iNAND_7250_ 8-64GB_datasheet generic final v1.pdf

发布时间：2022-06-10 发布人：admin 分类：说明书资料大小：1.80M 资料格式：pdf 举报版权申诉

qq_39844434-12367202-4744300845404335450.pdf-第1页.png

第1页 / 共42页

qq_39844434-12367202-4744300845404335450.pdf-第2页.png

第2页 / 共42页

qq_39844434-12367202-4744300845404335450.pdf-第3页.png

第3页 / 共42页

qq_39844434-12367202-4744300845404335450.pdf-第4页.png

第4页 / 共42页

qq_39844434-12367202-4744300845404335450.pdf-第5页.png

第5页 / 共42页

qq_39844434-12367202-4744300845404335450.pdf-第6页.png

第6页 / 共42页

qq_39844434-12367202-4744300845404335450.pdf-第7页.png

第7页 / 共42页

qq_39844434-12367202-4744300845404335450.pdf-第8页.png

第8页 / 共42页

文本预览

Data Sheet - Confidential DOC 56-34-01508 • Rev 1.0 • March 2017 iNAND® 7250 e.MMC 5.1 with HS400 Interface Confidential, subject to all applicable non-disclosure agreements www.SanDisk.com

Confidential SanDisk® iNAND 7250 e.MMC 5.1+ HS400 I/F data sheet REVISION HISTORY Doc. No Revision Date Description DOC-56-34-01508 1.0 March - 2016 Released version SanDisk® provides this information, and any related samples, products, and documentation (collectively the “Materials”) solely for the selection and use of SanDisk® products. To the maximum extent permitted by applicable law: (1) Materials are made available “AS IS” and with all faults, SanDisk hereby DISCLAIMS ALL WARRANTIES AND CONDITIONS, EXPRESS, IMPLIED, STATUTORY, OR OTHERWISE, INCLUDING BUT NOT LIMITED TO WARRANTIES OF MERCHANTABILITY, NON-INFRINGEMENT, OR FITNESS FOR ANY PARTICULAR PURPOSE; and (2) SanDisk shall not be liable (whether in contract or tort, including negligence, or under any other theory of liability) for any loss or damage of any kind or nature related to, arising under, or in connection with, the Materials (including your use of the Materials), including for any direct, indirect, special, incidental, or consequential loss or damage (including loss of data, profits, goodwill, or any type of loss or damage suffered as a result of any action brought by a third party) even if such damage or loss was reasonably foreseeable or SanDisk® had been advised of the possibility of the same. You are responsible for obtaining any rights required in connection with your use of the Materials. The Materials are subject to change without further notice. SanDisk®assumes no obligation to correct errors or to notify you of updates to the Materials or to product specifications. You may not reverse engineer, reproduce, modify, distribute, or publicly display the Materials without prior written consent of SanDisk. SanDisk products are not designed or intended to be fail-safe or for use in any application requiring fail-safe performance. You assume sole risk and liability for use of SanDisk products in critical applications. © 2017 Western Digital Corporation or its affiliates. All rights reserved. Specifications are subject to change. SanDisk® is a trademark of Western Digital Corporation or its affiliates, registered in the United States and other countries. microSDHC is a trademark of SD-3C, LLC. Other brand names mentioned herein are for identification purposes only and may be the trademarks of their respective holder(s). © 2017 SanDisk – a Western Digital brand - 2 - DOC-56-34-01508

Confidential SanDisk iNAND 7250 e.MMC 5.1 HS400 I/F data sheet TABLE OF CONTENTS 1. Introduction ......................................................................................................................... 5 1.1. General Description ...................................................................................................... 5 1.2. Plug-and-Play Integration ............................................................................................. 6 1.3. Feature Overview ......................................................................................................... 7 1.4. MMC bus and Power Lines ........................................................................................... 8 1.4.1. Bus operating conditions ............................................................................................. 8 2. e.MMC Selected Features Overview ................................................................................ 10 2.1. HS400 Interface .......................................................................................................... 11 2.2. Enhanced User Data Area (EUDA) ............................................................................. 11 2.3. Field Firmware Upgrade (FFU) ................................................................................... 11 2.4. Cache ......................................................................................................................... 11 2.5. Discard ....................................................................................................................... 11 2.6. Power off Notifications ................................................................................................ 12 2.7. Packed Commands .................................................................................................... 12 2.8. Boot Partition .............................................................................................................. 12 2.9. RPMB Partition ........................................................................................................... 12 2.10. Automatic Sleep Mode ................................................................................................ 12 2.11. Sleep (CMD5) ............................................................................................................. 12 2.12. Enhanced Reliable Write ............................................................................................ 12 2.13. Sanitize ...................................................................................................................... 13 2.14. Secure Erase .............................................................................................................. 13 2.15. Secure Trim ................................................................................................................ 13 2.16. Partition Management................................................................................................. 13 2.17. Device Health ............................................................................................................. 14 2.18. EOL Status ................................................................................................................. 14 2.19. Enhanced Write Protection ......................................................................................... 14 2.20. High Priority Interrupt (HPI)......................................................................................... 14 2.21. H/W Reset .................................................................................................................. 14 2.22. Host-Device Synchronization Flow (Enhanced STROBE) ........................................... 15 2.23. Command-Queue ....................................................................................................... 15 3. Product Specifications ..................................................................................................... 16 3.1. Typical Power Measurements ..................................................................................... 16 3.2. Operating Conditions .................................................................................................. 17 © 2017 SanDisk – a Western Digital brand - 3 - DOC - 56-34-01508

