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BES2300-L_Datasheet_v0.19.pdf

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    BES2300-L Bluetooth Audio Platform with Support for FWS* and Google Bisto Product Specification Rev 0.19 * FWS: Fully Wireless Stereo, BES’s stereo connection between primary and secondary Voice Box. Bestechnic (Shanghai) Co.,Ltd. Room 201, Tower B, ChamtimePlaza, Lane 2889 Jinke Road, Pudong New District, Shanghai 201203, China PHONE: (86)21 6886 7870 FAX: (86)21 6886 7870 - 617 Confidential and Proprietary – Bestechnic (Shanghai) Co, Ltd. DISCLAIMER: No part of this document may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying and recording, for any purpose, without the express written permission of Bestechnic. Bestechnic retains the right to make changes to this document at any time, without notice. Bestechnic makes no warranty of any kind, expressed or implied, with regard to any information contained in this document, including, but not limited to, the implied warranties of merchantability or fitness for any particular purpose. Further, Bestechnic does not warrant the accuracy or completeness of the information, text, graphics, or other items contained within this document. www.wlink-co.com confidential
    BES2300-L Product Specification Datasheet Status Status description. Datasheet Status Product Status Revision Control Description Draft Development Rev 0.01 - 0.49 Datasheets contain pre-tapeout information from the objective design Preliminary Qualification Rev 0.50 - 0.99 Datasheets contain information on post-tapeout and pre-volume specification and is only for internal use. production products, and a revision of this document or supplementary information may be published at a later date. BESTECHNIC may make changes to these specifications at any time without notice. Released Production Rev1.xx Datasheets contain information on volume production products. BESTECHNIC may make changes to these specifications at any time without notice. Revision History Bars appearing in the margin (as shown here) indicate where technical changes have occurred for this revision. The following table lists the technical content changes for all revisions. Revision Date Description 0.10 0.11 0.12 0.13 0.14 0.15 0.16 0.17 0.18 0.19 20/01/2018 29/06/2018 05/07/2018 09/07/2018 11/07/2018 25/08/2018 29/08/2018 14/09/2018 27/09/2018 11/10/2018 Initial definition Update format Update format Update format Modify pin list Update ball map Update pin description Update spec Update Spec. Support FWS and Bisto. Update ball map Rev 0.19 Page2 / 28 Confidential and Proprietary – Bestechnic (Shanghai) Co., Ltd www.wlink-co.com confidential
    BES2300-L Product Specification Table of contents Datasheet Status ................................................................................................................................................................... 2 Revision History .................................................................................................................................................................... 2 List of Tables and figures ...................................................................................................................................................... 5 1 General Description ...................................................................................................................................................... 6 1.1 Applications ............................................................................................................................................................ 6 1.2 Features .................................................................................................................................................................. 7 2 Platform Feature ........................................................................................................................................................... 8 2.1 MCU Subsystem ...................................................................................................................................................... 8 2.2 Memory .................................................................................................................................................................. 8 2.3 System Peripherals.................................................................................................................................................. 9 2.4 Power Management ............................................................................................................................................... 9 2.5 Audio Interface ....................................................................................................................................................... 9 3 Bluetooth Modem Description ................................................................................................................................... 11 3.1 Radio ..................................................................................................................................................................... 11 3.2 Auxiliary feature .................................................................................................................................................... 11 3.3 Bluetooth Stack ..................................................................................................................................................... 11 4 Electrical Characteristics ............................................................................................................................................. 12 4.1 Electrical Characteristics ....................................................................................................................................... 12 4.2 Bluetooth Radio Electrical Characteristics ............................................................................................................ 13 4.3 Audio Codec Electrical Characteristics .................................................................................................................. 15 4.4 BUCK Electrical Characteristics ............................................................................................................................. 17 5 Pin Map & Application Schematic ............................................................................................................................... 18 5.1 Pin Description ...................................................................................................................................................... 18 5.2 Application Schematic........................................................................................................................................... 21 6 Package Dimensions ................................................................................................................................................... 22 6.1 BGA Dimensions .................................................................................................................................................... 22 7 SMT Caution ................................................................................................................................................................ 23 7.1 Land Pad and Stencil Design ................................................................................................................................. 23 7.2 Solder Reflow Profile ............................................................................................................................................ 23 Rev 0.19 Page3 / 28 Confidential and Proprietary – Bestechnic (Shanghai) Co., Ltd www.wlink-co.com confidential
