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1/3.2-Inch System-On-A-Chip (SOC) CMOS Digital Image Sensor
Features
Applications
Ordering Information
General Description
Feature Overview
Typical Connection
Signal Description
Architecture Overview
Sensor Core
Color Pipeline
Test Pattern
Black Level Conditioning and Digital Gain
Lens Shading Correction
Line Buffers
Defect Correction
Color Interpolation and Edge Detection
Color Correction and Aperture Correction
Gamma Correction
YUV Processing
Image Cropping and Decimation
YUV-to-RGB/YUV Conversion and Output Formatting
JPEG Encoder and FIFO
JPEG Encoding Highlights
Output Interface
Control (Two-Wire Serial Interface)
Context and Operational Modes
Auto Exposure
Preview Mode
Scene Evaluative Algorithm
Auto White Balance
Flicker Detection
Die Outline
Electrical Specifications
Package Dimensions
Revision History
MT9D131: 1/3.2-Inch 2-Mp SOC Digital Image Sensor Features Preliminary‡ 1/3.2-Inch System-On-A-Chip (SOC) CMOS Digital Image Sensor MT9D131C12STC (Color, Pb-Free) Features • Micron® DigitalClarity® CMOS imaging technology Superior low-light performance Ultra-low-power,cost-effective Internal master clock generated by on-chip phase- locked loop oscillator (PLL) Electronic rolling shutter (ERS), progressive scan Integrated image flow processor (IFP) for single-die camera module Automatic image correction and enhancement, including lens shading correction Arbitrary image decimation with anti-aliasing Integrated real-time JPEG encoder Integrated microcontroller for flexibility Two-wire serial interface providing access to registers and microcontroller memory Selectable output data format – ITU-R BT.601 (YCbCr) – 565RGB – 555RGB – 444RGB – JPEG 4:2:2 – JPEG 4:2:0 – Raw 10-bit Output FIFO for data rate equalization Programmable I/O slew rate Applications Security surveillance cameras ePTZ cameras Wireless cameras Consumer video products High-resolution security cameras Table 1: Key Performance Parameters Parameter Optical format Active imager size Active pixels Pixel size Shutter type Maximum frame rate Value 1/3.2-inch (4:3) 4.73mm x 3.52mm 1600 x 1200 pixels (UXGA) 2.8µm x 2.8µm Electronic rolling shutter (ERS) 15 fps at full resolution, 30 fps in preview mode, (800 x 600) 80 MB/s 6 MHz to 80 MHz Digital I/O PLL Maximum data rate/ master clock Supply voltage Analog 2.5−3.1V 1.7−1.95V 1.7−3.1V 2.5−3.1V 10-bit, on-die 1.0V/lux-sec (550nm) 71dB 16 e-/pix/s at 55°C 3.6 e-RMS at 16X 30 e-/pix/s at 55°C 42.3dB 348mW at 15 fps, full resolution 223mW at 30 fps, preview mode ADC resolution Responsivity Dynamic range Output gain Read noise Dark current SNRMAX Power consumption Operating temperature –30°C to +70°C Package Bare die, 48-pin CLCC Ordering Information Table 2: Available Part Numbers Part Number Description 48-pin CLCC (Pb-free) ES MT9D131C12STC ES MT9D131C12STCD ES Demo kit MT9D131C12STCH ES Demo kit headboard PDF: 09005aef824c90ce/Source: 09005aef824c90d6 Micron Technology, Inc., reserves the right to change products or specifications without notice. MT9D131_LDS_1.fm - Rev. B 3/07 EN ©2006 Micron Technology, Inc. All rights reserved. ‡Products and specifications discussed herein are for evaluation and reference purposes only and are subject to change by Micron without notice. Products are only warranted by Micron to meet Micron’s production data sheet specifications. 1
MT9D131: 1/3.2-Inch 2-Mp SOC Digital Image Sensor General Description Preliminary General Description Micron Imaging MT9D131 is a 1/3.2 inch, 2-megapixel CMOS image sensor with an inte- grated advanced camera system. The camera system features a microcontroller (MCU) and a sophisticated image flow processor (IFP) with a real-time JPEG encoder. The sensor core consists of an active pixel array of 1668 x 1248 pixels, programmable timing and control circuitry including a PLL, analog signal chain with automatic offset correction and programmable gain, and two 10-bit A/D converters (ADC). The entire system-on-a-chip (SOC) has ultra-low power requirements and superior low-light per- formance that is particularly suitable for a wide variety of applications. Feature Overview The MT9D131 is a color image sensor with a Bayer color filter arrangement. The MT9D131 has an embedded phase-locked loop oscillator (PLL) that can be used with the common wireless system clock. When in use, the PLL adjusts the incoming clock frequency, allowing the MT9D131 to run at almost any resolution and frame rate. To reduce power consumption, the PLL can be bypassed and powered down. The MT9D131 has numerous power conserving features, including an ultra-low power standby mode and the ability to individually shut down unused digital blocks. Another important consideration for wireless devices is their electromagnetic emission or interference (EMI). The MT9D131 has a programmable I/O slew rate to minimize its EMI and an output FIFO to eliminate output data bursts. The advanced IFP and flexible programmability of the MT9D131 provide a variety of ways to enhance and optimize the image sensor performance. Built-in optimization algorithms enable the MT9D131 to operate at factory settings as a fully automatic, highly adaptable camera. However, most of its settings are user-programmable by changing register values. Figure 1 illustrates the MT9D131 quantum efficiency in relation to wavelength. Figure 1: MT9D131 Quantum Efficiency Quantum Efficiency vs. Wavelength Blue Green Red 40 35 30 25 20 15 10 5 0 ) % ( y c n e c i i f f E m u t n a u Q 350 450 550 650 750 850 950 1050 PDF: 09005aef824c90ce/Source: 09005aef824c90d6 MT9D131_LDS_2.fm - Rev. B 3/07 EN 2 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2006 Micron Technology, Inc. All rights reserved.
