第1页 / 共87页
第2页 / 共87页
第3页 / 共87页
第4页 / 共87页
第5页 / 共87页
第6页 / 共87页
第7页 / 共87页
第8页 / 共87页
Qualcomm 845datasheet.pdf
1 Introduction
1.1 Functional block diagram
1.2 SDM845 features
1.2.1 Air interface features
2 Pin definitions
2.1 I/O parameter definitions
2.2 Pin assignments – bottom
2.2.1 Pin map – bottom
2.2.2 Pin descriptions – bottom
2.3 Pin assignments – top
2.3.1 Pin map – top
2.3.2 Pin descriptions – top
3 Electrical specifications
3.1 Absolute maximum ratings
3.2 Operating conditions
3.3 Power distribution network
3.4 Average operating current
3.5 Dhrystone and rock bottom maximum power
3.6 Digital logic characteristics
3.7 Timing characteristics
3.7.1 Timing diagram conventions
3.7.2 Rise and fall time specifications
3.7.3 Pad design methodology
3.8 Memory support
3.8.1 EBI0 and EBI1 memory support
3.9 Multimedia
3.9.1 Camera interfaces
3.9.2 Audio support
3.9.3 Display support
3.9.4 DMB support
3.10 Connectivity
3.10.1 SD interfaces
3.10.2 USB interfaces
3.10.3 DisplayPort
3.10.4 PCIe interface
3.10.5 UFS interface
3.10.6 UICC interface
3.10.7 SLIMbus interface
3.10.8 I2S interfaces
3.10.9 PCM/TDM interfaces
3.10.10 TSIF
3.10.11 Touchscreen connections
3.10.12 I2C interface
3.10.13 Serial peripheral interface
3.11 Internal functions
3.11.1 Clocks
3.11.2 Modes and resets
3.11.3 JTAG
3.11.4 SWD
3.12 RF and power management interfaces
3.12.1 RF front end (RFFE)
3.12.2 System power management interface (SPMI)
4 Mechanical information
4.1 Device physical dimensions
4.2 Part marking
4.3 Device ordering information
4.3.1 Specification-compliant devices
4.3.2 Daisy-chain devices
4.4 Device moisture sensitivity level
4.5 Thermal characteristics
5 Carrier, handling, and storage information
5.1 Carrier
5.1.1 Tape and reel information
5.2 Storage
5.2.1 Bagged storage conditions
5.2.2 Out-of-bag duration
5.3 Handling
5.3.1 Baking
5.3.2 Electrostatic discharge
5.4 Bar code label and packing for shipment
6 PCB mounting guidelines
6.1 RoHS compliance
6.2 SMT assembly guidelines
6.3 Daisy-chain components
7 Part reliability
7.1 Reliability qualifications summary
7.2 Qualification sample description
8 Revision history
Qualcomm Technologies, Inc.
SDM845
Device Specification
80-P6348-1 Rev. K
Device description
The SDM845 includes the next generation of the Qualcomm®
Snapdragon™ 800 series processor and LTE modem.
