SX9325
Ultra Low Power, Smart Proximity Sensor for SAR 
 
 
  Active Mode:  
  Doze Mode:  
  Sleep Mode:  
ammable Interrupt or R
  2 Sub-Addresses Selectable by Pin. 
Addresses Selectable by P
ddresses Selectable by P
able Interrupt or
o Reset Sources: POR
o Reset Sources: POR
-40°C to +85°C Operat
40°C to +85°C Opera
-40°C to +85°C Operation 
Compact Size: 0.92
Compact Size: 0.92
  Programmable Interrupt or Real-Time Status pin 
set 
  Two Reset Sources: POR, Soft Reset 
 
m WLCSP package 
LCSP package 
  Compact Size: 0.92 x 1.69 mm WLCSP package 
 Pb & Halogen F
S/WEEE compliant 
  Pb & Halogen Free, RoHS/WEEE compliant 
Status pi
  Capacitance Resolution down to 0.004fF 
004fF 
on up to 200pF 
n up to 200pF 
  Capacitance Offset Compensation up to 200pF 
pensation 
ensation 
  Advanced Temperature Compensation 
KEY PRODUCT FEATURES
  ~1.8V  Input Supply Voltage 
  Up to 3 Capacitive Sensor Inputs  
  Automatic Calibration 
  Ultra Low Power Consumption 
sumption on
22 uA 
22 uA A 
6 uA uA 
6 uA 
1.75 uA 
5 uA 
1.75 uA 
  400kHz I2C Serial Interface  
Serial Interface  
Interface  
 
WIRELESS & SENSING                                                                 
 
GENERAL DESCRIPTION
The SX9325 is a capacitive Specific Absorption Rate (SAR) 
controller.  
The  SX9325  can  use  any  of  its  three  sensor  inputs.  The 
resulting  detection  is  used  in  portable  electronic  devices  to 
reduce  and  control  radio-frequency  (RF)  emission  power  in 
the  presence  of  a  human  body,  enabling  significant 
performance  advantages  for  manufacturers  of  electronic 
devices  with  electro-magnetic  radiation  sources  to  meet 
stringent  emission 
regulations'  criteria  and  Specific 
Absorption Rate (SAR) standards.   
Operating directly from an input supply voltage of 1.7 to 2V, 
the SX9325 outputs its data via I2C serial bus. The I2C serial 
communication bus port is compatible with 1.8V host control 
to report body detection/proximity and to facilitate parameter 
settings  adjustment.    Upon  proximity  detection,  the  NIRQ 
output  asserts,  enabling  the  user  to  either  determine  the 
relative  proximity  distance, or  simply  obtain  an indication  of 
detection.   
The  SX9325  includes  an  on-chip  auto-calibration  controller 
r 
that  regularly  performs  sensitivity  adjustments  to  maintain 
tain 
peak  performance  over  a  wide  variation  of  temperature, 
ature, 
humidity  and  noise  environments,  providing  simplified 
implified 
ied 
product development and enhanced performance. 
 
Confidential 
Only Status pin 
S/WEEE compliant On
b & HalogennfAPPLICATIO
o
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tekrt NumbeekSX9325ICSTRT 
SX9325rtert1 3000 Units/reel
SX9325ICSTRT 1teSX9325EV
Semtech 
echCIRCUIT
00 Units/reeloer
GoeoeooGoGo
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FoFF
Package Marking
WLCSP-8 
T8CS 
Eval. Kit 
  Mobile Phones 
  Mo
  Mo
 
  
  Notebooks 
Tablets 
Part Number 
SX9325ICSTRT 1 
SX9325EVKA 
TYPICAL APPLICATION CIRCUIT
1 3000 Units/reel 
 
