S5K3L8 datasheet.pdf

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Samsung Confidential S5K3L8XXM3 1/3.06" 13M CMOS Image Sensor Revision 1.05 May 2017 Data Sheet  2017 Samsung Electronics Co., Ltd. All rights reserved. coasia / albert_yang at 2017.05.15SAMSUNG Confidential

Samsung Confidential Important Notice subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, expenses, and reasonable attorney fees arising out of, either directly or indirectly, any claim (including but not limited to personal injury or death) that may be associated with such unintended, unauthorized and/or illegal use. WARNING No part of this publication may be reproduced, stored in a retrieval system, or transmitted in any form or by any means, electric or mechanical, by photocopying, recording, or otherwise, without the prior written consent of Samsung. This publication is intended for use by designated recipients only. This publication contains confidential information (including trade secrets) of Samsung protected by Competition Law, Trade Secrets Protection Act and other related laws, and therefore may not be, in part or in whole, directly or indirectly publicized, distributed, photocopied or used (including Internet where unspecified access is possible) by any unauthorized third party. Samsung reserves its right to take any and all measures both in equity and law available to it and claim full damages against any party that misappropriates Samsung’s trade secrets and/or confidential information. in a posting on the 警告本文件仅向经韩国三星电子株式会社授权的人员提供，其内容含有商业秘密保护相关法规规定并受其保护的三星电子株式会社商业秘密，任何直接或间接非法向第三人披露、传播、复制或允许第三人使用该文件全部或部分内容的行为（包括在互联网等公开媒介刊登该商业秘密而可能导致不特定第三人获取相关信息的行为）皆为法律严格禁止。此等违法行为一经发现，三星电子株式会社有权根据相关法规对其采取法律措施，包括但不限于提出损害赔偿请求。 Samsung Electronics Co. Ltd. (“Samsung”) reserves the right to make changes to the information in this publication at any time without prior notice. All information provided is for reference purpose only. Samsung assumes no responsibility for possible errors or omissions, or for any consequences resulting from the use of the information contained herein. This publication on its own does not convey any license, either express or implied, relating to any Samsung and/or third-party products, under the intellectual property rights of Samsung and/or any third parties. Samsung makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Samsung assume any liability arising out of the application or use of any product or circuit and specifically disclaims any and all liability, including without limitation any consequential or incidental damages. Customers are responsible for their own products and applications. "Typical" parameters can and do vary in different applications. All operating parameters, including "Typicals" must be validated for each customer application by the customer's technical experts. Samsung products are not designed, intended, or authorized for use in applications intended to support or sustain life, or for any other application in which the failure of the Samsung product could reasonably be expected to create a situation where personal injury or death may occur. Customers acknowledge and agree that they are solely responsible to meet all other legal and regulatory requirements regarding their applications using Samsung products notwithstanding any information provided in this publication. Customer shall indemnify and hold Samsung and its officers, employees, Copyright  2017 Samsung Electronics Co., Ltd. 1-1, Samsungjeonja-ro, Hwaseong-si, Gyeonggi-do, Korea 445-330 Contact Us: jy7998.lee@samsung.com Home Page: http://www.samsungsemi.com coasia / albert_yang at 2017.05.15SAMSUNG Confidential

Samsung Confidential Trademarks All brand names, trademarks and registered trademarks belong to their respective owners.  Exynos, Exynos4210, FlexOneNAND, and OneNAND are trademarks of Samsung Electronics.  ARM, Jazelle, TrustZone, and Thumb are registered trademarks of ARM Limited.  Cortex, ETM, ETB, Coresight, ISA, and Neon are trademarks of ARM Limited.  Java is a trademark of Sun Microsystems, Inc.  SD is a registered trademark of Toshiba Corporation.  MMC and eMMC are trademarks of MultiMediaCard Association.  JTAG is a registered trademark of JTAG Technologies, Inc.  Synopsys is a registered trademark of Synopsys, Inc.   I2S is a trademark of Phillips Electronics. I2C is a trademark of Phillips Semiconductor Corp.  MIPI and Slimbus are registered trademarks of the Mobile Industry Processor Interface (MIPI) Alliance. All other trademarks used in this publication are the property of their respective owners. coasia / albert_yang at 2017.05.15SAMSUNG Confidential