    BES2300-L Product Specification 7.3 RoHS Compliant .................................................................................................................................................... 24 7.4 ESD Sensitivity ....................................................................................................................................................... 24 7.5 Storage Alert ......................................................................................................................................................... 24 8 Ordering Information .................................................................................................................................................. 26 9 Tape and Reel Information ......................................................................................................................................... 27 9.1 Tape Orientation ................................................................................................................................................... 27 9.2 Reel Dimensions .................................................................................................................................................... 27 9.3 Tape Dimensions ................................................................................................................................................... 28 9.4 Moisture Sensitivity Level ..................................................................................................................................... 28 Rev 0.19 Page4 / 28 Confidential and Proprietary – Bestechnic (Shanghai) Co., Ltd www.wlink-co.com confidential
    BES2300-L Product Specification List of Tables and figures Table 4-1 DC Electrical Specification (Recommended Operation Conditions) ............................................................ 12 Table 4-2 DC Electrical Specification (Absolute Maximum Ratings) ........................................................................... 12 Table 4-3 Power Consumption.................................................................................................................................... 12 Table 4-4 Receiver Characteristics - Basic Data Rate .................................................................................................. 13 Table 4-5 Transmitter Characteristics - Basic Data Rate ............................................................................................. 13 Table 4-6 Receiver Characteristics - Enhanced Data Rate .......................................................................................... 14 Table 4-7 Transmitter Characteristics - Enhanced Data Rate ..................................................................................... 15 Table 4-8 Digital to Analogue Converter under 1.95V ................................................................................................ 15 Table 4-9 Codec - Analogue to Digital Converter under 1.95V ................................................................................... 16 Table 4-10 DCDC Characteristics ................................................................................................................................. 17 Table 5-1 BES2300-L Pins Description ......................................................................................................................... 18 Table 7-1 Package peak reflow temperature - Sn/Pb ................................................................................................. 23 Table 7-2 Package peak reflow temperature - Pb-Free .............................................................................................. 23 Table 7-3 Solder Reflow Profile Feature ..................................................................................................................... 24 Figure 1-1 BES2300-L Top View .................................................................................................................................... 6 Figure 2-1 Platform Architecture .................................................................................................................................. 8 Figure 5-1 BES2300-L Pins ........................................................................................................................................... 18 Figure 6-1 BES2300-L Dimension ................................................................................................................................ 22 Figure 7-1 Solder Reflow Profile ................................................................................................................................. 23 Figure 9-1 Tape Orientation ........................................................................................................................................ 27 Figure 9-2 Reel Dimensions ........................................................................................................................................ 27 Figure 9-3 Tape Dimensions........................................................................................................................................ 28 Rev 0.19 Page5 / 28 Confidential and Proprietary – Bestechnic (Shanghai) Co., Ltd www.wlink-co.com confidential
    BES2300-L Product Specification 1 General Description BES2300-L is a highly integrated SoC with Bluetooth 4.2+5.0 dual mode and high performance Cortex-M4F for wireless audio and voice application. It is also optimized for FWS (Fully Wireless Stereo) application, which is BES’s stereo connection technology between primary and secondary Voice Box. BES2300-L minimizes the external components and BOM cost by highly integrating RF transceiver, high performance audio codec and cap-less headphone driver. It also integrates serial Flash and powerful Cortex-M4F MCU to support various software features and product customization. BES2300-L is manufactured with advanced 28nm low power CMOS process and assembled with a 4.5*6.2mm 80-ball BGA package. Figure 1-1 BES2300-L Top View 1.1 Applications  High-end Bluetooth headset  Smart BT/WIFI music box  BT boom box  Other portable audio device  IOT platform Rev 0.19 Page6 / 28 Confidential and Proprietary – Bestechnic (Shanghai) Co., Ltd MCUFLASHROM/RAMConnectivity/StoragePeripheralDC/DCLDOCRYSTALBTMAC/PHY BT_RFCODEC DIGDAC_L ADCDAC_Rwww.wlink-co.com confidential
    BES2300-L Product Specification 1.2 Features  CMOS Single-chip Fully-integrated RF, PMU,  Active Crossover Two-way application: Audio CODEC and Cortex-M4F CPU  Bluetooth 4.2+EDR and BLE5.0 specification  Up to 350MHz ARM Cortex-M4F Processor 1MB Serial Flash On-chip for Custom Program Cortex-M4F with On-chip Boot-ROM and RAM Sports Bluetooth Support Talk through Support Temperature Sensor Support Class H 32-bit Audio Processing          Security Boot to Protect Custom IP  HiFi Stereo Audio DAC: 3.1V-5.5V Input for VBAT Internal LPO for Low Power Mode.  120dB SNR  110dB DNR  DCXO with Internal Oscillator Circuit  Supports Rates From 8 KHz to 384 KHz   Support FWS Support Google Bisto  HiFi Stereo Audio ADC:  100dB SNR  Dual MICs Noise Reduction  Supports Rates From 8 KHz to 384 KHz   Echo Cancellation  Support dual/single Mic noise Support low power voice activity detection suppression and ANC  Multi-band EQ and Bass enhancement  Support ambient awareness  Immersive audio with 3D or virtual surround  3D recording sound  Support Active Crossover  Crossover filter: DSP Adjustable Rev 0.19 Page7 / 28 Confidential and Proprietary – Bestechnic (Shanghai) Co., Ltd www.wlink-co.com confidential
    BES2300-L Product Specification 2 Platform Feature BES2300-L is designed for high-resolution wireless audio MCU system as shown in Figure 2-1. Figure 2-1 Platform Architecture 2.1 MCU Subsystem BES2300-L is embedded with the ARM Cortex-M4F processor, which provides best trade-off between system performance and power consumption. For large amount of data transfer, high performance Direct Memory Access (DMA) is implemented, which greatly enhances the data movement speed while reducing MCU processing load.       Cortex-M4F high performance processor with float and HW DSP instruction Unified cache High performance multi-layer AMBA bus Operating frequency up to 350MHz On-chip BootROM for factory Flash programming Secure boot support  Watchdog Timer for system crash recovery   General Purpose Timers DMA for audio/voice data transfer 2.2 Memory BES2300-L integrates internal memory and serial Flash on-chip with various operating frequencies.  Internal ROM 850KB for critical constants and code Rev 0.19 Page8 / 28 Confidential and Proprietary – Bestechnic (Shanghai) Co., Ltd Cortex-M4FBT 5.0MACPHYAHB2APBAHBAPBDMA1SRAMFLASHBOOT ROMUARTCMUCODECPCMPWMI2CGPIOGPADCTIMERSPI1WDTwww.wlink-co.com confidential
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