Key processor and memory characteristics include:
12.4 × 12.4 mm MEP
A customized 64-bit ARM v8-compliant octacore Qualcomm®
Kryo™ 385 applications processor
Qualcomm® Adreno™ 630 graphics processing unit (GPU)
4K 60 fps or 2 × 2K 90 fps
Audio DSP for low-power audio subsystem (LPASS)
Compute DSP with Qualcomm® Hexagon™ Vector
eXtensions (HVX)
Dedicated low-power Snapdragon sensor core with DSP to
support always-on use cases
Secure processor
Four-channel package-on-package (PoP) high-speed
memory, LPDDR4X SDRAM
3 MB system cache
Key features (see Section 1.2 for details)
Always-on subsystem with RPMh for hardware-based
Qualcomm® Universal Bandwidth Compression (UBWC) 2.0,
resource and power management
2x compression with camera, display, and DSP
Integrated X20 LTE modem to support latest air interfaces
including 5 X CA up to 1.2 Gbps
Two 4-lane DSI D-PHY 1.2 at 2.5 Gbps per lane
3840 × 2400 display at 60 fps, 2560 buffer width (10 layers
blending), and VESA DSC 1.1
A complete 4K60 entertainment system 4K60 10b encode +
4k60 10b decode
Qualcomm Spectra™ 280 camera: dual 14-bit image signal
processing (ISP) + Lite ISP: 16 + 16 + 2 megapixels (MP) to
support 32 MP/30 fps
Three 4-lane CSI with C-PHY/D-PHY and one 2-lane CSI
with D-PHY to support 4 + 4 + 4 + 2
1 x UFS 2.1, 2 x USB 3.1, DisplayPort
One 1-lane PCIe Gen 2 and one 1-lane PCIe Gen 3
WLAN 802.11ac and Bluetooth 5.0 with the WCN3990
device; WiGig (802.11ad/60 GHz) with the QCA6335 +
QCA6310 device
SDM845 high-level block diagram and 914B MPSP drawing
SDM845
Memory
support
EBI0
EBI1
EBI2
EBI3
UFS 2-lane
PoP memory
LPDDR4x
SDRAM
4 x 16-bit
eUFS
n
o
i
t
a
c
i
l
p
p
A
E
F
F
R
c
i
f
i
c
e
p
s
dsc
)
s
(
C
F
R
I
Qualcomm®
Wi-Fi
UART
SPI
I2C
WiGig
Audio
DMB
SD/MMC
RF interfaces
GRFC/RFFE
Discrete status
and control
QLink digital
interface
WLAN IQ
interface
Connectivity
GPIO (150)
Sensor core IO (18)
PCIe (× 2)
SLIMbus
MI2S (× 4)
PCM (× 4)
TSIF
SDC4
SDC2
USB 3.1 Gen 1
USB 3.1 Gen 1
with Type-C
SPI
4-lane DSI
(x2)
Touch
Pri display
Multimedia
4-lane CSI
4-lane CSI
4-lane CSI
2-lane CSI
Processors
X20 modem
Dual-V UIM (× 2)
Internal
functions
UIM
UIM
SPMI
Power
management
Confidential and Proprietary – Qualcomm Technologies, Inc.
NO PUBLIC DISCLOSURE PERMITTED: Please report postings of this document on public servers or websites to: DocCtrlAgent@qualcomm.com.
Restricted Distribution: Not to be distributed to anyone who is not an employee of either Qualcomm Technologies, Inc. or its affiliated companies
without the express approval of Qualcomm Configuration Management.
Not to be used, copied, reproduced, or modified in whole or in part, nor its contents revealed in any manner to others without the express written
permission of Qualcomm Technologies, Inc.
All Qualcomm products mentioned herein are products of Qualcomm Technologies, Inc. and/or its subsidiaries.
© 2016-2018 Qualcomm Technologies, Inc. and/or its subsidiaries. All rights reserved.
Contents
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1
2 Pin definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
4 Mechanical information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
5 Carrier, handling, and storage information . . . . . . . . . . . . . . . . . . . . . . . . . 75
6 PCB mounting guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
7 Part reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
80-P6348-1 Rev. K
Confidential and Proprietary – Qualcomm Technologies, Inc.
MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION
2
1 Introduction
Document updates
See the Revision history for details on the changes included in this revision.
80-P6348-1 Rev. K
Confidential and Proprietary – Qualcomm Technologies, Inc.
MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION
3
SDM845 Device Specification
1.1 Functional block diagram
Introduction
HB
ANT_0
HB
ANT_1
L/M/HB
ANT_0
L/M/HB
ANT_1
GNSS
Qualcomm front-end
components
QLN1020 LB LNA
QLN1030 MB/HB/UHB/LTE-U LNA
QLN1035 MB/HB/UHB 4 × 4 MIMO LNA
QLN2050/QLN2042 LNA
QPA5461 Power Amplifier
QPA8801/QPA8802/QPA8803/QPA8821
Power Amplifier
QPM2622 PAMiD Low Band
QPA2625 GSM PA
QPM2632 PAMiD Mid Band
QPM2642 PAMiD High Band
D53xx 1st Gen DRx Module
M592/M593/M595 2nd Gen DRx Module
QET4100 Envelope Tracker
QAT5514 Aperture Tuner
QAT5550 Antenna Tuner
QAT5522 Antenna Switch Diversity
and other components as needed
E
F
F
R
c
i
f
i
c
e
p
s
-
n
o
i
t
a
c
i
l
p
p
A
I
s
I
P
M
E
F
F
R
c
s
d
s
C
F
R
G
A
N
L
S
S
N
G
1×1 or
2×2 WLAN
2.4 & 5 GHz
Dedicated BT
(optional)
SDR modem
subsystem
(SDR 12-layer
MSS)
RF transmitters
for dual UL
(TX0/TX1)
RF
receivers with
carrier aggregation
support
ET
Tx
Rx TxFB
MB PRx
HB PRx
UHB PRx
LTE-U PRx
LB PRx
MB DRx
HB DRx
UHB DRx
LTE-U DRx
LB DRx
SI = serial interfaces = MIPI_RFFE (6)
dsc
SI
Discrete status/control
Serial interfaces
QLink digital
interface
UL0
DL0
DL1
DL2
CLK
EN
REQ
WCI2 (LTE coex)
WSI 1.0 (WLAN/
BT coex)
Sensor core
UART
UART (4-wire)
SLIMbus
GNSS
SDR845
WLAN RFA channel 1
WLAN RFA channel 2
CPU
Coex engine
BT RF & BB
FM RF & BB
WCN3990
s
O
/
I
&
t
r
o
p
p
u
S
N
A
L
W
x
e
o
C
T
B
M
F
WiGig
PCIe
d
n
e
-
t
n
o
r
f
/
T
B
N
A
L
W
E
F
F
R
PM & support
coexist
stat & ctl
dsc
QCA6335 + QCA6310
WCD934x
dsc
Audio
devices
5 DACs/5 out
5 in/4 ADCs
6 DMICs
MBHC
MIC bias/det
Qualcomm®
Snapdragon™ Voice
Activation, ANC,
native DSD
c
e
d
o
c
i
o
d
u
A
SLIM
bus
I2C
SPI
I2S 0/1
Sound-
Wire
WSA
881x
WSA
881x
DMB
(option)
SD/MMC
UFS
UIM
UIM
WSI 2.0
WLAN DACs
WLAN ADCs
WSI 2.0
WLAN DACs
WLAN ADCs
r
/
t
B
B
h
c
t
i
w
s
r
/
t
B
B
h
c
t
i
w
s
Chipset & RFFE I/Fs
SDM845
Connectivity
GPIOs (150)
P
U
Q
)
6
1
x
(
UART
SPI
I2C
PCIe Gen 2 1-lane
PCIe Gen 3 1-lane
LPASS SLIMbus
Sensor core I/O (x18)
TSIF (x2)
SDCs (x2)
UFS 2.1 gear 3 1-lane
MI2S/PCM/TDM (x4)
USB 3.1
USB 3.1 Type-C w/DP
Dual-V UIM (x2)
Processors
Memory support
Package-on-package
Qualcomm
Kryo Gold
Qualcomm
Kryo Silver
256 kB
L2 per
core
128 kB
L2 per
core
2 MB
L3
Modem DSP
Compute DSP + HVX
Audio DSP
RPMh, ARM Cortex-M3
Low-pwr DSP (sensors)
Secure processing unit
X20 modem
GSM processing
GSM/GPRS/EDGE
CDMA processing
to 1xEV-DOrC
WCDMA processing
to Rel 12 HSPA+
LTE processing
Cat 16 with UL/DL CA
TD-SCDMA processing
to TD-HSPA+256-QAM
GNSS Gen 9
GPS, GLONASS,
BeiDou, Compass
EBI0/EBI1
EBI2/EBI3
System cache 3 MB
Internal memory
UFS 2.1 gear 3
2-lane
4-lane
DSI
4-lane
DSI
A
S
E
V
C
S
D
5
9
7
U
P
D
Multimedia
CAMIF timing & I2C
2
.
1
Y
H
P
D
-
0
.
