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GD32F450XX.pdf
Table of Contents
List of Figures
List of Tables
1 Introduction
2 Device overview
2.1 Device information
2.2 Block diagram
2.3 Pinouts and pin assignment
2.4 Memory map
2.5 Clock tree
2.6 Pin definitions
3 Functional description
3.1 ARM® Cortex®-M4 core
3.2 On-chip memory
3.3 Clock, reset and supply management
3.4 Boot modes
3.5 Power saving modes
3.6 Analog to digital converter (ADC)
3.7 Digital to analog converter (DAC)
3.8 DMA
3.9 General-purpose inputs/outputs (GPIOs)
3.10 Timers and PWM generation
3.11 Real time clock (RTC) and backup registers
3.12 Inter-integrated circuit (I2C)
3.13 Serial peripheral interface (SPI)
3.14 Universal synchronous/asynchronous receiver transmitter (USART/UART)
3.15 Inter-IC sound (I2S)
3.16 Universal serial bus on-the-go full-speed (USB OTG FS)
3.17 Universal serial bus on-the-go high-speed (USB OTG HS)
3.18 Controller area network (CAN)
3.19 Ethernet MAC interface
3.20 External memory controller (EXMC)
3.21 Secure digital input and output card interface (SDIO)
3.22 TFT LCD interface (TLI)
3.23 Image processing accelerator (IPA)
3.24 Digital camera interface (DCI)
3.25 Debug mode
3.26 Package and operation temperature
4 Electrical characteristics
4.1 Absolute maximum ratings
4.2 Recommended DC characteristics
4.3 Power consumption
4.4 EMC characteristics
4.5 Power supply supervisor characteristics
4.6 Electrical sensitivity
4.7 External clock characteristics
4.8 Internal clock characteristics
4.9 PLL characteristics
4.10 Memory characteristics
4.11 GPIO characteristics
4.12 ADC characteristics
4.13 DAC characteristics
4.14 SPI characteristics
4.15 I2C characteristics
4.16 USART characteristics
5 Package information
5.1 LQFP package outline dimensions
5.2 BGA package outline dimensions
6 Ordering information
7 Revision history
GD32F450xx
GigaDevice Semiconductor Inc.
GD32F450xx
ARM® Cortex®-M4 32-bit MCU
Datasheet
0 / 66
GD32F450xx
Table of Contents
2.1
2.2
2.3
2.4
2.5
2.6
List of Figures ............................................................................................................................. 3
List of Tables ............................................................................................................................... 4
Introduction ...................................................................................................................... 6
1
Device overview ............................................................................................................... 7
2
Device information .............................................................................................................................. 7
Block diagram ...................................................................................................................................... 8
Pinouts and pin assignment .............................................................................................................. 9
Memory map ...................................................................................................................................... 12
Clock tree ........................................................................................................................................... 15
Pin definitions .................................................................................................................................... 16
Functional description .................................................................................................. 36
ARM® Cortex®-M4 core .................................................................................................................... 36
On-chip memory ................................................................................................................................ 36
Clock, reset and supply management ........................................................................................... 37
Boot modes ........................................................................................................................................ 38
Power saving modes ........................................................................................................................ 38
Analog to digital converter (ADC) ................................................................................................... 39
Digital to analog converter (DAC) ................................................................................................... 39
DMA .................................................................................................................................................... 40
General-purpose inputs/outputs (GPIOs) ...................................................................................... 40
Timers and PWM generation ........................................................................................................... 41
Real time clock (RTC) and backup registers ................................................................................ 42
Inter-integrated circuit (I2C) ............................................................................................................. 42
Serial peripheral interface (SPI) ...................................................................................................... 43
Universal synchronous/asynchronous receiver transmitter (USART/UART) ........................... 43
Inter-IC sound (I2S) .......................................................................................................................... 43
Universal serial bus on-the-go full-speed (USB OTG FS) .......................................................... 44
Universal serial bus on-the-go high-speed (USB OTG HS) ....................................................... 44
Controller area network (CAN) ........................................................................................................ 44
Ethernet MAC interface .................................................................................................................... 45
External memory controller (EXMC) .............................................................................................. 45
Secure digital input and output card interface (SDIO) ................................................................. 45
TFT LCD interface (TLI) ................................................................................................................... 46
Image processing accelerator (IPA) ............................................................................................... 46
Digital camera interface (DCI) ......................................................................................................... 46
Debug mode ...................................................................................................................................... 47
Package and operation temperature .............................................................................................. 47
Electrical characteristics .............................................................................................. 48
1 / 66
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
3.10
3.11
3.12
3.13
3.14
3.15
3.16
3.17
3.18
3.19
3.20
3.21
3.22
3.23
3.24
3.25
3.26
3
4
4.1
4.2
4.3
4.4
4.5
4.6
4.7
4.8
4.9
4.10
4.11
4.12
4.13
4.14
4.15
4.16
GD32F450xx
Absolute maximum ratings .............................................................................................................. 48
Recommended DC characteristics ................................................................................................. 48
Power consumption .......................................................................................................................... 49
EMC characteristics .......................................................................................................................... 50
Power supply supervisor characteristics ....................................................................................... 51
Electrical sensitivity........................................................................................................................... 51
External clock characteristics .......................................................................................................... 52
Internal clock characteristics ........................................................................................................... 53
PLL characteristics ........................................................................................................................... 54
Memory characteristics .................................................................................................................... 55
GPIO characteristics ......................................................................................................................... 56
ADC characteristics .......................................................................................................................... 57
DAC characteristics .......................................................................................................................... 59
SPI characteristics ............................................................................................................................ 60
I2C characteristics ............................................................................................................................ 60