APPLICATIONS
ORDERING INFORMATION
- 
Revision 1       October 12, 2017 
 
© Semtech 
1 
 
www.semtech.com 
 
 
WIRELESS & SENSING
 
SX9325
Ultra Low Power, Smart Proximity Sensor for SAR 
 
Table of Contents 
......
.............................
.........................
..............................
..................
........................
.................
1.1
1.2
1.3
2.1
2.2
2.3
2.4
3.1
3.2
3.3
Pin Diagram 
Marking Information 
Pin Description 
Introduction 
Scan Period 
Analog Front-End (AFE) 
Absolute Maximum Ratings 
Operating Conditions 
Thermal Characteristics 
Electrical Specifications 
.................
..............................
.........................
.............................
......................
.................
.............................
Confidential ..............
Only44
Goertek ....
Semtech B
For es 
GENERAL DESCRIPTION .......................................................................................................................... 1
KEY PRODUCT FEATURES ....................................................................................................................... 1
...................... 1
............... 1
APPLICATIONS ......................................................................................................................................... 1
........................ 1
...........
ORDERING INFORMATION ........................................................................................................................ 1
TYPICAL APPLICATION CIRCUIT .............................................................................................................. 1
GENERAL DESCRIPTION ................................................................................................................. 4
1
4
4
44
5
55
ELECTRICAL CHARACTERISTICS ................................................................................................... 6
....................... 6
........... 6
6
66
6
6
6
6
7
PROXIMITY SENSING INTERFACE ................................................................................................... 9
9
9
10
10
12
12
12
12
13
13
13
15
15
16
18
18
19
20
3.6.1
3.6.13.6.1
20
3.6.2
3.6.23.6.2
20
3.6.3
3.6.36.3
20
I2C INTERFACE ............................................................................................................................. 21
I2CI2C
21
21
21
RESET ........................................................................................................................................... 23
23
23
INTERRUPT .................................................................................................................................... 24
24
24
REGISTERS ................................................................................................................................... 25
www.semtech.com 
 
Digital Processing 
rocessing ng 
Overview 
erview ew 
PROXRAW Update 
PROXRAW Update 
PROXRAW Update 
PROXUSEFUL Update 
PROXUSEFUL Up
PROXUSEFUL 
PROXAVG Update 
PROXAVG Upd
ROXAVG Upd
PROXDIFF Update 
PROXDIFF U
PROXDIFF
PROXSTA
PROXSTAT Update 
PROXSTA
Host Operation 
Host Opera
Host Opera
Operational Modes 
Operatio
Operati
Capacitive Sensing Basics 
am 
AFE Block Diagram 
Capacitance-to-Voltage Conversion (C-to-V) 
o-Voltage Co
-Voltage C
V) 
Shield Control 
ol 
Offset Compensation 
mpensation 
ation 
Analog-to-Digital Conversion (ADC) 
)
to-Digital Conversio
Active 
A
Doze 
Sleep 
FACE ...................
.............
FACE
Introduction 
duction 
duction 
I2C Write 
te te 
I2C Read 
7
Revision 1       October 12, 2017 
 
3.3.1
3.3.2
3.3.3
3.3.4
3.3.5
3.3.6
3.4.1
3.4.2
3.4.3
3.4.4
3.4.5
4.5
3.4.6
3.4.6
Power-up 
Assertion and Clearing 
4.1
4.4
4.2
4.3
5.1
5.2
6.1
6.2
Power-up 
Software Reset 
3.4
3.5
3.5
3.6
3.6
© Semtech 
2 
 
2
3
4
44
5
6
sio
gital Conve
 
WIRELESS & SENSING
8
8.1
8.2
9.1
9.2
9
 
SX9325
Ultra Low Power, Smart Proximity Sensor for SAR 
 
Outline Drawing 
Land Pattern 
Typical Application Circuit 
External Components Recommended Values 
APPLICATION INFORMATION ........................................................................................................ 40
40
40
PACKAGING INFORMATION .......................................................................................................... 41
................... 41
............ 4
41
4141
42
44
Semtech Confidential 40
For Goertek Only
Revision 1       October 12, 2017 
 
© Semtech 
3 
 
www.semtech.com 
 
SX9325
Ultra Low Power, Smart Proximity Sensor for SAR 
 
 
 
WIRELESS & SENSING
1  GENERAL DESCRIPTION
1.1  Pin Diagram 
Confidential 
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1.2  Marking Information 
rking Information
Information
Figure 1: Pin Diagram
Figure 1: Pin Diagram
Pin Diagr
 
