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PICMG_COM_0R3_0/ COMe Express R3.0/COMe 3.0 Spec（电子版非图片版）.pdf
1 Introduction
1.1 Objective
1.2 COM.0 R3.0 Changes from R2.1
Type 6
Type 10
Type 7
1.3 Name and Logo Usage
1.4 Intellectual Property
1.4.1 Necessary Claims (referring to mandatory or recommended features)
1.4.2 Unnecessary Claims (referring to optional features or non-normative elements)
1.4.3 Third Party Disclosures
1.5 Copyright Notice
1.5.1 Trademarks
1.6 Acronyms / Definitions
Table 1.1: Terms and Definitions
1.7 Applicable Documents and Standards
1.8 Special Word Usage
Table 1.2: Special Word Usage
1.9 Statement of Compliance
2 Module Overview
2.1 Module Configuration
2.2 Feature Overview - Size
2.2.1 Mini Module
2.2.2 Compact Module
2.2.3 Basic Module
2.2.4 Extended Module
2.3 Feature Overview - Pin-Out Types
2.3.1 Pin-Out Type 10
2.3.2 Pin-Out Type 6
2.3.3 Pin-Out Type 7
3 Required and Optional Features
3.1 Module Pin-Out Type Definitions
Table 3.1: Module Pin-out Type Overview
3.2 Module Pin-Out Types 6-7 & 10 - Required and Optional Features
Table 3.2: Module Pin-out - Required and Optional Features
3.3 Feature Fill Order
Table 3.3: Module Feature Fill Order
3.4 EAPI - Embedded Application Programming Interface
4 Signal Descriptions
4.1 Signal Naming Convention
4.2 Pin and Signal Buffer Types
4.2.1 Pin Types
4.2.2 Buffer Types
4.2.3 Power Rails and Tolerances
4.3 Signal List
4.3.1 High Definition Audio
Table 4.1: HDA Signals, Pin Types, and Descriptions
4.3.2 Gb Ethernet
Table 4.2: Gigabit Ethernet Signals, Pin Types, and Descriptions
4.3.3 NC-SI
Table 4.3: NC-SI Signals, Pin Types, and Descriptions
4.3.4 10Gb Ethernet
Table 4.4: 10Gigabit Ethernet Pin Types and Descriptions
AC Coupling of 10G_KR_TX Signals
Table 4.5: I2C Data Mapping to Carrier Board Based PCA9539 I/O Expander
4.3.5 SDP Pins
Pulse Per Second (PPS):
Platform-Level Synchronization Implementation Examples:
Precision Time Protocol - Background
Software Implementation:
4.3.6 Serial ATA
Table 4.6: SATA Signals, Pin Types, and Descriptions
4.3.7 General Purpose PCI Express Lanes
Table 4.7: PCI Express Lanes Signals, Pin Types, and Descriptions
4.3.8 PEG PCI Express Lanes
Table 4.8: PEG Signals, Pin Types, and Descriptions
4.3.9 USB
Table 4.9: USB Signals, Pin Types, and Descriptions
4.3.10 LVDS Flat Panel
Table 4.10: LVDS Signals, Pin Types, and Descriptions
4.3.11 LPC and eSPI Interface
Table 4.11: LPC/eSPI, Pin Types, and Descriptions
4.3.12 SPI Interface
Table 4.12: SPI Signals, Pin Types, and Descriptions
SPI Power
Module Vs Carrier Board Pull-ups
4.3.13 BIOS Boot Selection
Historical Context
SPI Boot Flash Background
MAFS and SAFS BIOS Configurations
Table 4.13: BIOS Selection Straps
SPI BIOS MAFS Considerations – LPC Enabled
SPI BIOS MAFS Considerations – eSPI Enabled
eSPI BIOS SAFS Considerations – eSPI Enabled
4.3.14 Analog VGA
Table 4.14: VGA Signals, Pin Types, and Descriptions
4.3.15 Digital Display Interfaces (DDI) - Module Type 6 and 10
Figure 4-6: Dual-Mode COM Express Module Implementation
Table 4.15: Module and Carrier Combinations
Requirements
Table 4.16: Type 6 DDI Signals, Pin Types, and Descriptions
