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1 Features
2 Applications
3 Description
Table of Contents
4 Revision History
5 Pin Configuration and Functions
6 Specifications
6.1 Absolute Maximum Ratings
6.2 ESD Ratings - LM3478
6.3 Recommended Operating Conditions
6.4 Thermal Information
6.5 Electrical Characteristics
6.6 Typical Characteristics
7 Detailed Description
7.1 Overview
7.2 Functional Block Diagram
7.3 Feature Description
7.3.1 Overvoltage Protection
7.3.2 Slope Compensation Ramp
7.3.3 Frequency Adjust/Shutdown
7.3.4 Short-Circuit Protection
7.4 Device Functional Modes
8 Application and Implementation
8.1 Application Information
8.2 Typical Applications
8.2.1 Typical High Efficiency Step-Up (Boost) Converter
8.2.1.1 Design Requirements
8.2.1.2 Detailed Design Procedure
8.2.1.3 Application Curves
8.2.2 Typical SEPIC Converter
8.2.2.1 Design Requirements
8.2.2.2 Detailed Design Procedure
8.2.2.3 Application Curves
9 Power Supply Recommendations
10 Layout
10.1 Layout Guidelines
10.2 Layout Example
11 Device and Documentation Support
11.1 Custom Design with WEBENCH Tools
11.2 Receiving Notification of Documentation Updates
11.3 Documentation Support
11.3.1 Related Documentation
11.4 Related Links
11.5 Trademarks
11.6 Electrostatic Discharge Caution
11.7 Glossary
12 Mechanical, Packaging, and Orderable Information
LM3478 High-Efficiency Low-Side N-Channel Controller for Switching Regulator LM3478 SNVS085X –JULY 2000–REVISED DECEMBER 2017 1 Features 1• 8-lead VSSOP-8 and SOIC-8 packages • Internal Push-Pull Driver With 1-A Peak Current Capability • Current Limit and Thermal Shutdown • Frequency Compensation Optimized With a Capacitor and a Resistor Internal Soft Start • • Current Mode Operation • Undervoltage Lockout With Hysteresis • Create a Custom Design Using the LM3478 with the WEBENCH Power Designer 2 Applications • Distributed Power Systems • Battery Chargers • Offline Power Supplies • Telecom Power Supplies • Automotive Power Systems • Wide Supply Voltage Range of 2.97 V to 40 V 100-kHz to 1-MHz Adjustable Clock Frequency • ±2.5% (Over Temperature) Internal Reference • • 10-µA Shutdown Current (Over Temperature) It for switching regulators. 3 Description The LM3478 is a versatile Low-Side N-Channel MOSFET controller is suitable for use in topologies requiring a low side MOSFET, such as boost, flyback, SEPIC, etc. Moreover, the LM3478 can be operated at extremely high switching frequency in order to reduce the overall solution size. The switching frequency of the LM3478 can be adjusted to any value between 100 kHz and 1 MHz by using a single external resistor. Current mode control provides superior bandwidth and transient cycle-by-cycle current limiting. Output current can be programmed with a single external resistor. The LM3478 has built-in features such as thermal shutdown, voltage protection, etc. Power saving shutdown mode reduces the total supply current to 5 µA and allows power supply sequencing. Internal soft-start limits the inrush current at start-up. short-circuit protection, over response, besides Device Information(1) LM3478 PACKAGE PART NUMBER BODY SIZE (NOM) 4.90 mm x 3.91 mm 3.00 mm x 3.00 mm (1) For all available packages, see the orderable addendum at SOIC (8) VSSOP (8) the end of the datasheet. Typical High Efficiency Step-Up (Boost) Converter 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. ProductFolderOrderNowTechnicalDocumentsTools &SoftwareSupport &Community