 
Figure 2: Marking Information  
Revision 1       October 12, 2017 
 
© Semtech 
4 
 
www.semtech.com 
 
Digital Input 
SDA 
NIRQ 
Digital Input/Output 
Digital Input/Output 
 
 
 
SX9325
Ultra Low Power, Smart Proximity Sensor for SAR 
 
Number 
put or I2C Sub-Address
2C Sub-Addre
Table 1: Pin Description
ription
A2 
A4 
A3 
B4 
B3 
A1 
B1 
B2 
Type
Power 
Ground 
Analog 
Analog 
Analog 
I2C Data, requires pull-up resistor. 
Interrupt Output and Pause Input, requires pull-up resistor. 
 Pause Input, requ
 
WIRELESS & SENSING
 
1.3  Pin Description 
Name 
VDD 
GND 
CS0 
CS1 
CS2 
SCL 
Description
Power Supply, requires decoupling capacitor. 
Ground 
Secondary Capacitive Sensor Input 
Primary Capacitive Sensor Input 
Primary Capacitive Sensor Input or I2C Sub-Address Input. 
p resistor.  
I2C Clock, requires pull-up resistor.  
ause Input, requdential alllalalial
tiati
rnt
stor.  enull-up resistor. 
up resistor. den
de
Semtech Confideanda
stor. lyynlyyy
For Goertek Onlyyyp resistor. 
fidscription
Revision 1       October 12, 2017 
 
© Semtech 
5 
 
www.semtech.com 
 
SX9325
Ultra Low Power, Smart Proximity Sensor for SAR 
 
Symbol 
Table 3: Operating Conditions
Max 
2.2 
3.9 
VDD+0.3 
Min 
-0.5 
-0.5 
-0.5 
-0.5 
-10 
-40 
- 
-50 
8 
e device.  Th
s beyond the “Opera
beyond the “Opera
d periods may affect 
VDD 
VPULL 
VIN 
IIN 
TJCT 
 
TRE 
TSTOR 
ESDHBM 
Parameter 
Supply Voltage 
Pull-up Voltage 
Input Voltage (non-supply pins) 
Input Current (non-supply pins) 
Operating Junction Temperature 
Reflow Temperature 
Storage Temperature 
ESD HBM (ANSI/ESDA/JEDEC JS-001) 
 
WIRELESS & SENSING
2  ELECTRICAL CHARACTERISTICS
2.1  Absolute Maximum Ratings 
Stresses above the values listed in “Absolute Maximum Ratings” may cause permanent damage to the device.  This is 
a stress rating only and functional  operation  of the device at these, or any other conditions beyond the “Operating 
Conditions”, is not implied.  Exposure to Absolute Maximum Rating conditions for extended periods may affect device 
reliability and proper functionality. 
CCCConfidentiall to the device.  This
periods may affect ntntntintiMax ttia
nt-0.5 
2.22ntntnt
ent
den-0.5 
-0.5 enenen
-0.5 dddeeede-10 
-10 ddde
OnlyV V y3 3yylyy10 
260Onlynlyy
mA mA lylylyynlyy125 25 
°C nlynlynlyynlyy
Ony
fidTTJCTJ
-40-4fidfidfidfidTTRERE  fidfidfidfid
150 15OOOnnOn- - OOOOOO
TTSTORSTO  nfifififESDE
HBMBM nf
ooon: Absolute Maximum
Goertek gs
tek
tetek
tekMinekek
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lute MaximumCC
 teteteteTTA Arteteterttetperating Conditions
Semtech hhhh Ta
mteermtemtemtThermal Resistance –
GoGoGoGtic Airflow) 
mal Resistance –mtmNote: 
tic Airflow) GGle
For o Arfrom a package in s
Note: JA is calculated from a package in still air, mounted to 3" x 4.5", 4-layer FR4 PCB per JESD51 standards.   
ote: JAA is c
Note:  VDD  and  VPULL  are  fully  independent,  i.e.  can  be  turned  ON/OFF  separately  and  in  any  sequence  without 
creating any leakage current. 
age current. 
urrent. 
ULL  are  fully  indepen
fully  indepe
Parameter
Thermal Resistance – Junction to Air  (Static Airflow) 
VDD 
TA 
ting Condit
e.  can  be  turned  ON
e  turned  ON
Parameter 
Supply Voltage  
Ambient Temperature 
2.3  Thermal Characteristics 
rmal Characteris
Characteris
2.2  Operating Conditions 
Table 2: Absolute Maximum Ratings
Unit 
V 
mA 
°C 
kV 
Unit 
V 
°C 
10 
125 
260 
260 
150 
- 
Max 
2 
85 
Table 4: Thermal Characteristics 
Symbol
JA 
Typical 
120 
Unit
°C/W 
Symbol 
Min 
1.7 
1
-40 
 isAA
a package in
Revision 1       October 12, 2017 
 