Confidential SanDisk iNAND 7250 e.MMC 5.1 HS400 I/F data sheet 3.2.1. Operating and Storage Temperature Specifications ................................................... 17 3.2.2. Moisture Sensitivity ................................................................................................... 17 3.3. Reliability .................................................................................................................... 18 3.4 Typical System Performance ...................................................................................... 19 4. Physical Specifications .................................................................................................... 20 Interface Description ......................................................................................................... 22 5. 5.1. MMC I/F Ball Array ..................................................................................................... 22 5.2. Pins and Signal Description ........................................................................................ 23 5.3. Registers value ........................................................................................................... 24 5.3.1. OCR Register ............................................................................................................ 24 5.3.2. CID Register.............................................................................................................. 24 5.3.3. DSR Register ............................................................................................................ 24 5.3.4. CSD Register ............................................................................................................ 25 5.3.5. EXT_CSD Register ................................................................................................... 26 5.3.6. User Density.............................................................................................................. 32 6. HW Application Guidelines ............................................................................................... 33 6.1. Design Guidelines ...................................................................................................... 33 6.2. Capacitor Selection & Layout Guidelines .................................................................... 34 6.3. Reference Schematics ................................................................................................ 36 7. Propriety iNAND 7250 feature overview .......................................................................... 37 7.1. Device Report ............................................................................................................. 37 7.1.1. Device Report fields .................................................................................................. 37 7.2. Power-Loss indications ............................................................................................... 38 7.2.1. Unstable Power-Supply indications ............................................................................ 38 8. Marking .............................................................................................................................. 40 9. Ordering Information ........................................................................................................ 41 How to Contact Us .................................................................................................................. 42 © 2017 SanDisk – a Western Digital brand - 4 - DOC - 56-34-01508

Confidential SanDisk iNAND 7250 e.MMC 5.1 HS400 I/F data sheet 1. INTRODUCTION 1.1. General Description Overview SanDisk iNAND 7250 is an Embedded Flash Drive (EFD) designed for write intensive applications in a wide range of home entertainment and security applications, such as Set-Top- Box (STB), Over The Top (OTT), Home Gateways, Smart TV, Smart Security Cameras and more. The iNAND 7250 utilizes an LDPC ECC machine and MLC memory to provide a robust, high performance, high quality and high endurance product. The LDPC engine significantly improves error correction enabling longer device lifetime and an increased ability to handle operation at high temperature. The iNAND 7250 provides 8GB to 64GB of capacity and supports e.MMC 5.1. The iNAND 7250 is the ideal choice to deliver high reliability and high performance for storage applications like imaging, video, music, GPS, gaming, email, office and other new applications such as NOR replacement for embedded systems or other devices. The design of the iNAND 7250 is based on a JEDEC compatible form factor measuring 11.5x13mm (153 balls) for all capacities to lower integration costs and accelerate time-to- market. Architecture iNAND 7250 combines an embedded thin flash controller with advanced enterprise Multi-level Cell (eMLC) NAND flash technology enhanced by SanDisk’s embedded flash management software running as firmware on the flash controller. iNAND 7250 employs an industry-standard eMMC 5.11 interface featuring Command-Queue, HS400 interface, FFU, as well as legacy eMMC 4.51 features such as EUDA, Power Off Notifications, Packed commands, Cache, Boot / RPMB partitions, HPI, and HW Reset, making it an optimal device for both reliable code and data storage. Like our other iNAND products, iNAND 7250 offers plug-and-play integration and support for multiple NAND technology transitions, as well as features such as an advanced power management scheme. iNAND 7250 architecture and embedded firmware fully emulates a hard disk to the host processor, enabling read/write operations that are identical to a standard, sector-based hard drive. In addition, SanDisk firmware employs patented methods, such as virtual mapping, dynamic and static wear-leveling, and automatic block management to ensure high data reliability and maximizing flash life expectancy. iNAND 7250 also includes an intelligent controller, which manages interface protocols, data storage and retrieval, error correction code (ECC) algorithms, defect handling and diagnostics, power management and clock control. Combining high performance with features for easy integration and exceptional reliability, iNAND 7250 is an EFD designed to exceed the demands of both manufacturers and their customers. 1 Compatible to JESD84-B51 © 2017 SanDisk – a Western Digital brand - 5 - DOC-56-34-01508