LM3478 SNVS085X –JULY 2000–REVISED DECEMBER 2017 www.ti.com Table of Contents 1 Features.................................................................. 1 2 Applications ........................................................... 1 3 Description ............................................................. 1 4 Revision History..................................................... 2 5 Pin Configuration and Functions ......................... 3 6 Specifications......................................................... 4 6.1 Absolute Maximum Ratings ...................................... 4 6.2 ESD Ratings - LM3478 ............................................ 4 6.3 Recommended Operating Conditions....................... 4 6.4 Thermal Information.................................................. 5 6.5 Electrical Characteristics........................................... 5 6.6 Typical Characteristics.............................................. 7 7 Detailed Description ............................................ 11 7.1 Overview ................................................................. 11 7.2 Functional Block Diagram ....................................... 12 7.3 Feature Description................................................. 12 7.4 Device Functional Modes........................................ 15 8 Application and Implementation ........................ 16 8.1 Application Information............................................ 16 8.2 Typical Applications ................................................ 16 9 Power Supply Recommendations...................... 28 10 Layout................................................................... 28 10.1 Layout Guidelines ................................................. 28 10.2 Layout Example .................................................... 29 11 Device and Documentation Support ................. 30 11.1 Custom Design with WEBENCH Tools................. 30 11.2 Receiving Notification of Documentation Updates 30 11.3 Documentation Support ....................................... 30 11.4 Related Links ........................................................ 30 11.5 Trademarks ........................................................... 30 11.6 Electrostatic Discharge Caution............................ 30 11.7 Glossary ................................................................ 30 12 Mechanical, Packaging, and Orderable Information ........................................................... 31 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision W (December 2014) to Revision X Page • Deleted LM3478Q-Q1 device. See LM3478Q-Q1 data sheet ............................................................................................... 1 • Changed package from "DCK" to "DGK" for LM3478 and LM3478-Q1 devices in the Thermal Information table; changed pin complement from "3" to "8" for the D, and DGK packages ............................................................................... 5 • Changed RθJA for the D package from "157.2" to "105.3" °C/W............................................................................................. 5 • Changed RθJC(top) for the D package from "49.9" to "50.3" °C/W............................................................................................ 5 • Changed RθJB for the D package from "77.1" to "55.8" °C/W................................................................................................. 5 • Changed ψJT for the D package from "4.7" to "6.8" °C/W ...................................................................................................... 5 • Changed ψJB for the D package from "75.8" to "54.7" °C/W .................................................................................................. 5 Changes from Revision V (February 2013) to Revision W Page • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section ................................................................................................. 4 • Deleted Thermal Resistance parameter from Electrical Characteristics ............................................................................... 6 Changes from Revision U (February 2013) to Revision V Page 2 Submit Documentation Feedback Copyright © 2000–2017, Texas Instruments Incorporated Product Folder Links: LM3478