1
Y
H
P
C
-
2-lane CSI
4-lane CSI
4-lane CSI
4-lane CSI
Qualcomm Spectra
camera ISP
VPU444
Adreno 630
graphics accelerator
Audio: Qualcomm®
Fluence™ Pro,
Qualcomm® Snapdragon™
Voice Activation, HD audio
Internal functions
Thermal sensors
Security & QFPROM
Resource & pwr mgt
Clock generation
GP clock & PDM outs
JTAG QDSS
Mode/config/resets
LPDDR4x SDRAM
LPDDR4x SDRAM
eUFS
I2C/SPI
I2C
Pri display
Peripherals/
sensors
QTC800
Accelerometer
Geomagnetic
Gyros
Pressure
Proximity
Humidity
Temperature
Ambient light
Infrared
Chemical
external
source
Input
pwr mgt
Output
pwr mgt
User
I/Fs
IC-level
I/Fs
Gen’l
Hskeep’g
SSC
I2C
SPI
I2C
SMB1355
battery
charger
(optional)
system
power
supply
voltages
indicators
& lighting
Pon
others
SPMI
XOs & clks
from sensors
boot config
clocks
debug
modes
PM845, PM8005, and
PMI8998
Figure 1-1 SDM845 functional block diagram and example application
80-P6348-1 Rev. K
Confidential and Proprietary – Qualcomm Technologies, Inc.
MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION
4
SDM845 Device Specification
Introduction
1.2 SDM845 features
NOTE:
Some of the hardware features integrated within the SDM845 must be enabled by
software. See the latest revision of the applicable software release notes to identify the
enabled SDM845 features.
Table 1-1 SDM845 features
Feature
Processors
Applications
Digital signal processing
Always-on system
Sensor core
Security
Memory support
System memory via PoP and EBI
Other internal memory
External memory
Via UFS
Via SDC
SDM845 capability
64-bit applications processor (Kryo 385) with 2 MB L3 cache
Quad high-performance Kryo cores at 2.649 GHz – Kryo Gold cluster with
256 kB L2 cache per core
Kryo Gold single-core boost at 2.803 GHz
Quad low-power Kryo cores at 1.766 GHz – Kryo Silver cluster with
128 kB L2 cache per core
Compute DSP with Hexagon Vector eXtensions (dual-HVX512) and Hexagon
coprocessor
Audio DSP dedicated to audio subsystem
Modem DSP to support 5x DL CA, UL MIMO
Always-on subsystem with always-on processor
Hardware-based resource and power management (RPMh) with hardware
accelerators for voltage control and regulation, clock management, and
resource communication
Snapdragon sensor core with dedicated sensor DSP and 1.0 MB memory
(512 kB TCM + 512 kB L2) to support always-on low-power use cases
Dedicated secure processing unit
Four-channel PoP high-speed memory – LPDDR4x SDRAM (4x 16-bit)
designed for a 1866 MHz clock
3 MB system cache
256 KB IMEM
1 MB GMEM for graphics
UFS 2.1 gear 3 – 2 lanes for on-board memory
SD v3.0 4-bit for SD card
80-P6348-1 Rev. K
Confidential and Proprietary – Qualcomm Technologies, Inc.
MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION
5
SDM845 Device Specification
Introduction
Table 1-1 SDM845 features (cont.)
Feature
RF support
RF operating bands
Air interfaces
GSM
CDMA
WCDMA
TD-SCDMA
LTE
WLAN/Bluetooth
Advanced techniques
SDM845 capability
Defined by the wafer-level RF transceiver device SDR845
See Table 1-2.
