Revision History
Declaration
Contents
Figures
Tables
About This Documentation
1. Overview
2. Features
2.1. CPU
2.2. Memory Subsystem
Boot ROM
SDRAM
SMHC
2.3. System Peripheral
CCU
Timer
High Speed Timer
RTC
INTC
DMA
PWM
KEYADC
TP
Crypto Engine(CE)
Security ID
2.4. Display Subsystem
DE2.0
Display Output
2.5. Video Engine
Video Decoder
2.6. Image Subsystem
TVIN
2.7. Audio Subsystem
Audio Codec
I2S/PCM
2.8. External Peripherals
USB
TWI
SPI
UART
CIR Receiver
SCR
TSC
2.9. Package
3. Block Diagram
4. Pin Description
4.1. Pin Characteristics
4.2. Signal Descriptions
5. Electrical Characteristics
5.1. Absolute Maximum Ratings
5.2. Recommended Operating Conditions
5.3. DC Electrical Characteristics
5.4. PLL Electrical Characteristics
5.4.1. CPU PLL Electrical Parameters
5.4.2. Audio PLL Electrical Parameters
5.4.3. Peripheral0/1(2X) PLL Electrical Parameters
5.4.4. DDR1 PLL Electrical Parameters
5.4.5. Video0/1 PLL Electrical Parameters
5.4.6. DE PLL Electrical Parameters
5.4.7. VE PLL Electrical Parameters
5.4.8. MIPI PLL Electrical Parameters
5.5. KEYADC Electrical Characteristics
5.6. TP Electrical Characteristics
5.7. Oscillator Electrical Characteristics
5.8. Maximum Current Consumption
5.9. External Memory Electrical Characteristics
5.9.1. SMHC AC Electrical Characteristics
5.10. External Peripherals Electrical Characteristics
5.10.1. LCD AC Electrical Characteristics
5.10.2. SPI AC Electrical Characteristics
5.10.3. UART AC Electrical Characteristics
5.10.4. TWI AC Electrical Characteristics
5.10.5. CIR Receiver AC Electrical Characteristics
5.10.6. SCR AC Electrical Characteristics
5.10.7. TSC AC Electrical Characteristics
5.10.8. I2S/PCM AC Electrical Characteristics
5.11. Power-up and Power-down Sequence
5.11.1. Power-up Sequence
5.11.2. Power-down Sequence
6. Package Thermal Characteristics
7. Pin Assignment
7.1. Pin Map
7.2. Package Dimension