Rockchip RK809 Datasheet V1.4 20190618.pdf

发布时间：2022-05-30 发布人：admin 分类：说明书资料大小：4.45M 资料格式：pdf 举报版权申诉

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Table of Content

Figure Index

Table Index

Warranty Disclaimer

Chapter 1 Introduction

1.1 Overview

1.2 Feature

1.3 Typical Application Diagrams

Chapter 2 Package information

2.1 Ordering information

2.2 Top Marking

2.3 Dimension

2.4 Pin Assignment

2.5 Pinout Number Order

Chapter 3 Electrical Characteristics

3.1 Absolute Maximum Ratings

3.2 Recommended Operating Conditions

3.3 DC Characteristics

Chapter 4 Function Description

4.1 Top State Machine

4.1.1 State Machine Description

4.1.2 Power on Description

4.1.3 Power down Description

4.1.4 Reset Description

4.1.5 Power Sequence Description

4.1.6 Sleep Description

4.2 Power Channels

4.2.1 Buck Description

4.2.2 LDO Description

4.3 Battery Gas Gauge

4.4 Audio System

4.4.1 General Description

4.4.2 Audio Recording Path Description

4.4.3 Head-Phone Path Description

4.4.4 Speaker Path Description

4.4.5 I2S Description

4.5 Others

4.5.1 Real Time Clock (RTC) Description

4.5.2 RC Oscillator Description

Chapter 5 Register Description

5.1 Register Summary

5.2 Register Description

Chapter 6 Thermal Management

6.1 Overview

6.2 Package Thermal Characteristics

RK809 Datasheet Rev 1.4 Date Revision Description Revision History 2019-6-18 2019-02-15 2018-12-29 2018-8-28 2018-4-2 1.4 1.3 1.2 1.1 1.0 Update the header Add more detail description. RK809-1 LDO1 power up sequence modification Spec change @ power up sequence Initial release Copyright ©2019 Fuzhou Rockchip Electronics Co., Ltd. 2

RK809 Datasheet Rev 1.4 Table of Content Table of Content .................................................................................................. 3 Figure Index ....................................................................................................... 5 Table Index 6 Warranty Disclaimer ............................................................................................. 7 Chapter 1 Introduction ....................................................................................... 8 1.1 Overview ............................................................................................. 8 1.2 Feature ................................................................................................ 9 1.3 Typical Application Diagrams ................................................................ 10 Chapter 2 Package information ........................................................................... 12 2.1 Ordering information ........................................................................... 12 2.2 Top Marking ....................................................................................... 12 2.3 Dimension .......................................................................................... 13 2.4 Pin Assignment ................................................................................... 14 2.5 Pinout Number Order ........................................................................... 14 Chapter 3 Electrical Characteristics ...................................................................... 17 3.1 Absolute Maximum Ratings .................................................................. 17 3.2 Recommended Operating Conditions ..................................................... 17 3.3 DC Characteristics ............................................................................... 17 Chapter 4 Function Description ........................................................................... 24 4.1 Top State Machine ............................................................................... 24 4.1.1 State Machine Description .................................................................... 24 4.1.2 Power on Description ........................................................................... 24 4.1.3 Power down Description ....................................................................... 25 4.1.4 Reset Description ................................................................................ 26 4.1.5 Power Sequence Description ................................................................. 28 4.1.6 Sleep Description ................................................................................ 30 4.2 Power Channels .................................................................................. 30 4.2.1 Buck Description ................................................................................. 30 4.2.2 LDO Description .................................................................................. 33 4.3 Battery Gas Gauge .............................................................................. 33 4.4 Audio System ..................................................................................... 35 4.4.1 General Description ............................................................................. 35 4.4.2 Audio Recording Path Description .......................................................... 36 4.4.3 Head-Phone Path Description ................................................................ 36 Copyright ©2019 Fuzhou Rockchip Electronics Co., Ltd. 3

RK809 Datasheet Rev 1.4 4.4.4 Speaker Path Description ..................................................................... 37 4.4.5 I2S Description ................................................................................... 38 4.5 Others ............................................................................................... 38 4.5.1 Real Time Clock (RTC) Description ......................................................... 38 4.5.2 RC Oscillator Description ...................................................................... 38 Chapter 5 Register Description ............................................................................ 39 5.1 Register Summary .............................................................................. 39 5.2 Register Description ............................................................................ 44 Chapter 6 Thermal Management ....................................................................... 116 6.1 Overview .......................................................................................... 116 6.2 Package Thermal Characteristics .......................................................... 116 Copyright ©2019 Fuzhou Rockchip Electronics Co., Ltd. 4

RK809 Datasheet Rev 1.4 Figure Index Fig. 1-1 RK809 Typical Application Diagram for no battery .................................... 10 Fig. 1-2 RK809 Typical Application Diagram for two battery .................................. 11 Fig. 2-1 QFN687mm X 7mm ............................................................................. 13 Fig. 2-2 Pin Assignment QFN7x7-68(Pitch=0.35mm) ........................................... 14 Fig. 4-1 State Machine .................................................................................... 24 Copyright ©2019 Fuzhou Rockchip Electronics Co., Ltd. 5

RK809 Datasheet Rev 1.4 Table Index Table 4-1 RK809-1 Power up/down sequence(x:BUCK3 voltage determined by external divided resistor) ........................................................................................ 28 Table 6-1 Thermal Resistance Characteristics .................................................... 116 Copyright ©2019 Fuzhou Rockchip Electronics Co., Ltd. 6