Table 4.17: Type 10 DDI Signals, Pin Types, and Descriptions
Table 4.18: Type 6 DDI
Table 4.19: Type 10 DDI
4.3.16 DDI Signals: DisplayPort
Table 4.20: DisplayPort Signals, Pin Types, and Descriptions
4.3.17 DDI Signals: HDMI / DVI
Table 4.21: HDMI/DVI Signals, Pin Types, and Descriptions
4.3.18 General Purpose Serial Interface
Table 4.22: Serial Interface Signals (Type 10), Pin Types, and Descriptions
4.3.19 I2C Bus
Table 4.23: I2C Signals, Pin Types, and Descriptions
4.3.20 Miscellaneous
Table 4.24: Misc Signals, Pin Types, and Descriptions
4.3.21 Power and System Management
Table 4.25: Power and System Management Signals, Pin Types, and Descriptions
4.3.22 Rapid Shutdown
Table 4.26: Rapid Shutdown Signal
4.3.23 Thermal Protection
Table 4.27: Thermal Protection Signals, Pin Types, and Descriptions
4.3.24 SM Bus
Table 4.28: SM Bus Signals, Pin Types, and Descriptions
4.3.25 General Purpose Input Output
Table 4.29: GPIO Signals, Pin Types, and Descriptions
4.3.26 SDIO
Table 4.30: SD Card Interface Signals
Table 4.31: SDIO Signals, Pin Types, and Descriptions
4.3.27 Module Type Definition
Table 4.32: Module Type Signals, Pin Types, and Descriptions
4.3.28 Power and Ground
Table 4.33: Power Signals, Pin Types, and Descriptions
4.3.29 eDP - Embedded DisplayPort
Table 4.34: Module and Carrier Combinations Type 6 and Type 10 Modules
Table 4.35: eDP Signals
Table 4.36: LVDS / eDP Pin Assignment
4.3.30 CAN Bus
Table 4.37: CAN Bus Signals
4.4 Signals Requiring Carrier Board Termination
4.4.1 Ethernet
4.4.2 Analog VGA
4.4.3 LVDS
4.4.4 USB
4.4.5 Digital Display Interfaces (DDI)
4.4.6 VCC_RTC
4.4.7 EMI and ESD Mitigation
4.5 Signals Requiring Module Termination
4.5.1 AC coupled on the Module
4.5.2 Misc
4.6 Pin-out Tables
4.6.1 Type 10
Table 4.38: Pin List for Pin-Out Type 10
4.6.2 Type 6
Table 4.39: Pin List for Pin-Out Type 6
4.6.3 Type 7
Table 4.40: Pin List for Pin-Out Type 7
5 Module and Carrier Board Implementation Specifications
5.1 PCI Express Link Configuration Definitions
Lane:
Link:
Link Configuration:
Bucket:
5.2 PCI Express Link Configuration Guidelines
Table 5.1: PCI Express Lane Numbers and Bucket Groupings
Table 5.2: Module Pin-Out Type 6 - Preferred Lane Groupings: Bucket B1
Table 5.3: Module Pin-Out Type 6 - Preferred Lane Groupings: Buckets B3 and B4
5.2.1 Type 7 Limitations
Table 5.4: Module Pin-Out Type 7 - Preferred Lane Groupings, X4 Root Hubs
Type 7 Lane Reversal
Table 5.5: Type 7 X4 Root Hub Without Lane Reversal
Table 5.6: Type 7 X4 Root Hub With Lane Reversal
5.3 COM Express EEPROMs
5.3.1 EEPROM Device Information
5.3.2 COM Express Module EEPROM
5.3.3 COM Express Carrier Board EEPROM
5.4 Loss Budgets for High Speed Differential Interfaces
5.4.1 PCI Express Insertion Loss Budget with Slot Card
Figure 5-1: PCI Express Insertion Loss Budget with Slot Card
Table 5.7: PCI Express Insertion Loss Budget, 1.25 GHz with Carrier Board Slot Card
Table 5.8: PCI Express Insertion Loss Budget, 2.5 GHz with Carrier Board Slot Card
5.4.2 PCI Express Insertion Loss Budget with Carrier Board PCIe Device
Figure 5-2: PCI Express Insertion Loss Budget with Carrier Board PCIe Device
