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Lumped Elements for RF and Microwave Circuits (Bahl 2003).pdf

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    Lumped Elements for RF and Microwave Circuits
    Lumped Elements for RF and Microwave Circuits
    Copyright
    Contents
    Preface
    Acknowledgments
    1 Introduction
    1.1 History of Lumped Elements
    1.2 Why Use Lumped Elements for RF and Microwave Circuits?
    1.3 L, C, R Circuit Elements
    1.4 Basic Design of Lumped Elements
    1.4.1 Capacitor
    1.4.2 Inductor
    1.4.3 Resistor
    1.5 Lumped- Element Modeling
    1.6 Fabrication
    1.7 Applications
    References
    2 Inductors
    2.1 Introduction
    2.2 Basic Definitions
    2.2.1 Inductance
    2.2.2 Magnetic Energy
    2.2.3 Mutual Inductance
    2.2.4 Effective Inductance
    2.2.5 Impedance
    2.2.6 Time Constant
    2.2.7 Quality Factor
    2.2.8 Self- Resonant Frequency
    2.2.9 Maximum Current Rating
    2.2.10 Maximum Power Rating
    2.2.11 Other Parameters
    2.3 Inductor Configurations
    2.4 Inductor Models
    2.4.1 Analytical Models
    2.4.2 Coupled- Line Approach
    2.4.3 Mutual Inductance Approach
    2.4.4 Numerical Approach
    2.4.5 Measurement- Based Model
    2.5 Coupling Between Inductors
    2.5.1 Low- Resistivity Substrates
    2.5.2 High- Resistivity Substrates
    2.6 Electrical Representations
    2.6.1 Series and Parallel Representations
    2.6.2 Network Representations
    References
    3 Printed Inductors
    3.1 Inductors on Si Substrate
    3.1.1 Conductor Loss
    3.1.2 Substrate Loss
    3.1.3 Layout Considerations
    3.1.4 Inductor Model
    3.1.5 Q- Enhancement Techniques
    3.1.6 Stacked- Coil Inductor
    3.1.7 Temperature Dependence
    3.2 Inductors on GaAs Substrate
    3.2.1 Inductor Models
    3.2.2 Figure of Merit
    3.2.3 Comprehensive Inductor Data
    3.2.4 Q- Enhancement Techniques
    3.2.5 Compact Inductors
    3.2.6 High Current Handling Capability Inductors
    3.3 Printed Circuit Board Inductors
    3.4 Hybrid Integrated Circuit Inductors
    3.4.1 Thin- Film Inductors
    3.4.2 Thick- Film Inductors
    3.4.3 LTCC Inductors
    3.5 Ferromagnetic Inductors
    References
    4 Wire Inductors
    4.1 Wire- Wound Inductors
    4.1.1 Analytical Expressions
    4.1.2 Compact High- Frequency Inductors
    4.2 Bond Wire Inductor
    4.2.1 Single and Multiple Wires
    4.2.2 Wire Near a Corner
    4.2.3 Wire on a Substrate Backed by a Ground Plane
    4.2.4 Wire Above a Substrate Backed by a Ground Plane
    4.2.5 Curved Wire Connecting Substrates
    4.2.6 Twisted Wire
    4.2.7 Maximum Current Handling of Wires
    4.3 Wire Models
    4.3.1 Numerical Methods for Bond Wires
    4.3.2 Measurement- Based Model for Air Core Inductors
    4.3.3 Measurement- Based Model for Bond Wires
    4.4 Magnetic Materials
    References
    5 Capacitors
    5.1 Introduction
    5.2 Capacitor Parameters
    5.2.1 Capacitor Value
    5.2.2 Effective Capacitance
    5.2.3 Tolerances
    5.2.4 Temperature Coefficient
    5.2.5 Quality Factor
    5.2.6 Equivalent Series Resistance
    5.2.7 Series and Parallel Resonances
    5.2.8 Dissipation Factor or Loss Tangent
    5.2.9 Time Constant
    5.2.10 Rated Voltage
    5.2.11 Rated Current
    5.3 Chip Capacitor Types
    5.3.1 Multilayer Dielectric Capacitor
    5.3.2 Multiplate Capacitor
    5.4 Discrete Parallel Plate Capacitor Analysis
    5.4.1 Vertically Mounted Series Capacitor
    5.4.2 Flat- Mounted Series Capacitor
    5.4.3 Flat- Mounted Shunt Capacitor
    5.4.4 Measurement- Based Model
    5.5 Voltage and Current Ratings
    5.5.1 Maximum Voltage Rating
    5.5.2 Maximum RF Current Rating
    5.5.3 Maximum Power Dissipation
    5.6 Capacitor Electrical Representation
    5.6.1 Series and Shunt Connections
    5.6.2 Network Representations
    References
    6 Monolithic Capacitors
    6.1 MIM Capacitor Models
    6.1.1 Simple Lumped Equivalent Circuit
    6.1.2 Coupled Microstrip- Based Distributed Model
    6.1.3 Single Microstrip- Based Distributed Model
    6.1.4 EC Model for MIM Capacitor on Si
    6.1.5 EM Simulations
    6.2 High- Density Capacitors
    6.2.1 Multilayer Capacitors
    6.2.2 Ultra- Thin- Film Capacitors
    6.2.3 High- K Capacitors
    6.2.4 Fractal Capacitors
    6.2.5 Ferroelectric Capacitors
    6.3 Capacitor Shapes
    6.3.1 Rectangular Capacitors
    6.3.2 Circular Capacitors
    6.3.3 Octagonal Capacitors
    6.4 Design Considerations
