BES2300-HP_Datasheet_v0.13规格书.pdf

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BES2300-HP Product Specification Rev 0.13 Bluetooth Audio Platform with IBRT* for TWS Confidential and Proprietary –Bestechnic (Shanghai) Co., Ltd. *IBRT: BES Intelligent Bluetooth Retransmission Tech CONTACT US: Address: Room 201, Tower B, Chamtime Plaza, Lane 2889 Jinke Road, Pudong New District, Shanghai 201203, China Phone: (86)21 6877 1788 For products inquires and more information, please visit www.bestechnic.com. DISCLAIMER: No part of this document may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying and recording, for any purpose, without the express written permission of Bestechnic. Bestechnic retains the right to make changes to this document at any time, without notice. Bestechnic makes no warranty of any kind, expressed or implied, with regard to any information contained in this document, including, but not limited to, the implied warranties of merchantability or fitness for any particular purpose. Further, Bestechnic does not warrant the accuracy or completeness of the information, text, graphics, or other items contained within this document.

BES2300-HP Product Specification Datasheet Status Datasheet Status Product Status Revision Control Description Draft Development Rev 0.01 - 0.49 Datasheets contain pre-tape out information from the objective design specification and is only for internal use. Preliminary Qualification Rev 0.50 - 0.99 Datasheets contain information on post-tape out and pre-volume production products, and a revision of this document or supplementary information may be published at a later date. BESTECHNIC may make changes to these specifications at any time without notice. Released Production Rev1.xx Datasheets contain information on volume production products. BESTECHNIC may make changes to these specifications at any time without notice. Revision History Bars appearing in the margin (as shown here) indicate where technical changes have occurred for this revision. The following table lists the technical content changes for all revisions. Revision Date Description 0.10 0.11 0.12 0.13 17/10/2019 20/12/2019 20/02/2020 03/07/2020 Initial definition Update flash size and MCU dual core Update ANC feature Update ANC feature Rev 0.13 Page2 / 25 Confidential and Proprietary – Bestechnic (Shanghai) Co., Ltd.

BES2300-HP Product Specification Table of Contents List of Tables ........................................................................................................................................................................ 4 List of Figures ....................................................................................................................................................................... 4 1 General Description ............................................................................................................................................. 5 1.1 Applications ........................................................................................................................................................... 5 1.2 Features ................................................................................................................................................................. 6 2 3 4 5 6 7 Platform Feature .................................................................................................................................................. 7 2.1 MCU Subsystem ..................................................................................................................................................... 7 2.2 Memory ................................................................................................................................................................. 7 2.3 System Peripherals................................................................................................................................................. 8 2.4 Power Management .............................................................................................................................................. 8 2.5 Audio Interface ...................................................................................................................................................... 8 Bluetooth Modem Description ............................................................................................................................ 10 3.1 Radio .................................................................................................................................................................... 10 3.2 Auxiliary Feature .................................................................................................................................................. 10 3.3 Bluetooth Stack .................................................................................................................................................... 10 Electrical Characteristics ..................................................................................................................................... 11 4.1 Electrical Characteristics ...................................................................................................................................... 11 4.2 Bluetooth Radio Electrical Characteristics ........................................................................................................... 11 4.3 Audio Codec Electrical Characteristics ................................................................................................................. 15 4.4 BUCK Electrical Characteristics ............................................................................................................................ 16 Pin Map & Application Schematic ....................................................................................................................... 17 5.1 Pin Description ..................................................................................................................................................... 17 Package Dimensions ........................................................................................................................................... 20 6.1 BGA Dimensions ................................................................................................................................................... 20 SMT Caution ....................................................................................................................................................... 21 7.1 Land Pad and Stencil Design ................................................................................................................................ 21 7.2 Solder Reflow Profile ........................................................................................................................................... 21 7.3 RoHS Compliant ................................................................................................................................................... 22 7.4 ESD Sensitivity ...................................................................................................................................................... 22 7.5 Storage Alert ........................................................................................................................................................ 22 8 Ordering Information .......................................................................................................................................... 23 9 Tape and Reel Information .................................................................................................................................. 24 9.1 Tape Orientation .................................................................................................................................................. 24 9.2 Reel Dimensions ................................................................................................................................................... 24 9.3 Tape Dimensions .................................................................................................................................................. 25 9.4 Moisture Sensitivity Level .................................................................................................................................... 25 Rev 0.13 Page3 / 25 Confidential and Proprietary – Bestechnic (Shanghai) Co., Ltd.