Table 5.9: PCI Express Insertion Loss Budget, 1.25 GHz with Carrier Board PCIe Device
Table 5.10: PCI Express Insertion Loss Budget, 2.5 GHz with Carrier Board PCIe Device
Table 5.11: PCI Express Trace Routing Guidelines
5.4.3 SATA Insertion Loss Budget
Figure 5-3: SATA Insertion Loss Budget
Table 5.12: SATA Gen 1 Insertion Loss Budget, 1.5 GHz
Table 5.13: SATA Gen 2 Insertion Loss Budget, 3.0 GHz
Table 5.14: Serial ATA Trace Routing Guidelines
5.4.4 USB 2.0 Insertion Loss Budget
Figure 5-4: USB 2.0 Insertion Loss Budget
Table 5.15: USB Insertion Loss Budget, 400 MHz
5.4.5 SuperSpeed USB Insertion Loss Budget
Figure 5-5: SuperSpeed USB Insertion Loss Budget
Table 5.16: SuperSpeed USB Insertion Loss Budget
5.4.6 10/100/1000 Ethernet Insertion Loss Budget
Figure 5-6: 10/100/1000 Ethernet Insertion Loss Budget
Table 5.17: 10/100/1000 Ethernet Insertion Loss Budget, 100 MHz
5.4.7 10Gb Ethernet Insertion Loss Performance
Figure 5-7: 10GBASE-KR Trace Length Budget
Table 5.18: 10GBASE-KR Trace Length Budget
5.4.8 DDI Trace Length Recommendation
Figure 5-8: DDI Trace Length
Table 5.19: DDI Trace Length
5.4.9 Carrier Board LPC Devices
Figure 5-9: Typical Routing Topology for a Module LPC Device
5.5 SPI Devices
Figure 5-10: Typical SPI topology
5.6 eSPI Devices
5.7 Watchdog Timer
5.7.1 Output Modes and Characteristics
Table 5.20: Watchdog Timer Output Modes
5.7.2 Watchdog Enable and Strobe
Table 5.21: Watchdog Enable and Strobe Parameter Range
5.8 Protecting COM.0 Pins Reclaimed from the VCC_12V Pool
5.8.1 Logic Level Signals on Pins Reclaimed from VCC_12V
Figure 5-11: Protecting Logic Level Signals on Pins Reclaimed from VCC_12V, Diode Based Method
Figure 5-12: Protecting Logic Level Signals on Pins Reclaimed from VCC_12V, FET Based Method
5.8.2 TYPE10# Strap - Reclaimed from VCC_12V
6 Mechanical Specifications
6.1 Module Size – Mini Module
Figure 6-1: Mini Module Form Factor
6.2 Module Size - Compact Module
Figure 6-2: Compact Module Form Factor
6.3 Module Size - Basic Module
Figure 6-3: Basic Module Form Factor
6.4 Module Size - Extended Module
Figure 6-4: Extended Module Form Factor
6.5 Module Connector
Figure 6-5: Module Receptacle
6.6 Carrier Board Connector
Figure 6-6: Carrier Board Plug
6.7 Connector PCB Pattern
Figure 6-7: Connector PCB Pattern
6.8 Module Connector Pin Numbering
Figure 6-8: Module Connector Pin Numbering
6.9 Carrier Board Connector Pin Numbering
Figure 6-9: Carrier Board Connector Pin Numbering
6.10 Heat-Spreader
Figure 6-10: Overall Height for Heat-Spreader in Mini, Compact, Basic and Extended Modules
Figure 6-11: Mini Module Heat-Spreader
Figure 6-12: Compact Module Heat-Spreader
Figure 6-13: Basic Module Heat-Spreader
Figure 6-14: Heat-Spreader Specification for Extended Module
6.11 Component Height - Module Back and Carrier Board Top
Figure 6-15: Component Clearances Underneath Module
7 Electrical Specifications
7.1 Input Power - General Considerations
7.2 Input Power - Current Load
Table 7.1: Input Power - Pin-Out Type 10 Modules (Single Connector, 220 pins)
Table 7.2: Input Power - Pin-Out Type 6/7 Modules (Dual Connector, 440 pins)