USART characteristics ..................................................................................................................... 60
Package information ..................................................................................................... 61
LQFP package outline dimensions ................................................................................................ 61
BGA package outline dimensions .................................................................................................. 63
Ordering information ..................................................................................................... 64
Revision history ............................................................................................................. 65
5.1
5.2
5
6
7
2 / 66
GD32F450xx
List of Figures
Figure 1. GD32F450xx block diagram ...................................................................................................................... 8
Figure 2. GD32F450Ix BGA176 pinouts .................................................................................................................. 9
Figure 3. GD32F450Zx LQFP144 pinouts ............................................................................................................. 10
Figure 4. GD32F450Vx LQFP100 pinouts ............................................................................................................. 11
Figure 5. GD32F450xx memory map ..................................................................................................................... 12
Figure 6. GD32F450xx clock tree ............................................................................................................................ 15
Figure 7. LQFP package outline .............................................................................................................................. 61
Figure 8. BGA package outline ................................................................................................................................ 63
3 / 66
List of Tables
GD32F450xx
Table 1. GD32F450xx devices features and peripheral list................................................................................... 7
Table 2. GD32F450xx pin definitions ...................................................................................................................... 16
Table 3. Port A alternate functions summary ......................................................................................................... 27
Table 4. Port B alternate functions summary ......................................................................................................... 28
Table 5. Port C alternate functions summary ......................................................................................................... 29
Table 6. Port D alternate functions summary ......................................................................................................... 30
Table 7. Port E alternate functions summary ......................................................................................................... 31
Table 8. Port F alternate functions summary ......................................................................................................... 32
Table 9. Port G alternate functions summary ........................................................................................................ 33
Table 10. Port H alternate functions summary ...................................................................................................... 34
Table 11. Port I alternate functions summary ........................................................................................................ 35
Table 12. Absolute maximum ratings ...................................................................................................................... 48
Table 13. DC operating conditions .......................................................................................................................... 48
Table 14. Power consumption characteristics ....................................................................................................... 49
Table 15. EMS characteristics ................................................................................................................................. 50
Table 16. EMI characteristics ................................................................................................................................... 50
Table 17. Power supply supervisor characteristics .............................................................................................. 51
Table 18. ESD characteristics.................................................................................................................................. 51
Table 19. Static latch-up characteristics ................................................................................................................ 51
Table 20. High speed external clock (HXTAL) generated from a crystal/ceramic characteristics ................. 52
Table 21. Low speed external clock (LXTAL) generated from a crystal/ceramic characteristics ................... 52
Table 22. High speed internal clock (IRC16M) characteristics ........................................................................... 53
Table 23. High speed internal clock (IRC48M) characteristics ........................................................................... 53
Table 24. Low speed internal clock (IRC32K) characteristics ............................................................................. 54
Table 25. PLL characteristics ................................................................................................................................... 54
Table 26. PLL spread spectrum clock generation (SSCG) characteristics ....................................................... 54
Table 27. Flash memory characteristics ................................................................................................................. 55
Table 28. I/O port characteristics ............................................................................................................................. 56
Table 29. ADC characteristics .................................................................................................................................. 57
Table 30. ADC RAIN max for fADC=40MHz ................................................................................................................. 57
Table 31. ADC dynamic accuracy at fADC = 30 MHz ............................................................................................. 58
Table 32. ADC dynamic accuracy at fADC = 30 MHz ............................................................................................. 58
Table 33. ADC dynamic accuracy at fADC = 36 MHz ............................................................................................. 58
Table 34. ADC dynamic accuracy at fADC = 40 MHz ............................................................................................. 58
Table 35. ADC static accuracy at fADC = 15 MHz .................................................................................................. 58
Table 36. DAC characteristics ................................................................................................................................. 59
Table 37. SPI characteristics .................................................................................................................................... 60
Table 38. I2C characteristics .................................................................................................................................... 60
Table 39. USART characteristics ............................................................................................................................ 60
Table 40. LQFP package dimensions ..................................................................................................................... 62
Table 41. BGA package dimensions ....................................................................................................................... 63
4 / 66
GD32F450xx
Table 42. Part ordering code for GD32F407xx devices ....................................................................................... 64
Table 43. Revision history......................................................................................................................................... 65
5 / 66
1
Introduction
GD32F450xx
The GD32F450xx device belongs to the stretch performance line of GD32 MCU Family. It is
a new 32-bit general-purpose microcontroller based on the ARM® Cortex®-M4 RISC core with
best cost-performance ratio in terms of enhanced processing capacity, reduced power
consumption and peripheral set. The Cortex®-M4 core features a Floating Point Unit (FPU)
that accelerates single precision floating point math operations and supports all ARM® single
precision instructions and data types. It implements a full set of DSP instructions to address
digital signal control markets that demand an efficient, easy-to-use blend of control and signal
processing capabilities. It also provides a Memory Protection Unit (MPU) and powerful trace
technology for enhanced application security and advanced debug support.