BES2300-HP Product Specification List of Tables Table 4-1 DC Electrical Specification (a) ...................................................................................................................... 11 Table 4-2 DC Electrical Specification (c) ...................................................................................................................... 11 Table 4-3 Power Consumption (a) ............................................................................................................................... 11 Table 4-4 Receiver Characteristics - Basic Data Rate (a) ............................................................................................. 11 Table 4-5 Transmitter Characteristics - Basic Data Rate (a) ........................................................................................ 12 Table 4-6 Receiver Characteristics - Enhanced Data Rate (a) ...................................................................................... 13 Table 4-7 Transmitter Characteristics - Enhanced Data Rate (a) ................................................................................. 13 Table 4-8 Bluetooth LE Receiver Specifications ......................................................................................................... 14 Table 4-9 Bluetooth LE Transmitter Specifications .................................................................................................... 14 Table 4-10 Digital to Analogue Converter under 1.95V (b) ......................................................................................... 15 Table 4-11 Codec - Analogue to Digital Converter under 1.95V ................................................................................ 16 Table 5-1 BES2300-HP Pins Description ..................................................................................................................... 17 Table 7-1 Package peak reflow temperature - Sn/Pb ................................................................................................ 21 Table 7-2 Package peak reflow temperature - Pb-Free (a).......................................................................................... 21 Table 7-3 Solder Reflow Profile Feature .................................................................................................................... 22 List of Figures Figure 1-1 BES2300-HP Top View................................................................................................................................. 5 Figure 2-1 Platform Architecture ................................................................................................................................. 7 Figure 5-1 BES2300-HP Pinout Diagram .................................................................................................................... 17 Figure6-1 BES2300-HP Dimension ............................................................................................................................. 20 Figure 7-1 Solder Reflow Profile ................................................................................................................................ 21 Figure 9-1 Tape Orientation ....................................................................................................................................... 24 Figure 9-2 Reel Dimensions ....................................................................................................................................... 24 Figure 9-3 Tape Dimensions....................................................................................................................................... 25 Rev 0.13 Page4 / 25 Confidential and Proprietary – Bestechnic (Shanghai) Co., Ltd.

BES2300-HP Product Specification 1 General Description BES2300-HP is a highly integrated SoC with dual-mode Bluetooth 5.0 and high performance Cortex-M4F 300MHz Dual- Core for wireless audio and voice application. It also uses patented IBRT (Intelligent Bluetooth Retransmission) technology to achieve low latency and robust TWS application. IBRT is BES Patented snoop plus relay technology to implement synchronous connection between mobile phone, primary and secondary earbud. Besides, BES2300-HP supports FF or FB ANC (Active noise cancellation). BES2300-HP minimizes the external components and BOM cost by highly integrating RF transceiver, high performance Audio Codec and cap-less headphone driver. It also integrates serial flash and powerful Cortex-M4F MCU to support various software features and product customization. BES2300-HP is manufactured with advanced low power CMOS process and assembled with a 4.5*6.2mm 80-ball BGA package. Figure 1-1 BES2300-HP Top View 1.1 Applications  High-end full wireless headset  High-end Bluetooth headset  Smart BT/WIFI music box  BT boom box  IOT platform  Other portable audio device Rev 0.13 Page5 / 25 Confidential and Proprietary – Bestechnic (Shanghai) Co., Ltd. FLASHROM/RAMConnectivity/StoragePeripheralDC/DCLDOCRYSTALBTMAC/PHY BT_RFCODEC DIGDAC_LDAC_RANC ADCMCU(Dual Core)