7.3 Input Power - Sequencing
Figure 7-1: Power Sequencing
Table 7.3: Power Sequencing
7.4 Input Power - Rise Time
Figure 7-2: Input Power Rise Time
7.5 Signal Integrity Requirements
Table 7.4: Signal Integrity Requirements
8 Environmental Specifications
8.1 Thermal Specification
8.1.1 Objectives
8.1.2 Definitions
8.1.3 Tcase_max Measurement Setup
Figure 8-1: Tcase_Max Measurement Point
8.1.4 Module Thermal Specification Requirements
8.1.5 Shock and Vibration
9 Appendix
9.1 Mounting Positions and Connector Location for Carrier Boards
Figure 9-1: Carrier Board Mounting Positions
9.2 Changes in Type 6 from Revision 2.1 to Revision 3.0
Table 9.1: Comparison Type 6 Rev. 2.1 with Type 6 Rev 3.0
9.3 Comparison of Type 6 Revision 3.0 to Type 7
Table 9.2: Comparison Type 6 Rev. 2.1 with Type 7 Rev 3.0
9.4 Type 10 Changes from Rev. 2.1 to Rev. 3.0.
Table 9.3: Type 10 Rev. 2.1 to Rev. 3.0 Comparison
9.5 Example 10 GB Ethernet Designs
9.5.1 2016 Silicon 10GbE Fiber Implementation
Figure 9-2: 10G Ethernet Design for Fiber PHY with Broadwell DE
9.5.2 2016 Silicon 10GbE Copper Implementation
Figure 9-3: 10G Ethernet Design for Copper PHY with Broadwell DE
9.5.3 Future Silicon 10GbE Fiber Implementation
Figure 9-4: 10G Ethernet Design for Fiber PHY with Future SoC
9.5.4 Future Silicon 10GbE Copper Implementation
Figure 9-5: 10G Ethernet Design for Copper PHY with Future SoC
PICMG® COM.0
COM Express® Module Base Specification
Revision 3.0
March 31, 2017
© 2005, 2010, 2011, 2012, 2016, 2017 PCI Industrial Computer Manufacturers
Group. The attention of adopters is directed to the possibility that compliance with or
adoption of PICMG® specifications may require use of an invention covered by patent
rights. PICMG® shall not be responsible for identifying patents for which a license may
be required by any PICMG® specification or for conducting legal inquiries into the legal
validity or scope of those patents that are brought to its attention. PICMG®
specifications are prospective and advisory only. Prospective users are responsible for
protecting themselves against liability for infringement of patents.
NOTICE:
The information contained in this document is subject to change without notice. The
material in this document details a PICMG® specification in accordance with the license
and notices set forth on this page. This document does not represent a commitment to
implement any portion of this specification in any company's products.
WHILE THE INFORMATION IN THIS PUBLICATION IS BELIEVED TO BE ACCURATE, PICMG®
MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS
MATERIAL INCLUDING, BUT NOT LIMITED TO, ANY WARRANTY OF TITLE OR
OWNERSHIP, IMPLIED WARRANTY OF MERCHANTABILITY OR WARRANTY OF FITNESS
FOR PARTICULAR PURPOSE OR USE.
In no event shall PICMG® be liable for errors contained herein or for indirect, incidental,
special, consequential, reliance or cover damages, including loss of profits, revenue,
data or use, incurred by any user or any third party. Compliance with this specification
does not absolve manufacturers of equipment from the requirements of safety and
regulatory agencies (UL, CSA, FCC, IEC, etc.).
IMPORTANT NOTICE:
This document includes references to specifications, standards or other material not
created by PICMG. Such referenced materials will typically have been created by
organizations that operate under IPR policies with terms that vary widely, and under
process controls with varying degrees of strictness and efficacy. PICMG has not made
any enquiry into the nature or effectiveness of any such policies, processes or controls,
and therefore ANY USE OF REFERENCED MATERIALS IS ENTIRELY AT THE RISK OF THE
USER. Users should therefore make such investigations regarding referenced materials,
and the organizations that have created them, as they deem appropriate.
PICMG®, CompactPCI®, AdvancedTCA®, AdvancedTCA® 300,ATCA®, ATCA® 300,
AdvancedMC®, CompactPCI® Express, COM Express®, MicroTCA®, SHB Express®, and the
PICMG, CompactPCI, AdvancedTCA, µTCA and ATCA logos are registered trademarks,
and xTCA™, IRTM™ and the IRTM logo are trademarks of the PCI Industrial Computer
Manufacturers Group. All other brand or product names may be trademarks or
registered trademarks of their respective holders.