© Semtech 
6 
 
www.semtech.com 
 
SX9325
Ultra Low Power, Smart Proximity Sensor for SAR 
 
 
Min 
1.75 
1.75 
IACTIVE 
Doze  
Active  
ISLEEP 
IDOZE 
+/-1.325 
CRANGEL 
CRANGEH 
6 
6 
22 
Typ. 
Max 
Unit 
- 
- 
- 
- 
5 
14 
1
45 
Measurement Range 
AGAIN=1000, 
GAIN01/23=001 
Symbol  Conditions 
Power down. (I2C listening) 
PHEN = 0000 
Capacitive Sensing Interface  
SCANPERIOD = 30ms
FREQ = 100kHz 
RESOLUTION = 64 
PHEN = 0001
SCANPERIOD = 400ms
FREQ = 100kHz 
RESOLUTION = 64 
PHEN = 0001
E01/23 = 
ARANGE01/23 = 
mall 
0/Small 
ARANGE01/23 =
NGE01/23 =
1/Large 
1/Large 
Parameter 
Current Consumption 
Sleep  
(no phase enabled) 
 
WIRELESS & SENSING
2.4  Electrical Specifications 
All values are valid within the full operating conditions unless otherwise specified. 
Typical values are given for TA= +25°C, VDD=1.8V unless otherwise specified.  
Confidentialalalax alal Unitalal
tialal
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6 ntintinti
ent
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Onlyy
pnlynlynlyy
fidNGE01/23 = 
- fidfidfidfidARANGE01/23 =
- OOOnnnOOn16 
LargenfifififinGAIN=0110, 
16 OOOOOO04 
4OOOO
0/Small malooon
CoARANARAN
1/LCoCoCCo
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0.kkkek4.63 
4.63 eeekkk
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Q01/23CC
*teteterte
Semtech TTSCANSCAN
D = 1.8V.ertrtrtrt
SCASChchencies s FFTrim
ArccchhhchFrequencies 
Tempecececec& Scan Frequencies 
+25°C, Full VDGoe
nge, VDD = 1.8VeAround Trim Result. 
asurement  Phamte
pendency cyteeeernal DC Cap. to Groun
GGGGoGGGLG
eemuts: SDA, NmeOutput Low Cu
Output Low CeemeSeSeSeSeInputs: SSeSeInput 
InSeSeSe
ForrIOL04OL04 rIIOL06OL06  ooror
ForNIRorge ge 
VIHIH  Fooooge ge 
VFoooo
InInSSS
ent ent FF
rogrammable 
rogrammable
Programmable with 
EQ01/23 
FREQ01/23 
Programmable with 
P
h 
SCANPERIOD 
Around Nominal Values. 
inal Values. 
Values.
TA = +25°C, VDD = 1.8V.
C, VDD = 1.8V.
Around Trim Result. 
d Trim Result. 
m Result. 
Full TA range, VDD = 1.8V. 
 TA range, VDD = 1.8V
Around Trim Result
Around Trim Result. 
TA = +25°C, Full VDD range. 
TTA = +25°C, Full VD
Sampling & Scan Frequencies 
Trim Accuracy
uencies 
Sampling & Scan Frequencies 
Temperature Dependency 
ependency 
enc
Sampling & Scan Frequencies 
an Frequencies 
VDD Dependency 
External DC Cap. to Ground 
C Cap. to Groun
per Measurement  Phase
er Measurement  Phase
Outputs: SDA, NIRQ 
ARANGE01/
ANGE01
ARANGE01/23 = 
0/Small 
ARANGE01/23 = 
1/Large 
Nominal Sampling 
Frequencies 
VOL  0.32V 
VOL  0.6V 
VIH 
VIL 
IL 
VHYS 
Measurement Resolution 
AGAIN=0110, 
GAIN=01
GAIN01/23=100 
GAIN01/23=100 
GAIN01/23=100 
Nominal Scan Periods 
Output Low Current  
-
- 
- 
- 
- 
- 
- 
IOL04 
IOL06 
- 
- 
- 
- 
- 
- 
- 
- 
-
- 
%
% 
% 
- 
- 
- 
- 
- 
- 
0.04 x VDD 
-0.5 
-1 
V 
uA 
V 
pF 
pF 
pF 
bits 
- 
- 
- 
- 
NBIT 
CRESL 
- 
- 
-
3 
6 
0.7 x VDD 
FTrim
FFTemp
FTemp
FVDD 
kHz 
ms 
0.004 
0.008 
0.0
0.3 x VDD 
250 
4000 
200
pF
+/-1 
+/-0.6 
+/-2.65 
+/-2.65 
+/-2.65 
16 
CRESH 
FS 
TSCAN 
3.6 
1 
- 
4.63 
-* 
-4
- 
- 
-
uA 
fF 
fF 
CDC
mA 
+4
  
