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Data Sheet V 1.1 / Feb. 2015 MSM261S4030H0 I2S digital output MEMS microphone with Multi‐modes

MSM261S4030H0 I2S digital output MEMS microphone GENERAL DESCRIPTION APPLICATIONS Mobile Phone Laptop Tablet computer Bluetooth headset Earphone Wearable intelligent equipment PRODUCT VIEW MSM26S4030H0 is an omnidirectional, bottom‐ported, I2S digital output MEMS microphone. It has high performance and reliability. MSM26S4030H0 is available in a 4 mm × 3 mm × 1.0 mm metal cap LGA package. It is SMT compatible with no sensitivity degradation. FEATURES Cost effective Low Power mode Digital I2S output Compatible with Sn/Pb and Pb‐free solder processes RoHS/Halogen free compliant Sensitivity Matching within +/‐1dB © 2011‐2015 MEMSensing Microsystems Co. Ltd, —DOC NO:DS‐035, P ENG, All rights reserved 2

MSM261S4030H0 I2S digital output MEMS microphone ABSOLUTE MAXIMUM RATINGS Parameter Supply Voltage Sound Pressure Level Mechanical Shock Temperature Range Electrostatic discharge protection SPECIFICATIONS Maximum value −0.3 to 4.0 140 10,000 −40 to 100 2 (HBM) Unit V dB SPL g °C kV All data taken at 25°C, Relative Humidity 45±5% L/R pin grounded unless otherwise specified Vdd=1.8V, clock frequency=3.072MHz Directivity Sensitivity Operation voltage Limits Nom. Omni directional ‐26 3.6 Min. ‐27 1.6 Max. ‐25 Freq. range Refer to the frequency response Sensitivity loss across supply voltage Signal to noise ratio THD PSR Current consumption Clock frequency Operating temperature Storage temperature No change across the voltage range ‐ ‐ ‐ ‐ ‐ 1.0 150 ‐40 ‐40 57 ‐ ‐ ‐72 750 400 3 ‐ ‐ ‐ ‐ 1% 10% 1000 ‐ 4.0 600 100 100 unit condition dB V Hz dB dB dBFS @1kHz 1Pa 20 kHz bandwidth, A‐weighted 100dB SPL @1kHz 120dB SPL @1kHz dBFS(A) μA μA MHz KHz °C °C Normal mode Low power mode Normal mode Low power mode © 2011‐2015 MEMSensing Microsystems Co. Ltd, —DOC NO:DS‐035, P ENG, All rights reserved 3

MSM261S4030H0 I2S digital output MEMS microphone TYPICAL FREQUENCY RESPONSE Frequency Response @94dB SPL 200 500 1K 2K 5K Frequence (Hz) 10K 20 10 0 ‐10 ‐20 100 ) a P / S F B d ( y t i v i t i s n e S LOGIC TABLE Digital Input SD Digital Output Parameter Low Voltage Input(L/R, WS, SCK) High Voltage Input(L/R, WS, SCK) Voltage Output Low Voltage Output Low Voltage Output High Voltage Output High Voltage Output Low Voltage Output Low Voltage Output High Voltage Output High Symbol Min Max Unit VIL 0 0.25 × VDD VIH 0.7 × VDD VDD VOL VOL VOH VOH VOL VOL VOH VOH 0.7 × VDD 0.9 × VDD 0.7 × VDD 0.9 × VDD 0.1 × VDD 0.3 × VDD 0.1 × VDD 0.3 × VDD V V V V V V V V V V © 2011‐2015 MEMSensing Microsystems Co. Ltd, —DOC NO:DS‐035, P ENG, All rights reserved 4

MSM261S4030H0 I2S digital output MEMS microphone TIMING DIAGRAM Parameter Description Min. tSCH tSCL tSCP fSCK tWSS tWSH fWS SCK High SCK Low SCK Period SCK Frequency WS Setup WS Hold WS Frequency — — — — — — — Norm. 50 50 325 3.072 0 20 7.8 Max. — — — — — — — Unit ns ns ns MHz ns ns kHz © 2011‐2015 MEMSensing Microsystems Co. Ltd, —DOC NO:DS‐035, P ENG, All rights reserved 5

MSM261S4030H0 I2S digital output MEMS microphone SMT Parameters： 1. Recommend PCB land pattern layout and stencil pattern：（unit: mm） © 2011‐2015 MEMSensing Microsystems Co. Ltd, —DOC NO:DS‐035, P ENG, All rights reserved 6

MSM261S4030H0 I2S digital output MEMS microphone 2. Recommend reflow profile: Description Average ramp rate Preheat Minimum temperature Maximum temperature Time(T SMIN to TSMAX) Ramp‐up rate Time maintained above liquidous temperature Liquidous temperature Peak temperature Time within 5°C of actual peak temperature Ramp‐down rate Time 25 °C (t25 °C) to peak temperature Parameter TL to TP TSMIN TSMAX tS TSMAX to TL tL TL TP tP TP to T smax t 3. note： Pb free 3 °C/sec max 150 °C 200 °C 60 sec to 120 sec 1.25 °C/sec 60 sec to 150 sec 217 °C 260 °C 20 sec to 40 sec 6 °C/sec max 8 minutes max When washing the PCB, ensure that water does not make contact with the microphone port. Do not use blow‐off procedures or ultrasonic cleaning. © 2011‐2015 MEMSensing Microsystems Co. Ltd, —DOC NO:DS‐035, P ENG, All rights reserved 7

MSM261S4030H0 I2S digital output MEMS microphone OUTLINE DIMENSIONS AND PIN DEFINITION： Port 1 4 5 3 2 6 7 1 8 TOP VIEW SIDE VIEW BOTTOM VIEW 1 2 3 4 5 6 7 8 GND N/C WS Ground — Input CHIPEN Input L/R Input SCK Input SD Output Power VDD Connect to ground on the PCB. Do not connect Serial Data‐Word Select for I²S Interface. Microphone Enable. When set low (ground), the microphone is disabled and put in power‐down mode. When set high (VDD), the microphone is enabled. Left/Right Channel Select. When set low, the microphone outputs its signal in the left channel of the I²S frame; when set high, the microphone outputs its signal in the right channel. Serial Data Clock for I²S Interface. Serial Data Output for I²S Interface. This pin tristates when not actively driving the appropriate output channel. The SD trace should have a 100 kΩ pull‐down resistor to discharge the line during the time that all microphones on the bus have tristated their outputs. 1.8 to 3.3 V. This pin should be decoupled to Pin 6 with a 0.1 μF capacitor. Item Length (L) Width (W) Height (H) Acoustic Port (AP) Dimension 4.0 3.0 1.05 Ø0.65 Tolerance ±0.10 ±0.10 ±0.10 ±0.10 Dimensions are in millimeters Tolerance is ±0.1mm unless otherwise specified. © 2011‐2015 MEMSensing Microsystems Co. Ltd, —DOC NO:DS‐035, P ENG, All rights reserved 8

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