ZedBoard 
 
(Zynq™ Evaluation and Development) 
Hardware User’s Guide 
 
 
 
Version 2.2 
27 January 2014 
 
 
 
  
 
 
 
Table of Contents 
1 
2 
2.3 
1.1 
2.2.1 
2.2.2 
2.2.3 
INTRODUCTION .................................................................................................................................. 2 
ZYNQ BANK PIN ASSIGNMENTS ...................................................................................................... 4 
FUNCTIONAL DESCRIPTION ............................................................................................................ 5 
2.1 
ALL PROGRAMMABLE SOC ............................................................................................................. 5 
2.2  MEMORY ......................................................................................................................................... 5 
DDR3 ...................................................................................................................................... 5 
SPI Flash ................................................................................................................................ 7 
SD Card Interface ..................................................................................................................10 
USB ...............................................................................................................................................11 
USB OTG ...............................................................................................................................11 
USB-to-UART Bridge ............................................................................................................11 
USB-JTAG .............................................................................................................................12 
USB circuit protection ...........................................................................................................13 
DISPLAY AND AUDIO ......................................................................................................................13 
HDMI Output .........................................................................................................................13 
VGA Connector......................................................................................................................16 
I2S Audio Codec ....................................................................................................................17 
OLED .....................................................................................................................................18 
CLOCK SOURCES .............................................................................................................................18 
RESET SOURCES .............................................................................................................................18 
2.3.1 
2.3.2 
2.3.3 
2.3.4 
2.4.1 
2.4.2 
2.4.3 
2.4.4 
2.5 
2.6 
2.4 
2.7 
2.8 
2.9 
2.10.1 
2.9.1 
2.9.2 
2.9.3 
2.7.1 
2.7.2 
2.7.3 
2.6.1 
2.6.2 
2.6.3 
Power‐on Reset (PS_POR_B) ................................................................................................18 
Program Push Button Switch .................................................................................................19 
Processor Subsystem Reset ....................................................................................................19 
USER I/O ........................................................................................................................................19 
User Push Buttons .................................................................................................................19 
User DIP Switches .................................................................................................................19 
User LEDs .............................................................................................................................20 
10/100/1000 ETHERNET PHY ........................................................................................................20 
EXPANSION HEADERS ....................................................................................................................21 
LPC FMC Connector .............................................................................................................21 
Digilent Pmod™ Compatible Headers (2x6).........................................................................22 
Agile Mixed Signaling (AMS) Connector, J2 .........................................................................23 
2.10  CONFIGURATION MODES ................................................................................................................26 
JTAG ......................................................................................................................................27 
2.11  POWER ...........................................................................................................................................28 
2.11.1 
Primary Power Input .............................................................................................................28 
2.11.2  On/Off Switch ........................................................................................................................28 
2.11.3 
Regulators ..............................................................................................................................28 
Sequencing .............................................................................................................................29 
2.11.4 
Power Good LED ..................................................................................................................30 
2.11.5 
Power Estimation ..................................................................................................................30 
2.11.6 
2.11.7 
Testing ...................................................................................................................................31 
2.11.8 
Probes ....................................................................................................................................31 
ZYNQ-7000 AP SOC BANKS .............................................................................................................32 
ZYNQ-7000 AP SOC BANK VOLTAGES ..........................................................................................33 
4 
JUMPER SETTINGS ............................................................................................................................34 
5  MECHANICAL ....................................................................................................................................36 
6  REVISION HISTORY ..........................................................................................................................37 
 
3.1 
3 
 
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27-Jan-2014 
 
Introduction 
1 
The ZedBoard is an evaluation and development board based on the Xilinx ZynqTM-7000 All 
Programmable SoC (AP SoC). Combining a dual Corex-A9 Processing System (PS) with 85,000 
Series-7 Programmable Logic (PL) cells, the Zynq-7000 AP SoC can be targeted for broad use in 
many applications.  The ZedBoard’s robust mix of on-board peripherals and expansion 
capabilities make it an ideal platform for both novice and experienced designers. The features 
provided by the ZedBoard consist of:  
 