Yes
Yes
Yes
Yes
Yes (Cat 16+ with 1.2 Gbps capability)
Yes (with WCN3990)
Up to 5 DL CA, up to 2 UL CA, 4 × 4 MIMO using single TRx
GNSS – Qualcomm® Location Suite engine Gen 9; GPS, GLONASS, BeiDou
Multimedia
Display support
MIPI_DSI
DisplayPort
Miracast
Example combinations
General display features
Mobile display processor
Camera interfaces
MIPI_CSI
Performance
Video applications performance
Graphics
Multistream supported
Two 4-lane; DSI D-PHY 1.2 or C-PHY 1.0; VESA DSC 1.1
DisplayPort 1.4+ data concurrency over USB
Yes; v2.0 (4 k at 30 fps)
3840 × 2400 10-bit 60 fps + 4K60 DisplayPort 10-bit or 4K30 Miracast
2 x 2400 × 2400 120 fps (VR), LTM, 16-layer
Color depth – 24-bit per pixel; TFT, LTPS, CSTN, and OLED panels
DPU 795
MIPI CSI configurable in 4 + 4 + 4 + 2 configuration
D-PHY: 2.5 Gbps/lane on 4-lane CSI and 2-lane CSI
C-PHY: ~17 Gbps (2.5 G symbols per trio per second) on 4-lane CSI
Qualcomm Spectra 280 ISP to support up to seven cameras (three
concurrent)
Real-time sensor input resolution: 16 +16 + 2 MP
32 MP 30 fps ZSL with a dual ISP
16 MP 30 ZSL with a single ISP
VPU444
4K60 decode for H.264 High Profile, H.265 Main 10 Profile and VP9 Profile 2
4K60 encode for H.264 High Profile, H.265 Main 10 Profile
4K30 encode for VP8
Support for HDR 10-bit video playback (HLG, HDR10)
Support for HDR 10-bit capture (HLG)
Adreno 630 – 4K 60 fps UI or 2x 2k × 2k 90 fps UI
OpenGL ES 3.2 + AEP, DX next, Vulkan 2
OpenCL 2.0 full profile, RenderScript
80-P6348-1 Rev. K
Confidential and Proprietary – Qualcomm Technologies, Inc.
MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION
6
SDM845 Device Specification
Introduction
Table 1-1 SDM845 features (cont.)
Feature
Audio
Codec
Speaker amplifier
Low-power audio
Voice codec support
Audio codec support
Enhanced audio
Digital mobile broadcast (DMB)
Connectivity
Qualcomm universal peripheral (QUP) ports
UART
I2C
SPI
CCI I2C
UIM
USB
PCIe
Secure digital interfaces
SDM845 capability
Dedicated LPASS audio DSP with 1 MB L2 cache
Integrated within the WCD9340/WCD9341 high-fidelity audio codec:
Five DACs; five outputs
Five differential analog inputs; four ADCs
Six digital microphones
Open DSP CPE voice activation subsystem for ultra low-power voice
wake-up
Native DSD (WCD9341 only), MBHC, and ANC
130 dB dynamic range
32-bit DAC
44.1 kHz family native playback
5 GPIOs
Integrated within the WSA8810/WSA8815 class D/G, low noise smart amplifier:
2 W/4 W output power into 8 Ω load
Integrated SmartBoost
Integrated feedback speaker protection for excursion and temperature
control
of the transducers
Supports receiver assist speaker (RAS) or speaker as receiver (SAR) with
handset ANC
Low-power, low-complexity; 7.1 surround sound
QCELP, EVS, EVRC, EVRC-B, EVRC-WB; G.7Gen, G.729A/AB;
GSM-FR, GSM-EFR, and GSM-HR; AMR-NB and AMR-WB
MP3; aacPlus, eAAC; WMA 9/Pro
Surround sound: advanced multichannel
Qualcomm® Noise and Echo Cancellation; enhanced speaker protection
Qualcomm enhanced 3D audio solution, Qualcomm stereo audio
expansion feature, and Qualcomm intelligent mixing algorithm
External IC required with TSIF or SDIO interface
16, 4 bits each; multiplexed serial interface functions
UART interface available on all QUPs. HS-UART available on GPIO
QUP6/QUP7 and Snapdragon sensor core QUP3/QUP4/QUP5
I2C interface available on all QUPs up to 1 Mbps for touch, sensors, near field
communicator (NFC), and so on; dedicated controller for each port
SPI interfaces available on all QUPs for cameras, sensors, and so on;
dedicated controller for each port
Two dedicated I2C interfaces for camera
Two – dual voltage (1.8 V/2.95 V)
2x USB 3.1, one can support Type-C with DisplayPort
Two – One Gen 2 1-lane with PHY 2.1 and one Gen 3 1-lane with PHY 3.0
Two 4-bit ports (SDC2 and SDC4); SD 3.0
SDC2 is dual-voltage
SD/MMC card; DMB; eSD boot
80-P6348-1 Rev. K
Confidential and Proprietary – Qualcomm Technologies, Inc.
MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION
7
SDM845 Device Specification
Introduction
Table 1-1 SDM845 features (cont.)
Feature
SDM845 capability
DMB support
Two; highly multiplexed, high-speed; baseline WCD9340/WCD9341
Full duplex stereo or up to quad channel Tx/Rx MI2S (x3)
Up to eight channels for multichannel Tx/Rx audio applications (x1)
Half duplex stereo Rx MI2S (x1)
Up to four interfaces: 16 active Tx and Rx slots per individual interface
Up to 512 bits/frame and 32 bits/slot
Short, long, and one-slot sync mode
Maximum clock frequency of 24.576 MHz
WCN3990 2 × 2 802.11ac RF
QCA6335 and QCA6310 (802.11ad/60 GHz)
Capacitive panels via ext IC (I2C, SPI, and interrupts)
QTC800 Qualcomm® improveTouch™ controller
Via external DMB device (SDC or TSIF)
150 – GPIO_0 to GPIO_149
18 – SSC_0 to SSC_17
Pull-up, pull-down, keeper, or no pull
Programmable drive current
Provides a convenient way to program groups of GPIOs
Secure boot, secure debug, secure key provisioning, TrustZone, Qualcomm®
Trusted Execution Environment, hardware supported KeyStore
Crypto engine v5 (CE5), DRBG/PRNG (FIPS-compliant), inline crypto engine
(FIPS-compliant)
Secure file system, fast trusted storage
PlayReady SL2000/SL3000, Widevine level 1, ISDB-T
640 bits available for OEM use
Programmable security domain protection and sand-boxing
FlexSKU over-the-air feature
1) Applications PBL; 2) XBL; 3) SHRM; 4) AOP 5) HLOS; 6) modem PBL;
7) SP PBL; 8) VPU444, audio, Snapdragon sensor core, compute
Emergency boot over USB 3.1
Multiple clock regimes; watchdog and sleep timers
Input: 19.2 MHz CXO
General-purpose outputs: M/N counter and PDM
JTAG, design for software debug (DFSD), and ETM
Thermal sensors; modes and resets; peripheral subsystem
TSIF
Audio interfaces
SLIMbus
MI2S
PCM/TDM
Wireless connectivity
Touchscreen support
DMB support
Configurable GPIOs
Number of GPIO ports
Number of sensor I/Os
Input configurations
Output configurations
Top-level mode multiplexer
Internal functions
Security
General hardware security features
Crypto engines
TrustZone services
DRM support in hardware
QFPROM
Access control
Boot sequence
PLLs and clocks
Debug
Others
80-P6348-1 Rev. K
Confidential and Proprietary – Qualcomm Technologies, Inc.
MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION
8
相关推荐
2023年江西萍乡中考道德与法治真题及答案.doc
2012年重庆南川中考生物真题及答案.doc
2013年江西师范大学地理学综合及文艺理论基础考研真题.doc
2020年四川甘孜小升初语文真题及答案I卷.doc
2020年注册岩土工程师专业基础考试真题及答案.doc
2023-2024学年福建省厦门市九年级上学期数学月考试题及答案.doc
2021-2022学年辽宁省沈阳市大东区九年级上学期语文期末试题及答案.doc
2022-2023学年北京东城区初三第一学期物理期末试卷及答案.doc
2018上半年江西教师资格初中地理学科知识与教学能力真题及答案.doc
2012年河北国家公务员申论考试真题及答案-省级.doc
2020-2021学年江苏省扬州市江都区邵樊片九年级上学期数学第一次质量检测试题及答案.doc
2022下半年黑龙江教师资格证中学综合素质真题及答案.doc