The GD32F450xx device incorporates the ARM® Cortex®-M4 32-bit processor core operating
at 200 MHz frequency with Flash accesses zero wait states to obtain maximum efficiency. It
provides up to 3072 KB on-chip Flash memory and 512 KB SRAM memory. An extensive
range of enhanced I/Os and peripherals connected to two APB buses. The devices offer up
to three 12-bit 2.6M SPS ADCs, two 12-bit DACs, up to eight general-purpose 16-bit timers,
two 16-bit PWM advanced-control timers , two 32-bit general-purpose timers, and two 16-bit
basic timers, as well as standard and advanced communication interfaces: up to six SPIs,
three I2Cs, four USARTs and four UARTs, two I2Ss, two CANs, a SDIO, USB
device/host/OTG FS and HS, and an Ethernet MAC. Additional peripherals as Digital camera
interface (DCI), EXMC interface with SDRAM extension support, TFT-LCD Interface (TLI) and
Image Processing Accelerator (IPA) are included.
The device operates from a 2.6 to 3.6V power supply and available in –40 to +85 °C
temperature range. Three power saving modes provide the flexibility for maximum
optimization of power consumption, an especially important consideration in low power
applications.
The above features make GD32F450xx devices suitable for a wide range of interconnection
and advanced applications, especially in areas such as industrial control, consumer and
handheld equipment, embedded modules, human machine interface, security and alarm
systems, graphic display, automotive navigation, drone, IoT and so on.
6 / 66
2
Device overview
GD32F450xx
2.1
Device information
Table 1. GD32F450xx devices features and peripheral list
GD32F450xx
Part Number
Code Area (KB) 512
VE
VG
512
VI
256
VK
512
ZE
512
ZG
512
ZI
256
ZK
512
IG
II
IK
512
256
512
h
s
a
F
l
Data Area (KB)
0
512
1792 2560
0
512
1792 2560
512
1792 2560
Total (KB)
SRAM (KB)
512
256
1024 2048 3072
256
512
256
512
256
1024 2048 3072 1024 2048 3072
256
512
256
256
512
256
s
r
e
m
T
i
16-bit GPTM
32-bit GPTM
Adv. 16-bit TM
Basic TM
SysTick
Watchdog
RTC
8
2
2
2
1
2
1
8
2
2
2
1
2
1
8
2
2
2
1
2
1
8
2
2
2
1
2
1
8
2
2
2
1
2
1
8
2
2
2
1
2
1
8
2
2
2
1
2
1
8
2
2
2
1
2
1
8
2
2
2
1
2
1
8
2
2
2
1
2
1
8
2
2
2
1
2
1
USART+UART 4+4
4+4
4+4
4+4
4+4
4+4
4+4
4+4
4+4
4+4
4+4
I2C
SPI/I2S
SDIO
CAN 2.0B
USB OTG
y
t
i
v
i
t
c
e
n
n
o
C
3
5/2
1
2
3
5/2
1
2
3
5/2
1
2
3
5/2
1
2
3
6/2
1
2
3
6/2
1
2
3
6/2
1
2
3
6/2
1
2
3
6/2
1
2
3
6/2
1
2
3
6/2
1
2
FS+HS FS+HS FS+HS FS+HS FS+HS FS+HS FS+HS FS+HS FS+HS FS+HS FS+HS
Ethernet MAC
TFT-LCD
Digital Camera
GPIO
EXMC/SDRAM
1
1
1
82
1/0
1
1
1
82
1/0
1
1
1
82
1/0
1
1
1
82
1/0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
114
114
114
114
140
140
140
1/1
1/1
1/1
1/1
1/1
1/1
1/1
ADC Unit (CHs) 3(16) 3(16) 3(16) 3(16) 3(24) 3(24) 3(24) 3(24) 3(24) 3(24) 3(24)
DAC
Package
2
2
2
2
2
2
2
2
2
2
2
LQFP100
LQFP144
BGA176
7 / 66
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