Confidential SanDisk iNAND 7250 e.MMC 5.1 HS400 I/F data sheet 1.2. Plug-and-Play Integration iNAND’s optimized architecture eliminates the need for complicated software integration and testing processes thereby enabling plug-and-play integration into the host system. The replacement of one iNAND device with another of a newer generation requires virtually no changes to the host. This allows manufacturers to adopt advanced NAND Flash technologies and update product lines with minimal integration or qualification efforts. iNAND 7250 features a MMC interface allows for easy integration regardless of the host (chipset) type used. All device and interface configuration data (such as maximum frequency and device identification) are stored on the device. Figure 1 shows a block diagram of the SanDisk iNAND 7250 with MMC Interface. MMC Bus Interface SanDisk iNAND Single Chip controller Data In/Out Flash Memory Control Figure 1 - SanDisk iNAND 7250 with MMC Interface Block Diagram © 2017 SanDisk – a Western Digital brand - 6 - DOC - 56-34-01508

Confidential SanDisk iNAND 7250 e.MMC 5.1 HS400 I/F data sheet 1.3. Feature Overview SanDisk iNAND 7250, with MMC interface, includes the following features: • Memory controller and NAND flash • Mechanical design that complies with JEDEC Specifications with specific optimizations for automotive applications • Offered in three TFBGA packages of e.MMC 5.1 o 11.5mm x 13mm x 0.8mm (8GB-16GB) o 11.5mm x 13mm x 1.0mm (32GB) o 11.5mm x 13mm x 1.2mm (64GB) • Operating temperature range: –25C° to +85C° • Dual power system • Core voltage (VCC) 2.7-3.6 V • I/O (VCCQ) voltage, either: 1.7-1.95V or 2.7-3.6V • 8GB - 64GB of data storage • Supports three data bus widths: 1bit (default), 4bit, 8bit • Complies with e.MMC Specification Ver. 5.1 HS400 • Variable clock frequencies of 0-20 MHz, 0-26 MHz (default), 0-52 MHz (high-speed), 0-200 MHz SDR (HS200), 0-200 MHz DDR (HS400) • Up to 300 MB/sec bus transfer rate, using 8 parallel data lines at 200 MHz, HS400 Mode • High data integrity with eMLC memory, advanced LDPC ECC engine, automatic refresh, advanced power protection • Flexible EUDA, Fast boot • Up to 3K P/E cycles, 10 year data retention @ 55°C fresh © 2017 SanDisk – a Western Digital brand - 7 - DOC - 56-34-01508

Confidential SanDisk iNAND 7250 e.MMC 5.1 HS400 I/F data sheet 1.4. MMC bus and Power Lines SanDisk iNAND 7250 supports the MMC interface protocol. For more details regarding these buses refer to JEDEC standard No. JESD84-B51. The iNAND bus has the following communication and power lines: • CMD: Command is a bidirectional signal. The host and iNAND operate in two modes, open drain and push-pull. • DAT0-7: Data lines are bidirectional signals. Host and iNAND operate in push-pull mode. • CLK: Clock input. • RST_n: Hardware Reset Input. • VCCQ: Power supply line for host interface. • VCC: Power supply line for internal flash memory. • VDDi: iNAND’s internal power node, not the power supply. Connect 0.1uF capacitor from VDDi to ground. • VSS, VSSQ: Ground lines. • RCLK: Data strobe. • VSF: Vendor specific functions used for debugging purposes. 1.4.1. Bus operating conditions Table 1 - Bus operating conditions Max Unit VCCQ+0.5 100 V µA µA Parameter Peak voltage on all lines Input Leakage Current (before initializing and/or connecting the internal pull-up resistors) Min -0.5 -100 Input Leakage Current (after changing the -2 2 bus width and disconnecting the internal pull-up resistors) Output Leakage Current (before initializing and/or connecting the internal pull-up resistors) -100 100 µA Output Leakage Current (after changing -2 2 µA the bus width and disconnecting the internal pull-up resistors) © 2017 SanDisk – a Western Digital brand - 8 - DOC - 56-34-01508

分享到：

赞收藏

资料库

iNAND_7250_ 8-64GB_datasheet generic final v1.pdf

相关推荐

存储

热门标签

最新资料