Contents
Contents
1 Introduction...................................................................................................................................1
1.1 Objective.......................................................................................................................................................2
1.2 COM.0 R3.0 Changes from R2.1....................................................................................................................3
1.3 Name and Logo Usage...................................................................................................................................4
1.4 Intellectual Property.....................................................................................................................................5
1.4.1 Necessary Claims (referring to mandatory or recommended features)....................................5
1.4.2 Unnecessary Claims (referring to optional features or non-normative elements)...................5
1.4.3 Third Party Disclosures...............................................................................................................6
1.5 Copyright Notice...........................................................................................................................................7
1.5.1 Trademarks.................................................................................................................................7
1.6 Acronyms / Definitions..................................................................................................................................8
1.7 Applicable Documents and Standards.........................................................................................................11
1.8 Special Word Usage....................................................................................................................................13
1.9 Statement of Compliance............................................................................................................................14
2 Module Overview.........................................................................................................................15
2.1 Module Configuration.................................................................................................................................15
2.2 Feature Overview - Size...............................................................................................................................16
2.2.1 Mini Module.............................................................................................................................16
2.2.2 Compact Module......................................................................................................................16
2.2.3 Basic Module............................................................................................................................16
2.2.4 Extended Module.....................................................................................................................16
2.3 Feature Overview - Pin-Out Types..............................................................................................................18
2.3.1 Pin-Out Type 10........................................................................................................................18
2.3.2 Pin-Out Type 6..........................................................................................................................19
2.3.3 Pin-Out Type 7..........................................................................................................................19
3 Required and Optional Features...................................................................................................21
3.1 Module Pin-Out Type Definitions................................................................................................................21
3.2 Module Pin-Out Types 6-7 & 10 - Required and Optional Features............................................................22
3.3 Feature Fill Order........................................................................................................................................24
3.4 EAPI - Embedded Application Programming Interface................................................................................25
4 Signal Descriptions.......................................................................................................................27
4.1 Signal Naming Convention..........................................................................................................................27
4.2 Pin and Signal Buffer Types.........................................................................................................................27
4.2.1 Pin Types...................................................................................................................................27
PICMG® COM.0 Revision 3.0 COM Express® Base Specification - March 31, 2017
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Contents
4.2.2 Buffer Types..............................................................................................................................27
4.2.3 Power Rails and Tolerances......................................................................................................28
4.3 Signal List....................................................................................................................................................29
4.3.1 High Definition Audio...............................................................................................................30
4.3.2 Gb Ethernet..............................................................................................................................31
4.3.3 NC-SI.........................................................................................................................................32
4.3.4 10Gb Ethernet..........................................................................................................................33
4.3.5 SDP Pins....................................................................................................................................37
4.3.6 Serial ATA.................................................................................................................................39
4.3.7 General Purpose PCI Express Lanes.........................................................................................40
4.3.8 PEG PCI Express Lanes..............................................................................................................41
4.3.9 USB...........................................................................................................................................42
4.3.10 LVDS Flat Panel.......................................................................................................................43
4.3.11 LPC and eSPI Interface............................................................................................................44
4.3.12 SPI Interface...........................................................................................................................46
4.3.13 BIOS Boot Selection................................................................................................................48
4.3.14 Analog VGA.............................................................................................................................52
4.3.15 Digital Display Interfaces (DDI) - Module Type 6 and 10.......................................................53
4.3.16 DDI Signals: DisplayPort.........................................................................................................58
4.3.17 DDI Signals: HDMI / DVI.........................................................................................................58
4.3.18 General Purpose Serial Interface...........................................................................................59
4.3.19 I2C Bus....................................................................................................................................60
4.3.20 Miscellaneous.........................................................................................................................61
4.3.21 Power and System Management...........................................................................................62
4.3.22 Rapid Shutdown.....................................................................................................................64
4.3.23 Thermal Protection................................................................................................................65
4.3.24 SM Bus....................................................................................................................................66