www.ti.com 5 Pin Configuration and Functions LM3478 SNVS085X –JULY 2000–REVISED DECEMBER 2017 8-Lead VSSOP-8 Package 3 Pins Top View 8-Lead SOIC-8 3 Pins Top View PIN NAME ISEN COMP FB AGND PGND DR FA/SD VIN NO. 1 2 3 4 5 6 7 8 I/O I I I G G O I P Pin Functions DESCRIPTION Current sense input pin. Voltage generated across an external sense resistor is fed into this pin. Compensation pin. A resistor, capacitor combination connected to this pin provides compensation for the control loop. Feedback pin. The output voltage should be adjusted using a resistor divider to provide 1.26 V at this pin. Analog ground pin. Power ground pin. Drive pin. The gate of the external MOSFET should be connected to this pin. Frequency adjust and Shutdown pin. A resistor connected to this pin sets the oscillator frequency. A high level on this pin for longer than 30 µs will turn the device off. The device will then draw less than 10µA from the supply. Power Supply Input pin. Copyright © 2000–2017, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LM3478
www.ti.com MIN –0.4< V –0.4 < VFA/SD MAX 45 V FB < 7 VFA/SD< 7 1 UNIT V V V A Internally Limited +150 215 260 –0.4 ≤ VDR VDR ≤ 8 °C °C °C V mV °C LM3478 SNVS085X –JULY 2000–REVISED DECEMBER 2017 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature (unless otherwise noted) (1) Input Voltage FB Pin Voltage FA/SD Pin Voltage Peak Driver Output Current (<10µs) Power Dissipation Junction Temperature Lead Temperature Vapor Phase (60 s) Infrared (15 s) DR Pin Voltage ISEN Pin Voltage Tstg (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings Storage temperature 500 150 −65 only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 6.2 ESD Ratings - LM3478 V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) VALUE ±2000 ±750 UNIT V (1) (2) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) Supply Voltage Junction Temperature Range Switching Frequency MIN 2.97 ≤ VIN −40 ≤ TJ 100 ≤ FSW NOM MAX VIN ≤ 40 TJ ≤ +125 FSW ≤ 1 UNIT V °C MHz 4 Submit Documentation Feedback Copyright © 2000–2017, Texas Instruments Incorporated Product Folder Links: LM3478
www.ti.com 6.4 Thermal Information LM3478 SNVS085X –JULY 2000–REVISED DECEMBER 2017 THERMAL METRIC(1) LM3478 D UNIT Junction-to-ambient thermal resistance Junction-to-case (top) thermal resistance Junction-to-board thermal resistance Junction-to-top characterization parameter Junction-to-board characterization parameter Junction-to-case (bottom) thermal resistance RθJA RθJC(top) RθJB ψJT ψJB RθJC(bot) (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. °C/W °C/W °C/W °C/W °C/W °C/W 8 PINS 105.3 50.3 55.8 6.8 54.7 N/A DGK 8 PINS 157.2 49.9 77.1 4.7 75.8 N/A PARAMETER 6.5 Electrical Characteristics Unless otherwise specified, VIN = 12V, RFA = 40kΩ, TJ = 25°C TEST CONDITIONS VCOMP = 1.4V, 2.97 ≤ VIN ≤ 40V VCOMP = 1.4V, 2.97 ≤ VIN ≤ 40V, −40°C ≤ TJ ≤ 125°C 2.97 ≤ VIN ≤ 40V Feedback Voltage VFB ΔVLINE Feedback Voltage Line Regulation Output Voltage Load Regulation Input Undervoltage Lock-out Input Undervoltage Lock-out Hysteresis Nominal Switching Frequency Driver Switch On Resistance (top) Driver Switch On Resistance (bottom) Maximum Drive Voltage Swing(1) Maximum Duty Cycle(2) ΔVLOAD VUVLO VUV(HYS) Fnom RDS1 (ON) RDS2 (ON) VDR (max) Dmax IEAO Source/Sink −40°C ≤ TJ ≤ 125°C −40°C ≤ TJ ≤ 125°C RFA = 40KΩ RFA = 40KΩ, −40°C ≤ TJ ≤ 125°C IDR = 0.2A, VIN= 5V IDR = 0.2A VIN < 7.2V VIN ≥ 7.2V Tmin (on) Minimum On Time ISUPPLY Supply Current (non- switching) IQ VSENSE VSC Quiescent Current in Shutdown Mode Current Sense Threshold Voltage Short-Circuit Current Limit Sense Voltage −40°C ≤ TJ ≤ 125°C See (3) See (3), −40°C ≤ TJ ≤ 125°C VFA/SD = 5V (4), VIN = 5V VFA/SD = 5V (4), VIN = 5V, −40°C ≤ TJ ≤ 125°C VIN = 5V VIN = 5V, −40°C ≤ TJ ≤ 125°C VIN = 5V VIN = 5V, −40°C ≤ TJ ≤ 125°C MIN 1.2416 1.228 130 350 210 135 125 250 TYP 1.26 0.001 2.85 170 400 16 4.5 VIN 7.2 100% 325 2.7 5 156 343 MAX 1.2843 1.292 ±0.5 2.97 210 440 600 3.3 10 180 190 415 UNIT V %/V %/A V mV kHz Ω V ns mA µA mV mV (1) The voltage on the drive pin, VDR is equal to the input voltage when input voltage is less than 7.2 V. VDR is equal to 7.2 V when the input voltage is greater than or equal to 7.2 V. (2) The limits for the maximum duty cycle can not be specified since the part does not permit less than 100% maximum duty cycle operation. (3) For this test, the FA/SD pin is pulled to ground using a 40-K resistor. (4) For this test, the FA/SD pin is pulled to 5 V using a 40-K resistor. Copyright © 2000–2017, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: LM3478
