10) .004 A (5.59) .220 (4.60) .181 LEAD STYLE –02.0 –03.0 –03.5 –06.5 –07.0 (9.60) .378 –09.0 (11.60) .457 –11.0 (13.60) .535 (6.10) .240 (9.14) .360 – 1 = Tin/Lead Alloy Solder Charge –2 = Lead-Free Solder Charge – A = Alignment Pins (Required. Arrays will not self-center on solder pads) – K = Polyimide film Pick & Place Pad – TR =Tape & Reel DIFFERENTIAL (1.27) .050 (1.27) .050 ARRAY PAIR COUNT 50x10 125 50x8 100 40x10 100 ARRAY PAIR COUNT 40x8 40x6 30x10 30x8 30x6 20x10 20x8 20x5 80 60 75 60 45 50 40 25 ALSO AVAILABLE (MOQ Required) • Up to 560 pins Contact Samtec. SEAM–30–02.0–S–08–2–A–K–TRSEAM–30–03.5–S–04–2–A–K–TRSEAM–20–02.0–S–10–2–A–K–TRSolder charges5, 8 and 10 row footprint compatible with SamArray®. Samples recommended.Up to 500 PinsLow insertion/extraction forcesWWW.SAMTEC.COMDue to technical progress, all designs, specifications and components are subject to change without notice.