•  Xilinx® XC7Z020-1CLG484C Zynq-7000 AP SoC 
o  Primary configuration = QSPI Flash 
o  Auxiliary configuration options 
  Cascaded JTAG 
  SD Card 
•  Memory 
• 
Interfaces 
o  512 MB DDR3 (128M x 32) 
o  256 Mb QSPI Flash  
o  USB-JTAG Programming using Digilent SMT1-equivalent circuit  
  Accesses PL JTAG 
  PS JTAG pins connected through PS Pmod 
•  On-board Oscillators 
•  Display/Audio 
o  10/100/1G Ethernet  
o  USB OTG 2.0 
o  SD Card 
o  USB 2.0 FS USB-UART bridge 
o  Five Digilent Pmod™ compatible headers (2x6) (1 PS, 4 PL) 
o  One LPC FMC 
o  One AMS Header 
o  Two Reset Buttons (1 PS, 1 PL) 
o  Seven Push Buttons (2 PS, 5 PL) 
o  Eight dip/slide switches (PL) 
o  Nine User LEDs (1 PS, 8 PL) 
o  DONE LED (PL) 
o  33.333 MHz (PS) 
o  100 MHz (PL) 
o  HDMI Output 
o  VGA (12-bit Color) 
o  128x32 OLED Display 
o  Audio Line-in, Line-out, headphone, microphone 
o  On/Off Switch 
o  12V @ 5A AC/DC regulator 
o 
o  License voucher for ChipScope™ Pro locked to XC7Z020 
ISE® WebPACK Design Software 
 
•  Power 
•  Software 
 
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27-Jan-2014 
 
 
 
Flash
QSPI
Pmod
Gbit
Enet
USB
OTG
SD
USB
UART
1 LED,
2 buttons
PHY
PHY
USB
Cont
7
8
14
12
8
2
3
QSPI
ENET/
MDIO
USBOTG
SD
)
I
O
M
(
 
O
/
I
 
d
e
x
e
p
l
i
t
l
USBUART
u
M
PS_GPIO
512Mbyte 
DDR3 (x32) 
DDR3
71
DDR
)
S
P
(
 
m
e
Reset
33Mhz
Clk
1
1
PS_RST
PS_CLK
i
 
t
s
y
S
g
n
s
s
e
c
o
r
P
PMOD
FMC
GPIO
I2S/ACD
HDMI
VGA
OLED
DONE
PROG
)
L
P
i
(
 
c
g
o
L
 
l
e
b
a
m
m
a
r
g
o
r
P
GPIO/VP/VN
JTAG
GCLK
32
82
21
8
27
10
5
1
1
8
4
1
Pmods
FMC-LPC
GPIO (8 LEDs,
8 slide switches,
5 pushbuttons)
HdPhn Out
Line Out
Line In
MIC In
Type A
HDMI Out
VGA (12-
bit color)
I2S Audio
Codec
HDMI 
transmitter
128x32 OLED
Display
DONE LED
PROG
XADC
Primary JTAG
100Mhz
USB
Cont
Clk
ZYNQ XC7Z020-CLG484
 
 
Figure 1 – ZedBoard Block Diagram 
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27-Jan-2014 
 
1.1  Zynq Bank Pin Assignments 
The following figure shows the Zynq bank pin assignments on the ZedBoard followed by a table 
that shows the detailed I/O connections. 
 
 
Figure 2 - Zynq Z7020 CLG484 Bank Assignments 
 
 
 
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27-Jan-2014 
 
 
 
2  Functional Description 
2.1  All Programmable SoC 
The ZedBoard features a Xilinx Zynq XC7Z020-1CLG484 All Programmable SoC (AP SoC).  
Initial ZedBoards were marked ‘Rev C’ and shipped with Engineering Sample "CES" grade 
silicon. Later ‘Rev D’ shipments switched to production "C" grade silicon once those became 
available. The Zynq-7000 AP SoC part markings indicate the silicon grade. 
2.2  Memory 
Zynq contains a hardened PS memory interface unit.  The memory interface unit includes a 
dynamic memory controller and static memory interface modules.  
 
