AP6234 datasheet_V1.3_04262013.pdf-资料库

正基科技股份有限公司 SPECIFICATION SPEC. NO.： REV： 1.3 DATE： 04.26. 2013 PRODUCT NAME： AP6234 APPROVED CHECKED PREPARED DCC ISSUE NAME AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO:

AMPAK AP6234 WiFi 11a/b/g/n +Bluetooth 4.0 SIP Module Spec Sheet AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO:

Revision History Date 2012/10/18 2012/12/18 2013/01/23 2013/04/26 Revision Content Revised By Version - Initial released - Pin definition modify - Pin definition modify - Specification modify Brian Joe Joe Joe 1.0 1.1 1.2 1.3 AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO: 1

AP6234 Datasheet Contents Contents ................................................................................................................... 2 1. Introduction ......................................................................................................... 3 2. Features ............................................................................................................... 4 3. Deliverables ........................................................................................................ 5 3.1 Deliverables .................................................................................................... 5 3.2 Regulatory certifications ................................................................................. 5 4. General Specification ......................................................................................... 6 4.1 General Specification ...................................................................................... 6 4.2 Voltages .......................................................................................................... 6 4.2.1 Absolute Maximum Ratings .................................................................... 6 4.2.2 Recommended Operating Rating ........................................................... 6 The module requires two power supplies: VBAT and VDDIO. ......................... 6 5. WiFi RF Specification ......................................................................................... 7 5.1 2.4GHz & 5GHz RF Specification ................................................................... 7 6. Bluetooth Specification ...................................................................................... 9 6.1 Bluetooth Specification ................................................................................... 9 7. Pin Assignments ............................................................................................... 10 7.1 Pin Outline .................................................................................................... 10 7.2 Pin Definition ................................................................................................ 10 8. Dimensions ....................................................................................................... 12 8.1 Physical Dimensions..................................................................................... 12 8.2 Layout Recommendation .............................................................................. 13 9. External clock reference .................................................................................. 14 9.1 SDIO Pin Description .................................................................................... 14 10. Host Interface Timing Diagram ........................................................................ 15 10.1 Power-up Sequence Timing Diagram ......................................................... 15 10.2 SDIO Default Mode Timing Diagram........................................................... 17 10.3 SDIO High Speed Mode Timing Diagram ................................................... 18 11. Recommended Reflow Profile ......................................................................... 19 12. Package Information ........................................................................................ 20 12.1Label ............................................................................................................ 20 Label C Inner box label . .................................................................................... 20 Label D Carton box label . ................................................................................. 20 12.2 Dimension ................................................................................................... 21 12.3 MSL Level / Storage Condition ................................................................... 23 AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO: 2

AP6234 Datasheet 1. Introduction AMPAK Technology would like to announce a low-cost and low-power consumption module, with integrated dual band (2.4GHz/5GHz) IEEE 802.11 a/b/g and single-stream IEEE 802.11n MAC/baseband/radio and Bluetooth 4.0. The integrated module provides SDIO V2.0 Host interface for Wi-Fi, high-speed UART is provided for the Bluetooth Host interface. This compact module is a total solution for a combination of Wi-Fi dual mode + BT4.0 technologies. The module is specifically developed for mobiles, tablets or handheld wireless system devices. AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO: 3

AP6234 Datasheet 2. Features IEEE 802.11x Key Features • • • • • Dual-band 2.4GHz/5GHz 802.11a/b/g/n. Single-stream IEEE 802.11n support for 20MHz and 40MHz channels provides PHY layer rates up to 150Mbps. WLAN host interface options: SDIO v2.0 — up to 50 MHz clock rate Support a single antenna shared between WLAN and Bluetooth. Security: WEP, WPS, WPA, WPA2, WMM, WAPI, AES,… Bluetooth Features • • • • • • Bluetooth V4.0(BLE) Low Energy with provisions for supporting future specifications. Bluetooth Class1 or Class2 transmitter operation. BT host digital interface UART(up to 4 Mbps) with support all Bluetooth4.0 package types Multipoint operation with up to seven active ACL links, three active SCO and eSCO connections. Full support for power savings modes (standard sniff, deep sleep modes) ECI - enhanced coexistence support, ability to coordinate BT SCO transmissions around WLAN receives A simplified block diagram of the module is depicted in the figure below. AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO: 4

AP6234 Datasheet 3. Deliverables 3.1 Deliverables The following products and software will be part of the product.  Module with packaging  Evaluation Kits  Software utility for integration, performance test.  Product Datasheet.  Agency certified pre-tested report with the adapter board. 3.2 Regulatory certifications The product delivery is a pre-tested module, without the module level certification. For module approval, the platform’s antennas are required for the certification. AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO: 5

AP6234 Datasheet 4. General Specification 4.1 General Specification Model Name Product Description Dimension WiFi Interface BT Interface Operating temperature Storage temperature Humidity AP6234 Supports Wi-Fi dual mode /Bluetoothfunctionalities L x W x H: 12.0 x 12.0 x 1.5 (typical) mm SDIOV2.0 UART/ PCM -30°C to 85°C -40°C to 85°C Operating Humidity 10% to 95% Non-Condensing 4.2 Voltages 4.2.1 Absolute Maximum Ratings Symbol VBAT VDDIO Description Input supply Voltage Digital/Bluetooth/SDIO/ I/O Voltage 4.2.2 Recommended Operating Rating The module requires two power supplies: VBAT and VDDIO. Min. Max. Unit -0.5 V V -0.5 5 3.6 Operating Temperature VBAT VDDIO Min. -30 3.0 1.6 Typ. 25 3.6 3.3 Max. 85 4.8 3.4 Unit deg.C V V AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information Doc. NO: 6

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AP6234 datasheet_V1.3_04262013.pdf

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