LM3478 SNVS085X –JULY 2000–REVISED DECEMBER 2017 Electrical Characteristics (continued) Unless otherwise specified, VIN = 12V, RFA = 40kΩ, TJ = 25°C TEST CONDITIONS PARAMETER Internal Compensation Ramp Voltage VSL/VSENSE VSL VSL ratio VOVP Output Over-voltage Protection (with respect to feedback voltage) (5) VOVP(HYS) Output Over-Voltage Protection Hysteresis(5) Gm AVOL IEAO VEAO TSS Tr Tf VSD ISD IFB TSD Tsh VIN = 5V VIN = 5V, −40°C ≤ TJ ≤ 125°C VCOMP = 1.4V VCOMP = 1.4V, −40°C ≤ TJ ≤ 125°C VSSOP Package VSSOP Package, −40°C ≤ TJ ≤ 125°C SOIC Package SOIC Package, −40°C ≤ TJ ≤ 125°C VCOMP = 1.4V VCOMP = 1.4V, −40°C ≤ TJ ≤ 125°C VCOMP = 1.4V, IEAO = 100µA (Source/Sink) VCOMP = 1.4V, IEAO = 100µA (Source/Sink), −40°C ≤ TJ ≤ 125°C VCOMP = 1.4V, IEAO = 100µA (Source/Sink) VCOMP = 1.4V, IEAO = 100µA (Source/Sink), −40°C ≤ TJ ≤ 125°C Source, VCOMP = 1.4V, VFB = 0V Source, VCOMP = 1.4V, VFB = 0V, −40°C ≤ TJ ≤ 125°C Sink, VCOMP = 1.4V, VFB = 1.4V Sink, VCOMP = 1.4V, VFB = 1.4V, −40°C ≤ TJ ≤ 125°C Upper Limit, VFB = 0V, COMP Pin = Floating Upper Limit, VFB = 0V, COMP Pin = Floating, −40°C ≤ TJ ≤ 125°C Lower Limit, VFB = 1.4V Lower Limit, VFB = 1.4V, −40°C ≤ TJ ≤ 125°C Error Amplifier Transconductance Error Amplifier Voltage Gain Error Amplifier Output Current (Source/ Sink) Error Amplifier Output Voltage Swing Internal Soft-Start Delay VFB = 1.2V, VCOMP = Floating Drive Pin Rise Time Cgs = 3000pf, VDR = 0 to 3V Cgs = 3000pf, VDR = 0 to 3V Drive Pin Fall Time Shutdown threshold (6) Output = High Output = High, −40°C ≤ TJ ≤ 125°C Output = Low Output = Low, −40°C ≤ TJ ≤ 125°C VSD = 5V VSD = 0V Shutdown Pin Current Feedback Pin Current Thermal Shutdown Thermal Shutdown Hysteresis MIN 52 0.30 32 25 20 600 365 26 80 50 −100 −85 1.8 0.2 www.ti.com MAX UNIT 132 0.70 78 85 78 100 110 1000 1265 44 140 180 −180 −185 2.4 1.0 1.4 0.3 mV mV mV µS V/V µA µA V V ms ns ns V V µA nA °C °C TYP 92 0.49 50 60 800 38 110 −140 2.2 0.56 4 25 25 1.27 0.65 −1 +1 15 165 10 (5) The over-voltage protection is specified with respect to the feedback voltage. This is because the over-voltage protection tracks the feedback voltage. The overvoltage protection threshold is given by adding the feedback voltage, VFB to the over-voltage protection specification. (6) The FA/SD pin should be pulled to VIN through a resistor to turn the regulator off. The voltage on the FA/SD pin must be above the maximum limit for Output = High to keep the regulator off and must be below the limit for Output = Low to keep the regulator on. 6 Submit Documentation Feedback Copyright © 2000–2017, Texas Instruments Incorporated Product Folder Links: LM3478
www.ti.com 6.6 Typical Characteristics Unless otherwise specified, VIN = 12V, TJ = 25°C. LM3478 SNVS085X –JULY 2000–REVISED DECEMBER 2017 Figure 1. IQ vs Input Voltage (Shutdown) Figure 2. ISupply vs Input Voltage (Non-Switching) Figure 3. ISupply vs VIN (Switching) Figure 4. Switching Frequency vs RFA Figure 5. Frequency vs Temperature Figure 6. Drive Voltage vs Input Voltage Copyright © 2000–2017, Texas Instruments Incorporated Submit Documentation Feedback 7 Product Folder Links: LM3478
LM3478 SNVS085X –JULY 2000–REVISED DECEMBER 2017 Typical Characteristics (continued) Unless otherwise specified, VIN = 12V, TJ = 25°C. www.ti.com Figure 7. Current Sense Threshold vs Input Voltage Figure 8. COMP Pin Voltage vs Load Current Figure 9. Efficiency vs Load Current (3.3-V Input and 12-V Output) Figure 10. Efficiency vs Load Current (5-V Input and 12-V Output) Figure 11. Efficiency vs Load Current (9-V Input and 12-V Output) Figure 12. Efficiency vs Load Current (3.3-V Input and 5-V Output) 8 Submit Documentation Feedback Copyright © 2000–2017, Texas Instruments Incorporated Product Folder Links: LM3478
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