2.2.1  DDR3 
The ZedBoard includes two Micron DDR3 128 Megabit x 16 memory components creating a 32-
bit interface, totaling 512 MB. 
 
Earlier ZedBoards used Micron MT41J128M16HA-15E:D, but  
 
As of August 2012, this device has been marked by Micron for end-of-life.  There are several 
options that Micron offers for a replacement.  ZedBoard will likely migrate to the 
MT41K128M16JT-125 device, although this is pending validation.  The DDR3 is connected to the 
hard memory controller in the Processor Subsystem (PS) as outlined in the Zynq datasheet. 
 
The multi-protocol DDR memory controller is configured for 32-bit wide accesses to a 512 MB 
address space.  The PS incorporates both the DDR controller and the associated PHY, including 
its own set of dedicated I/Os. DDR3 memory interface speeds up to 533MHz (1066Mbs) are 
supported. 
 
The DDR3 uses 1.5V SSTL-compatible inputs.  DDR3 Termination is utilized on the ZedBoard.  
The Zynq-7000 AP SoC and DDR3 have been placed close together keeping traces short and 
matched. 
 
DDR3 on the PS was routed with 50 ohm targeted trace impedance for single-ended signals, and 
DCI resistors (VRP/VRN) as well as differential clocks set to 80 ohms.  Each DDR3 chip needs its 
own 240-ohm pull-down on ZQ. The Xilinx Zynq-7000 All Programmable SoC PCB Design and 
Pin Planning Guide (UG933) recommends using 40 ohm trace impedance for DDR3 single-ended 
signals, so designers looking to duplicate the ZedBoard design may want consider this in their 
own board design. See the appropriate ZedBoard Errata document for more details. 
 
DDR-VDDQ is set to 1.5V to support the DDR3 devices selected.  DDR-VTT is the termination 
voltage which is ½ DDR-VDDQ.  DDR-VREF is a separate buffered output that is equal to ½ 
nominal DDR-VDDQ.  The DDR-VREF is isolated to provide a cleaner reference for the DDR 
level transitions. 
 
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27-Jan-2014 
 
Signal Name 
DDR_CK_P 
DDR_CK_N 
DDR_CKE 
DDR_CS_B 
DDR_RAS_B 
DDR_CAS_B 
DDR_WE_B 
DDR_BA[2:0] 
DDR_A[14:0] 
DDR_ODT 
DDR_RESET_B 
DDR_DQ[31:0] 
DDR_DM[3:0] 
DDR_DQS_P[3:0] 
DDR_DQS_N[3:0] 
DDR_VRP 
DDR_VRN 
Description 
 Differential clock 
output 
 Differential clock 
output 
 Clock enable 
 Chip select 
 RAS row address 
select 
 RAS column address 
select 
 Write enable 
 Bank address 
 Address 
 Output dynamic 
termination 
 Reset 
 I/O Data 
 Data mask 
 I/O Differential data 
strobe 
 I/O Differential data 
strobe 
 I/O Used to calibrate 
input termination 
 I/O Used to calibrate 
input termination 
 I/O Reference 
voltage 
Zynq pin 
N4 
N5 
V3 
P6 
R5 
P3 
R4 
PS_DDR_BA[2:0] 
PS_DDR_A[14:0] 
P5 
F3 
DDR3 pin 
J7 
K7 
K9 
L2 
J3 
K3 
L3 
BA[2:0] 
A[14:0] 
K1 
T2 
PS_DDR_[31:0] 
PS_DDR_DM[3:0] 
DDR3_DQ pins 
LDM/UDM x2 
PS_DDR_DQS_P[3:0] 
UDQS/LDQS 
PS_DDR_DQS_N[3:0] 
UDQS#/LDQS# 
N7 
M7 
N/A 
N/A 
The PCB design guidelines outlined in Zynq datasheet must be followed for trace matching, etc. 
 
Table 1 - DDR3 Connections 
H1 
H7, P7 
DDR_VREF[1:0] 
 
For best DDR3 performance, DRAM training is enabled for write leveling, read gate, and read 
data eye options in the PS Configuration Tool in Xilinx Platform Studio (XPS) or the IP Editor in 
Vivado. Two entries allow for DQS to Clock Delay and Board Delay information to be specified for 
each of the four byte lanes. The tools will calculate these board training details based upon 
specific trace lengths for certain DDR3 signals.  
 