 
 
 
 
 
Inputs: SCL, SDA, NIRQ 
Input High Voltage 
Input Low Voltage 
Input Leakage Current 
Hysteresis  
Miscellaneous 
Power-up Time 
TPOR 
- 
- 
1 
ms 
    * Min is achieved when SCANPERIOD=00000 and determined by the total measurement time. 
   
 
Table 5: Electrical Specifications
Revision 1       October 12, 2017 
 
© Semtech 
7 
 
www.semtech.com 
 
 
WIRELESS & SENSING
 
 
Parameter 
I2C Timing Specifications (Cf. figure below)
SCL clock frequency 
fSCL 
SCL low period 
SCL high period 
Data setup time 
Data hold time 
Repeated start setup time 
Start condition hold time 
Stop condition setup time 
Bus free time between stop and start  
Data valid time 
Data valid acknowledge time 
Input glitch suppression 
 
 
Note 1: Minimum glitch amplitude is 0.7VDD at High level and Maximum 0.3VDD at Low level. 
tSP 
SX9325
Ultra Low Power, Smart Proximity Sensor for SAR 
- 
- 
- 
0.1 
0 
0 
1.3 
0.6 
400 
- 
- 
- 
- 
- 
- 
- 
- 
- 
kHz 
kHz 
- 
- 
- 
- 
tLOW 
tHIGH 
Max
Min 
Typ 
Unit 
 
 
 
 
 
 
 
 
 
 
 
tSU;STA 
tHD;STA 
tSU;DAT 
tHD;DAT 
Symbol 
Conditions 
Confidential llllll400 
kHz lallal- - ialalal
ntia
tia- 
- - tititiaa
- ntintintinti
- - ntntnt
en0.6 
- eeennn
de0.6 0.6 dddeeeide0.6 idfidideee
Onlyus yyy-  ylyylyy- - lynlyynlyy
- OOOnlynlyy
Ony
fid1.fidfidfidfid
0OOOnnOOn
 nfififif  onoNote 1 1 oCoon
0OOOOOO 50OOOO
CoCoCovel and Maximum 0.3V
rtek - - kkkk. 
el and Maximum 0.3VDD
Table 6: I2C Timing Specifications 
able 6: I2C Timin
ifications 
ions 
ble 6: I2C Tim
Note 1 
tVD;ACK 
tSU;STO 
tVD;DAT 
- 
- 
- 
- 
 
- 
- 
- 
- 
- 
- 
- 
tBUF 
- 
- 
- 
- 
- 
- 
- 
0.9 
0.9 
0.6 
6 
0.6 
0.6 
1.3 
0.9 
0.9 
50 
ns 
us 
Figure 3: I2C Timing
 
Revision 1       October 12, 2017 
 
© Semtech 
8 
 
www.semtech.com