RK809 Datasheet Rev 1.4 Warranty Disclaimer Rockchip Electronics Co.,Ltd makes no warranty, representation or guarantee (expressed, implied, statutory, or otherwise) by or with respect to anything in this document, and shall not be liable for any implied warranties of non-infringement, merchantability or fitness for a particular purpose or for any indirect, special or consequential damages. Information furnished is believed to be accurate and reliable. However, Rockchip Electronics Co., Ltd assumes no responsibility for the consequences of use of such information or for any infringement of patents or other rights of third parties that may result from its use. Rockchip Electronics Co., Ltd’s products are not designed, intended, or authorized for using as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Rockchip Electronics Co., Ltd’s product could create a situation where personal injury or death may occur, should buyer purchase or use Rockchip Electronics Co., Ltd’s products for any such unintended or unauthorized application, buyers shall indemnify and hold Rockchip Electronics Co., Ltd and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, expenses, and reasonable attorney fees arising out of, either directly or indirectly, any claim of personal injury or death that may be associated with such unintended or unauthorized use, even if such claim alleges that Rockchip Electronics Co.,Ltd was negligent regarding the design or manufacture of the part. Copyright and Patent Right Information in this document is provided solely to enable system and software implementers to use Rockchip Electronics Co., Ltd ’s products. There are no expressed or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Rockchip Electronics Co.,Ltd does not convey any license under its patent rights nor the rights of others. All copyright and patent rights referenced in this document belong to their respective owners and shall be subject to corresponding copyright and patent licensing requirements. Trademarks Rockchip and RockchipTM logo and the name of Rockchip Electronics Co., Ltd’s products are trademarks of Rockchip Electronics Co., Ltd. and are exclusively owned by Rockchip Electronics Co., Ltd. References to other companies and their products use trademarks owned by the respective companies and are for reference purpose only. Confidentiality The information contained herein (including any attachments) is confidential. The recipient hereby acknowledges the confidentiality of this document, and except for the specific purpose, this document shall not be disclosed to any third party. Reverse engineering or disassembly is prohibited. ROCKCHIP ELECTRONICS CO.,LTD. RESERVES THE RIGHT TO MAKE CHANGES IN ITS PRODUCTS OR PRODUCT SPECIFICATIONS WITH THE INTENT TO IMPROVE FUNCTION OR DESIGN AT ANY TIME AND WITHOUT NOTICE AND IS NOT REQUIRED TO UNDATE THIS DOCUMENTATION TO REFLECT SUCH CHANGES. Copyright ©2019 Rockchip Electronics Co., Ltd. All rights reserved. No part of this publication may be reproduced, stored in a retrieval system, or transmitted in any form or by any means, electric or mechanical, by photocopying, recording, or otherwise, without the prior written consent of Rockchip Electronics Co.,Ltd. Copyright ©2019 Fuzhou Rockchip Electronics Co., Ltd. 7

RK809 Datasheet Rev 1.4 Chapter 1 Introduction 1.1 Overview The RK809 is a complex power-management integrated circuit (PMIC) integrated CODEC for multi-core system applications powered by an external power supply. The RK809 can provide a complete power management solution with very few external components. The RK809 provides five fast load transient synchronous step-down converters. The device also contains 9 LDO regulators, two switches and a battery fuel gauge. Power- up/power-down controller is configurable and can support any customized power- up/power-down sequences (OTP based). A real-time clock (RTC) is also integrated to provide a 32.768-kHz output buffer, and real time function. The RK809 supports 32.768- kHz clock generation based on a crystal oscillator. It also includes Audio CODEC , real ground Head phone driver and ClassD driver. The RK809 integrates four channels step-down DC-DC converters. All of them adopt ripple base control to achieve very fast load transient response. Meanwhile, all of them can dynamically adjust the output voltage, as required by the processor based on the processor’s operation status so as to maximize the system efficiency. The output voltages of most channels can be configured through the I2C interface. The inputs of all channels have soft start function, which greatly reduces the inrush current at the startup. 2.5MHz switching frequency and good control method decrease the external inductance and capacitance. The RK809 also integrate a peak current mode control high efficiency buck converter, maximum current up to 2.5A, it’s usually used to power LDOs. The RK809 integrates nine channels LDO regulators. The LDO3 is high PSRR (75dB @1Khz) high accuracy low drop-out regulator. The inputs of all LDO regulators could be decrease to 2V for high convert efficiency. The output voltages of all LDO regulators can be configured through the I2C interface. A “battery fuel gauge” is integrated in the RK809. Using the proprietary algorithms and the sensed battery current and voltage, the gauge can accurately calculate the battery capacity based on the charging/discharging characteristics of the battery preloaded in the system. The gauge then sends the battery capacity information to the processor through the I2C interface. The RK809 also integrates complete audio system. The single end or differential mode Micro-phone can be connected to RK817 through two AC-couple capacitors. 24- bits ADC and gain adjustable PGA would convert the micro-phone signal to digital signal. The sound recording path has very low THD (-75dB @1KHz@580mV source). 24 bits DAC would convert digital signal to analog signal, and Class-AB driver adopt real-ground structure for Head-phone application, has very low THD (-90dB @1KHz@-3dBFS source). Meanwhile, Class-D driver integrated for speaker application. The speaker and head- phone can be used at the same time. I2S interface is integrated to communicate with processor. The RK809 is available in a QFN68 7.0 mm x 7.0 mm package, with a 0.35-mm pin pitch. Copyright ©2019 Fuzhou Rockchip Electronics Co., Ltd. 8

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Rockchip RK809 Datasheet V1.4 20190618.pdf

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