MT9D131: 1/3.2-Inch 2-Mp SOC Digital Image Sensor Typical Connection Preliminary Typical Connection Figure 2: Typical Configuration (Connection) VDDQ VDD VDDPLL VAA 1 Ω K 5 . 1 1 Ω K 5 . 1 3 Q D D V 3 D D V 3 A A V 3 L L P D D V I 3 X P A A V Two-Wire Serial Bus 6 MHz–80 MHz Clock Ω K 1 10µF SADDR SCLK SDATA STANDBY TEST2 EXTCLK RESET# DOUT0-DOUT7 LINE_VALID FRAME_VALID PIXCLK To CMOS Camera Port D N G D D N G A Notes: 1. Resistor value 1.5KΩ is recommended, but may be greater for slower two-wire speed. 2. TEST must be connected to digital ground for normal device operation. 3. All power supply pads must be used. PDF: 09005aef824c90ce/Source: 09005aef824c90d6 MT9D131_LDS_2.fm - Rev. B 3/07 EN 3 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2006 Micron Technology, Inc. All rights reserved.
MT9D131: 1/3.2-Inch 2-Mp SOC Digital Image Sensor Signal Description Preliminary Signal Description Table 3: Signal Description Name EXTCLK RESET# STANDBY TEST SCLK SADDR CLCC Pin 40 39 38 20 34 35 Type Input Input Input Input Input Input DOUT[7:0] 8, 9, 10, 11, 14, 15, 16, Input FRAME_VALID LINE_VALID PIXCLK SDATA VDD VDDPLL VAA VAAPIX VDDQ AGND DGND 17 1 48 47 46 2, 3, 12, 24, 25, 36 41 32, 33 26, 27 21, 22, 44, 5 29, 30, 31 4, 6, 7, 13, 18, 19, 23, 28, 37, 42, 43, 45 Input Input Input I/O Supply Supply Supply Supply Supply Supply Supply Description Master clock signal (can either drive the on-chip PLL or bypass it). Master reset signal, active LOW. Controls sensor’s standby mode. Reserved for factory test. Tie to digital ground during normal operation. Two-wire serial interface clock. Selects device address for the two-wire serial interface. The address is 0x90 when SADDR is tied LOW, 0xBA if tied HIGH. See also R0x0D:0[10]. Eight-bit image data output or most significant bits (MSB) of 10- bit sensor bypass mode. Identifies rows in the active image. Identifies lines in the active image. Pixel clock. To be used for sampling DOUT, FRAME_VALID, and LINE_VALID. Two-wire serial interface data. Digital power (1.8V). PLL power (2.8V). Analog power (2.8V). Pixel array power (2.8V). I/O power (nominal 1.8V or 2.8V). Analog ground. Digital, I/O, and PLL ground. PDF: 09005aef824c90ce/Source: 09005aef824c90d6 MT9D131_LDS_2.fm - Rev. B 3/07 EN 4 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2006 Micron Technology, Inc. All rights reserved.
MT9D131: 1/3.2-Inch 2-Mp SOC Digital Image Sensor Signal Description Preliminary Figure 3: 48-Pin CLCC Pinout D N G D Q D D V D N G D D D V D D V D I L A V _ E M A R F D I L A V _ E N I L K L C X P I A T A D S D N G D Q D D V D N G D DGND DOUT7 DOUT6 DOUT5 DOUT4 VDD DGND DOUT3 DOUT2 DOUT1 DOUT0 DGND 7 8 9 10 11 12 13 14 15 16 17 18 6 5 4 3 2 1 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 19 20 21 22 23 24 25 26 27 28 29 30 D N G D T S E T Q D D V Q D D V D N G D D D V D D V D N G D D N G A D N G A I X P A A V I X P A A V DGND VDDPLL EXTCLK RESET# STANDBY DGND VDD SADDR SCLK VAA VAA AGND PDF: 09005aef824c90ce/Source: 09005aef824c90d6 MT9D131_LDS_2.fm - Rev. B 3/07 EN 5 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2006 Micron Technology, Inc. All rights reserved.