    6.4.1 Q- Enhancement Techniques
    6.4.2 Tunable Capacitor
    6.4.3 Maximum Power Handling
    References
    7 Interdigital Capacitors
    7.1 Interdigital Capacitor Models
    7.1.1 Approximate Analysis
    7.1.2 J- Inverter Network Equivalent Representation
    7.1.3 Full- Wave Analysis
    7.1.4 Measurement- Based Model
    7.2 Design Considerations
    7.2.1 Compact Size
    7.2.2 Multilayer Capacitor
    7.2.3 Q- Enhancement Techniques
    7.2.4 Voltage Tunable Capacitor
    7.2.5 High- Voltage Operation
    7.3 Interdigital Structure as a Photodetector
    References
    8 Resistors
    8.1 Introduction
    8.2 Basic Definitions
    8.2.1 Power Rating
    8.2.2 Temperature Coefficient
    8.2.3 Resistor Tolerances
    8.2.4 Maximum Working Voltage
    8.2.5 Maximum Frequency of Operation
    8.2.6 Stability
    8.2.7 Noise
    8.2.8 Maximum Current Rating
    8.3 Resistor Types
    8.3.1 Chip Resistors
    8.3.2 MCM Resistors
    8.3.3 Monolithic Resistors
    8.4 High- Power Resistors
    8.5 Resistor Models
    8.5.1 EC Model
    8.5.2 Distributed Model
    8.5.3 Meander Line Resistor
    8.6 Resistor Representations
    8.6.1 Network Representations
    8.6.2 Electrical Representations
    8.7 Effective Conductivity
    8.8 Thermistors
    References
    9 Via Holes
    9.1 Types of Via Holes
    9.1.1 Via Hole Connection
    9.1.2 Via Hole Ground
    9.2 Via Hole Models
    9.2.1 Analytical Expression
    9.2.2 Quasistatic Method
    9.2.3 Parallel Plate Waveguide Model
    9.2.4 Method of Moments
    9.2.5 Measurement- Based Model
    9.3 Via Fence
    9.3.1 Coupling Between Via Holes
    9.3.2 Radiation from Via Ground Plug
    9.4 Plated Heat Sink Via
    9.5 Via Hole Layout
    References
    10 Airbridges and Dielectric Crossovers
    10.1 Airbridge and Crossover
    10.2 Analysis Techniques
    10.2.1 Quasistatic Method
    10.2.2 Full- Wave Analysis
    10.3 Models
    10.3.1 Analytical Model
    10.3.2 Measurement- Based Model
    References
    11 Transformers and Baluns
    11.1 Basic Theory
    11.1.1 Parameters Definition
    11.1.2 Analysis of Transformers
    11.1.3 Ideal Transformers
    11.1.4 Equivalent Circuit Representation
    11.1.5 Equivalent Circuit of a Practical Transformer
    11.1.6 Wideband Impedance Matching Transformers
    11.1.7 Types of Transformers
    11.2 Wire- Wrapped Transformers
    11.2.1 Tapped Coil Transformers
    11.2.2 Bond Wire Transformer
    11.3 Transmission- Line Transformers
    11.4 Ferrite Transformers
    11.5 Parallel Conductor Winding Transformers on Si Substrate
    11.6 Spiral Transformers on GaAs Substrate
    11.6.1 Triformer Balun
    11.6.2 Planar- Transformer Balun
    References
    12 Lumped-Element Circuits
    12.1 Passive Circuits
    12.1.1 Filters
    12.1.2 Hybrids and Couplers
    12.1.3 Power Dividers/ Combiners
    12.1.4 Matching Networks
    12.1.5 Lumped- Element Biasing Circuit
    12.2 Control Circuits
    12.2.1 Switches
    12.2.2 Phase Shifters
    12.2.3 Digital Attenuator
    References
    13 Fabrication Technologies
    13.1 Introduction
    13.1.1 Materials
    13.1.2 Mask Layouts
    13.1.3 Mask Fabrication
    13.2 Printed Circuit Boards
    13.2.1 PCB Fabrication
    13.2.2 PCB Inductors
    13.3 Microwave Printed Circuits
    13.3.1 MPC Fabrication
    13.3.2 MPC Applications
    13.4 Hybrid Integrated Circuits
    13.4.1 Thin- Film MICs
    13.4.2 Thick- Film Technology
    13.4.3 Cofired Ceramic and Glass- Ceramic Technology
    13.5 GaAs MICs
    13.5.1 MMIC Fabrication
    13.5.2 MMIC Example
    13.6 CMOS Fabrication
    13.7 Micromachining Fabrication
    References
    14 Microstrip Overview
    14.1 Design Equations
    14.1.1 Characteristic Impedance and Effective Dielectric Constant
    14.1.2 Effect of Strip Thickness
    14.2 Design Considerations
    14.2.1 Effect of Dispersion
    14.2.2 Microstrip Losses
    14.2.3 Quality Factor Q
    14.2.4 Enclosure Effect
    14.2.5 Frequency Range of Operation
    14.2.6 Power- Handling Capability
    14.3 Coupled Microstrip Lines
    14.3.1 Even- Mode Capacitance
    14.3.2 Odd- Mode Capacitance
    14.3.3 Characteristic Impedances
    14.3.4 Effective Dielectric Constants
    14.4 Microstrip Discontinuities
    14.5 Compensated Microstrip Discontinuities
    14.5.1 Step- in- Width
    14.5.2 Chamfered Bend
    14.5.3 T- Junction
    References
    Appendix
    About the Author
    Index
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