The PCB lengths are contained in the ZedBoard PCB trace length reports. The DQS to CLK 
Delay and Board Delay values are calculated specific to the ZedBoard memory interface PCB 
design. The Xilinx tools allow for up to 4 memory devices to be configured for DDR3 4x8 flyby 
topology. Note that ZedBoard is configured for DDR3 2x16 flyby routing topology. The first two 
clock trace midpoint values (CLK0 and CLK1) are used to represent the Micron device electrically 
furthest from the 7Z020 (IC25) and the second two clock trace midpoint values (CLK2 and CLK3) 
are used to represent the Micron device electrically closest to the 7Z020 (IC26). The worksheet 
calculation results are shown in the following table.  
 
 
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27-Jan-2014 
 
Pin Group  Length 
(mm) 
Length 
(mils) 
 Table 2 - DDR3 Worksheet Calculations 
Package 
Length 
(mils) 
Total 
Length 
(mils) 
Propagation 
Delay 
(ps/inch) 
Total 
Delay 
(ns) 
DQS to 
CLK 
Delay 
(ns) 
Board 
Delay 
(ns) 
 
 
 
 
 
 
 
 
0.410 
0.411 
0.341 
0.358 
 
 
 
 
 
 
 
 
0.025 
0.028 
-0.009 
-0.061 
160 
160 
160 
160 
160 
160 
160 
160 
160 
160 
160 
160 
470 
470 
470 
470 
504 
495 
520 
835 
465 
480 
550 
780 
0.427 
0.427 
0.336 
0.336 
0.402 
0.399 
0.345 
0.398 
0.393 
0.396 
0.346 
0.380 
2195.9 
2195.9 
1631.1 
1631.1 
2008.0 
1998.8 
1637.6 
1649.4 
1993.3 
1996.4 
1609.9 
1597.8 
2665.9 
2665.9 
2101.1 
2101.1 
2512.0 
2493.8 
2157.6 
2484.4 
2458.3 
2476.4 
2159.9 
2377.8 
55.77 
CLK0 
55.77 
CLK1 
41.43 
CLK2 
41.43 
CLK3 
51.00 
DQS0 
50.77 
DQS1 
41.59 
DQS2 
41.90 
DQS3 
50.63 
DQ[7:0] 
50.71 
DQ[15:8] 
DQ[23:16]  40.89 
DQ[31:24]  40.58 
 
 
The DQS to CLK Delay fields in the PS7 DDR Configuration window should be populated using 
the corresponding values from the previous table.  
 
The configuration fields of the tool may not allow you to input a negative delay value, this is a 
known problem with the 14.1 tools and scheduled for correction in the 14.2 tools release. In the 
case of DQS2 and DQS3 fields for DQS to CLK Delay, simply enter a value of zero rather than 
the negative delay values. This is an acceptable workaround since the calculated values are 
relatively close to zero and the values provided in these fields are used as initial values for the 
read/write training for DDR3. Keep in mind for LPDDR2 there is no write leveling, and for DDR2 
there is no training whatsoever. In these memory use cases, the accuracy of the trace length info 
is more important. This is covered in further detail in section 10.6.8 of the Xilinx Zynq TRM, 
UG585. 
 
Figure 3 - DQS to Clock Delay Settings 
 
The Board Delay fields in the PS7 DDR Configuration window should be populated using the 
corresponding values from the table above.  
 
 
Figure 4 - DDR3 Board Delay Settings 
 
2.2.2  SPI Flash 
The ZedBoard features a 4-bit SPI (quad-SPI) serial NOR flash. The Spansion S25FL256S is 
used on this board.  The Multi-I/O SPI Flash memory is used to provide non-volatile code, and 
data storage.   It can be used to initialize the PS subsystem as well as configure the PL 
subsystem (bitstream). Spansion provides Spansion Flash File System (FFS) for use after 
booting the Zynq-7000 AP SoC. 
 
 
7 
27-Jan-2014