MT9D131: 1/3.2-Inch 2-Mp SOC Digital Image Sensor Architecture Overview Preliminary Architecture Overview Figure 4: Block Diagram Interpolation Line Buffers Decimator Line Buffers JPEG Line Buffers Other JPEG Memories Image Flow Processor Sensor Core PLL Color Pipeline Stats Engine JPEG F I F O Internal Register Bus ROM Micron controller SRAM Sensor Core The MT9D131 sensor core is a 2-megapixel CMOS image sensor with a 2.8µm pixel size designed for an optical format of 1/3.2 inches with a UXGA maximum resolution. The MT9D131 sensor core includes a phase-locked loop oscillator (PLL), to facilitate camera integration and minimize the system cost for wireless and mobile applications. When in use, the PLL generates an internal master clock signal whose frequency can be set higher than the frequency of external clock signal EXTCLK. This allows the MT9D131 to run at any resolution and frame rate up to the specified maximum values, irrespective of the EXTCLK frequency. PDF: 09005aef824c90ce/Source: 09005aef824c90d6 MT9D131_LDS_2.fm - Rev. B 3/07 EN 6 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2006 Micron Technology, Inc. All rights reserved.
MT9D131: 1/3.2-Inch 2-Mp SOC Digital Image Sensor Architecture Overview Preliminary Color Pipeline Figure 5: Color Pipeline DATA, SYNC IN Test Pattern Black Level Subtraction Digital Gain Lens Shading Correction with Digital Gain Line Buffers Defect Correction Interpolation and Edge Detection CCM and Aperture Correction Gamma Correction YUV Processing Decimator YUV-to-RGB/YUV Conversion Format Output DATA, SYNC OUT MEASUREMENT ENGINE AE Statistics Test Pattern During normal operation of MT9D131, a stream of raw image data from the sensor core is continuously fed into the color pipeline. For test purposes, this stream can be replaced with a fixed image generated by a special test module in the pipeline. The mod- ule provides a selection of test patterns sufficient for basic testing of the pipeline. PDF: 09005aef824c90ce/Source: 09005aef824c90d6 MT9D131_LDS_2.fm - Rev. B 3/07 EN 7 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2006 Micron Technology, Inc. All rights reserved.
MT9D131: 1/3.2-Inch 2-Mp SOC Digital Image Sensor Architecture Overview Preliminary Black Level Conditioning and Digital Gain Image stream processing starts with black level conditioning and multiplication of all pixel values by a programmable digital gain. Lens Shading Correction Line Buffers Defect Correction Inexpensive lenses tend to produce images whose brightness is significantly attenuated near the edges. Chromatic aberration in such lenses can cause color variation across the field of view. There are also other factors causing fixed-pattern signal gradients in images captured by image sensors. The cumulative result of all these factors is known as lens shading. The MT9D131 has an embedded lens shading correction (LC) module that can be programmed to precisely counter the shading effect of a lens on each RGB color signal. The LC module multiplies RGB signals by a 2-dimensional correction function F(x,y), whose profile in both x and y direction is a piecewise quadratic polynomial with coefficients independently programmable for each direction and color. Several data processing steps following the lens shading correction require access to pixel values from up to 8 consecutive image lines. For these lines to be simultaneously available for processing, they must be buffered. The IFP includes a number of SRAM line buffers that are used to perform defect correction, color interpolation, image decima- tion, and JPEG encoding. The IFP performs on-the-fly defect correction that can mask pixel array defects such as high-dark-current (“hot”) pixels and pixels that are darker or brighter than their neigh- bors due to photoresponse nonuniformity. The defect correction algorithm uses several pixel features to distinguish between normal and defective pixels. After identifying the latter, it replaces their actual values with values inferred from the values of nearest same-color neighbors. Color Interpolation and Edge Detection In the raw data stream fed by the sensor core to the IFP, each pixel is represented by a 10-bit integer number, which, to make things simple, can be considered proportional to the pixel’s response to a one-color light stimulus—red, green, or blue—depending on the pixel’s position under the color filter array. Initial data processing steps, up to and including the defect correction, preserve the one-color-per-pixel nature of the data stream, but after the defect correction it must be converted to a three-colors-per-pixel stream appropriate for standard color processing. The conversion is done by an edge- sensitive color interpolation module. The module pads the incomplete color informa- tion available for each pixel with information extracted from an appropriate set of neighboring pixels. The algorithm used to select this set and extract the information seeks the best compromise between maintaining the sharpness of the image and filter- ing out high-frequency noise. The simplest interpolation algorithm is to sort the nearest eight neighbors of every pixel into three sets—red, green, and blue, discard the set of pixels of the same color as the center pixel (if there are any), calculate average pixel val- ues for the remaining two sets, and use the averages instead of the missing color data for the center pixel. Such averaging reduces high-frequency noise, but it also blurs and dis- torts sharp transitions (edges) in the image. To avoid this problem, the interpolation module performs edge detection in the neighborhood of every processed pixel and, depending on its results, extracts color information from neighboring pixels in a number of different ways. In effect, it does low-pass filtering in flat-field image areas and avoids doing it near edges. PDF: 09005aef824c90ce/Source: 09005aef824c90d6 MT9D131_LDS_2.fm - Rev. B 3/07 EN 8 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2006 Micron Technology, Inc. All rights reserved.
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