4.3.25 General Purpose Input Output...............................................................................................67
4.3.26 SDIO........................................................................................................................................68
4.3.27 Module Type Definition..........................................................................................................69
4.3.28 Power and Ground.................................................................................................................70
4.3.29 eDP - Embedded DisplayPort.................................................................................................71
4.3.30 CAN Bus..................................................................................................................................73
4.4 Signals Requiring Carrier Board Termination..............................................................................................74
4.4.1 Ethernet....................................................................................................................................74
4.4.2 Analog VGA...............................................................................................................................74
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Contents
4.4.3 LVDS..........................................................................................................................................74
4.4.4 USB...........................................................................................................................................74
4.4.5 Digital Display Interfaces (DDI).................................................................................................75
4.4.6 VCC_RTC...................................................................................................................................76
4.4.7 EMI and ESD Mitigation............................................................................................................76
4.5 Signals Requiring Module Termination.......................................................................................................77
4.5.1 AC coupled on the Module.......................................................................................................77
4.5.2 Misc..........................................................................................................................................77
4.6 Pin-out Tables.............................................................................................................................................79
4.6.1 Type 10.....................................................................................................................................79
4.6.2 Type 6.......................................................................................................................................82
4.6.3 Type 7.......................................................................................................................................85
5 Module and Carrier Board Implementation Specifications............................................................89
5.1 PCI Express Link Configuration Definitions..................................................................................................89
5.2 PCI Express Link Configuration Guidelines..................................................................................................89
5.2.1 Type 7 Limitations....................................................................................................................93
5.3 COM Express EEPROMs...............................................................................................................................95
5.3.1 EEPROM Device Information....................................................................................................95
5.3.2 COM Express Module EEPROM................................................................................................95
5.3.3 COM Express Carrier Board EEPROM.......................................................................................95
5.4 Loss Budgets for High Speed Differential Interfaces...................................................................................96
5.4.1 PCI Express Insertion Loss Budget with Slot Card....................................................................98
5.4.2 PCI Express Insertion Loss Budget with Carrier Board PCIe Device.......................................100
5.4.3 SATA Insertion Loss Budget....................................................................................................103
5.4.4 USB 2.0 Insertion Loss Budget................................................................................................106
5.4.5 SuperSpeed USB Insertion Loss Budget.................................................................................107
5.4.6 10/100/1000 Ethernet Insertion Loss Budget........................................................................108
5.4.7 10Gb Ethernet Insertion Loss Performance...........................................................................109
5.4.8 DDI Trace Length Recommendation......................................................................................110
5.4.9 Carrier Board LPC Devices......................................................................................................112
5.5 SPI Devices................................................................................................................................................113
5.6 eSPI Devices..............................................................................................................................................114
5.7 Watchdog Timer........................................................................................................................................115
5.7.1 Output Modes and Characteristics........................................................................................115
5.7.2 Watchdog Enable and Strobe.................................................................................................115
5.8 Protecting COM.0 Pins Reclaimed from the VCC_12V Pool......................................................................116
PICMG® COM.0 Revision 3.0 COM Express® Base Specification - March 31, 2017
v
Contents
5.8.1 Logic Level Signals on Pins Reclaimed from VCC_12V...........................................................117
5.8.2 TYPE10# Strap - Reclaimed from VCC_12V............................................................................120
6 Mechanical Specifications...........................................................................................................121
6.1 Module Size – Mini Module......................................................................................................................121
6.2 Module Size - Compact Module................................................................................................................122
6.3 Module Size - Basic Module......................................................................................................................123
6.4 Module Size - Extended Module...............................................................................................................124
6.5 Module Connector....................................................................................................................................125
6.6 Carrier Board Connector...........................................................................................................................126
6.7 Connector PCB Pattern.............................................................................................................................127
6.8 Module Connector Pin Numbering...........................................................................................................128
6.9 Carrier Board Connector Pin Numbering...................................................................................................128
6.10 Heat-Spreader.........................................................................................................................................129
6.11 Component Height - Module Back and Carrier Board Top......................................................................134
7 Electrical Specifications..............................................................................................................135
7.1 Input Power - General Considerations......................................................................................................135
7.2 Input Power - Current Load.......................................................................................................................136