BES2300-HP Product Specification 1.2 Features CPU Features  CMOS Single-chip fully-integrated PMU, RF, Audio Codec and Cortex-M4F CPU  Up to 300MHz Dual-Core ARM Cortex-M4F Processor  Support for BES Intelligent Bluetooth Retransmission (IBRT)  2MB serial flash On-chip for custom program  Dual-Core Cortex-M4F with On-chip Boot-ROM and RAM  Security boot to protect customer IP BT Features  Multi-band EQ and Bass enhancement  HiFi Stereo Audio DAC: − − − 120dB SNR 110dB DNR Sample rates from 8 kHz to 384 kHz  HiFi Stereo Audio ADC: − − − 100dB SNR Sample rates from 8 kHz to 384 kHz 3D recording     Support TWS Echo Cancellation 24-bit audio processing Support for USB Audio Playback  Bluetooth 5.0 dual-mode compliance Interface Features Audio Features  USB 2.0 HS device  Immersive audio with 3D or virtual surround PMU Features sound  Support hybrid ANC  Active Crossover − Crossover filter: DSP Adjustable − Active Crossover two-way application: Sports Bluetooth & FWS Bluetooth     3.1V-5.5V input for VBAT Support for DCXO with internal oscillator circuit Internal LPO for low power mode Internal temperature sensor Rev 0.13 Page6 / 25 Confidential and Proprietary – Bestechnic (Shanghai) Co., Ltd.

BES2300-HP Product Specification 2 Platform Feature BES2300-HP is designed for high-resolution wireless audio MCU system as shown in Figure 2-1. Figure 2-1 Platform Architecture 2.1 MCU Subsystem BES2300-HP is embedded with the ARM Cortex-M4F processor, which provides best trade-off between system performance and power consumption. For large amount of data transfer, high performance Direct Memory Access (DMA) is implemented, which greatly enhances the data movement speed while reducing MCU processing load.       Dual-Core Cortex-M4F high performance processor with float and HW DSP instruction Unified cache High performance multi-layer AMBA bus Operating frequency up to 300MHz On-chip boot ROM for factory flash programming Security boot  Watchdog Timer (WDT) for system crash recovery   General-purpose Timers DMA for audio/voice data transfer 2.2 Memory BES2300-HP integrates internal memory and serial flash on-chip with various operating frequencies.   Internal ROM 448KB for critical constants and code Internal SRAM 736KB for critical data and code Rev 0.13 Page7 / 25 Confidential and Proprietary – Bestechnic (Shanghai) Co., Ltd. Cortex-M4F_0BT 5.0MACPHYAHB2APBAHBDMA1SRAMFLASHBOOT ROMI2CGPIOGPADCTIMERSPI1APBUARTCMUWDTCODECPCMPWMCortex-M4F_1

BES2300-HP Product Specification   BT shared SRAM 64KB On-chip serial flash 2MB for custom program 2.3 System Peripherals BES2300-HP is embedded with necessary peripheral blocks, and supports for UART or USB download.          Clock Management Unit (CMU) provides general controls over the whole system UART with configurable baud rate I2C master/slave peripheral interface General-purpose input/output (GPIO) with independent interruptions Pulse Width Modulation (PWM) Several timers: RTC timer, WDT, general-purpose timer USB 2.0 HS device and USB Type C compliant Sony/Philips Digital Interface Format (SPDIF) in/out Real Time Clock (RTC) 2.4 Power Management BES2300-HP integrates Power Management Unit (PMU), which supports 3.1V~5.5V input for VBAT, DCXO with internal oscillator circuit, power on reset control, internal 32kHz OSC for standby and sleep state, internal LPOs supporting for low power mode. BES2300-HP offers various low power features to reduce system consumption. Features include standby mode with 32 kHz clock, power down mode for individual peripherals and processor sleep mode. In addition, BES2300-HP is fabricated using the advanced low leakage CMOS process in order to provide ultra-low leakage solution. BES2300-HP also includes 6 linear regulators (LDOs and DCDCs): − − − − LDO_MEM generates a 1.2~2.7V supply rail for on-chip memory; LDO_USB generates a 2.4~3.6V supply rail for USB2.0 interface; LDO_VIO generates a 1.2~3.3V supply rail for GPIOs; LDO_ANA generates a 1.0~1.7V supply rail for the analog building blocks on-chip; − DCDC_CODEC generates a 1.2~2V supply rail for the Codec units; − DCDC_CORE generates a 0.3~1.3V supply rail for the digital logics. BES2300-HP provides two switch-mode DCDCs, both of them are single–inductor–single–output (SISO) Buck. 2.5 Audio Interface The audio interface circuit consists of:   Stereo/dual-mono Audio Codec Two high-quality ADC channels with sample rates from 8 kHz to 384 kHz Rev 0.13 Page8 / 25 Confidential and Proprietary – Bestechnic (Shanghai) Co., Ltd.

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