7.3 Input Power - Sequencing.........................................................................................................................137
7.4 Input Power - Rise Time............................................................................................................................138
7.5 Signal Integrity Requirements...................................................................................................................139
8 Environmental Specifications......................................................................................................141
8.1 Thermal Specification................................................................................................................................141
8.1.1 Objectives...............................................................................................................................141
8.1.2 Definitions..............................................................................................................................142
8.1.3 Tcase_max Measurement Setup............................................................................................143
8.1.4 Module Thermal Specification Requirements.......................................................................143
8.1.5 Shock and Vibration...............................................................................................................144
9 Appendix....................................................................................................................................145
9.1 Mounting Positions and Connector Location for Carrier Boards...............................................................145
9.2 Changes in Type 6 from Revision 2.1 to Revision 3.0................................................................................146
9.3 Comparison of Type 6 Revision 3.0 to Type 7...........................................................................................147
9.4 Type 10 Changes from Rev. 2.1 to Rev. 3.0...............................................................................................150
9.5 Example 10 GB Ethernet Designs..............................................................................................................151
9.5.1 2016 Silicon 10GbE Fiber Implementation.............................................................................151
9.5.2 2016 Silicon 10GbE Copper Implementation.........................................................................152
9.5.3 Future Silicon 10GbE Fiber Implementation..........................................................................153
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9.5.4 Future Silicon 10GbE Copper Implementation......................................................................154
Contents
PICMG® COM.0 Revision 3.0 COM Express® Base Specification - March 31, 2017
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Contents
List of Tables
Table 1.1: Terms and Definitions................................................................................................................................... 8
Table 1.2: Special Word Usage..................................................................................................................................... 13
Table 3.1: Module Pin-out Type Overview................................................................................................................... 19
Table 3.2: Module Pin-out - Required and Optional Features......................................................................................20
Table 3.3: Module Feature Fill Order........................................................................................................................... 22
Table 4.1: HDA Signals, Pin Types, and Descriptions....................................................................................................27
Table 4.2: Gigabit Ethernet Signals, Pin Types, and Descriptions.................................................................................28
Table 4.3: NC-SI Signals, Pin Types, and Descriptions...................................................................................................29
Table 4.4: 10Gigabit Ethernet Pin Types and Descriptions...........................................................................................31
Table 4.5: I2C Data Mapping to Carrier Board Based PCA9539 I/O Expander..............................................................33
Table 4.6: SATA Signals, Pin Types, and Descriptions...................................................................................................35
Table 4.7: PCI Express Lanes Signals, Pin Types, and Descriptions...............................................................................36
Table 4.8: PEG Signals, Pin Types, and Descriptions.....................................................................................................37
Table 4.9: USB Signals, Pin Types, and Descriptions.....................................................................................................38
Table 4.10: LVDS Signals, Pin Types, and Descriptions.................................................................................................39
Table 4.11: LPC/eSPI, Pin Types, and Descriptions.......................................................................................................41
Table 4.12: SPI Signals, Pin Types, and Descriptions....................................................................................................42
Table 4.13: BIOS Selection Straps................................................................................................................................ 46
Table 4.14: VGA Signals, Pin Types, and Descriptions..................................................................................................48
Table 4.15: Module and Carrier Combinations............................................................................................................50
Table 4.16: Type 6 DDI Signals, Pin Types, and Descriptions........................................................................................50
Table 4.17: Type 10 DDI Signals, Pin Types, and Descriptions......................................................................................51
Table 4.18: Type 6 DDI................................................................................................................................................. 52
Table 4.19: Type 10 DDI............................................................................................................................................... 53
Table 4.20: DisplayPort Signals, Pin Types, and Descriptions.......................................................................................54
Table 4.21: HDMI/DVI Signals, Pin Types, and Descriptions.........................................................................................54
Table 4.22: Serial Interface Signals (Type 10), Pin Types, and Descriptions..................................................................55
Table 4.23: I2C Signals, Pin Types, and Descriptions....................................................................................................56
Table 4.24: Misc Signals, Pin Types, and Descriptions..................................................................................................57
Table 4.25: Power and System Management Signals, Pin Types, and Descriptions......................................................59
Table 4.26: Rapid Shutdown Signal.............................................................................................................................. 60
Table 4.27: Thermal Protection Signals, Pin Types, and Descriptions...........................................................................61
Table 4.28: SM Bus Signals, Pin Types, and Descriptions.............................................................................................62
Table 4.29: GPIO Signals, Pin Types, and Descriptions.................................................................................................63
Table 4.30: SD Card Interface Signals........................................................................................................................... 64
Table 4.31: SDIO Signals, Pin Types, and Descriptions.................................................................................................64
Table 4.32: Module Type Signals, Pin Types, and Descriptions....................................................................................65
Table 4.33: Power Signals, Pin Types, and Descriptions...............................................................................................66
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PICMG® COM.0 Revision 3.0 COM Express® Base Specification - March 31, 2017
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