Samsung Confidential Chip Handling Guide Precaution against Electrostatic Discharge When using semiconductor devices, ensure that the environment is protected against static electricity: 1. Wear antistatic clothes and use earth band. 2. All objects that are in direct contact with devices must be made up of materials that do not produce static electricity. 3. Ensure that the equipment and work table are earthed. 4. Use ionizer to remove electron charge. Contamination Do not use semiconductor products in an environment exposed to dust or dirt adhesion. Temperature/Humidity Semiconductor devices are sensitive to:  Environment  Temperature  Humidity High temperature or humidity deteriorates the characteristics of semiconductor devices. Therefore, do not store or use semiconductor devices in such conditions. Mechanical Shock Do not to apply excessive mechanical shock or force on semiconductor devices. Chemical Do not expose semiconductor devices to chemicals because exposure to chemicals leads to reactions that deteriorate the characteristics of the devices. Light Protection In non- Epoxy Molding Compound (EMC) package, do not expose semiconductor IC to bright light. Exposure to bright light causes malfunctioning of the devices. However, a few special products that utilize light or with security functions are exempted from this guide. Radioactive, Cosmic and X-ray Radioactive substances, cosmic ray, or X-ray may influence semiconductor devices. These substances or rays may cause a soft error during a device operation. Therefore, ensure to shield the semiconductor devices under environment that may be exposed to radioactive substances, cosmic ray, or X-ray. EMS (Electromagnetic Susceptibility) Strong electromagnetic wave or magnetic field may affect the characteristic of semiconductor devices during the operation under insufficient PCB circuit design for Electromagnetic Susceptibility (EMS). coasia / albert_yang at 2017.05.15SAMSUNG Confidential

Samsung Confidential Revision History Revision No. Date Description 0.00 0.01 0.02 Oct. 14. 2014  Initial draft Nov. 5. 2014  Update bonding coordinator Dec. 20.2014  Update De-speckle description 0.03 Jul.3.2015  Update frame rate  Update VOH and VOL specification  Add Pad A/D description  Update MCLK jitter  Add Lens specification  Add Register Description  Update pixel array information 0.04 0.05 Jul.27.2015  Update DC Characteristics Aug.8.2015  Update DC Characteristics 1.00 Sep.11.2015 1.01 Oct.23.2015  Update Lens specification  Update DC Characteristics  Update Pad Information  Update integration time formula  Update register description  Update maximum of digital operating current  Update MCLK period 1.02 1.03 1.04 1.05 Apr 5 2016  Update maximum analog supply current May 11, 2016  Update power up/down sequence Aug 22, 2016  Update effective pixel performance May 2 2017  Update data sheet format Author(s) YB Kim YB Kim YB Kim YB Kim YB Kim YB Kim YB Kim YB Kim YB Kim YB Kim YB Kim YB Kim coasia / albert_yang at 2017.05.15SAMSUNG Confidential

Samsung Confidential Table of Contents 1 PRODUCT OVERVIEW .................................................................................. 11 1.1 Introduction ................................................................................................................................................ 11 1.2 Features ..................................................................................................................................................... 12 2 PAD CONFIGURATION ................................................................................. 13 2.1 Pad Description .......................................................................................................................................... 14 2.2 Application Circuit ...................................................................................................................................... 18 2.3 Pixel Array Information ............................................................................................................................... 19 3 POWER SEQUENCE...................................................................................... 20 3.1 Operating Modes........................................................................................................................................ 20 3.2 Power-Up Sequence .................................................................................................................................. 21 3.3 Power-Down Sequence ............................................................................................................................. 24 3.4 Software Standby Mode Sequence ........................................................................................................... 26 4 CONTROL INTERFACE ................................................................................. 27 4.1 Camera Control Interface (CCI) ................................................................................................................. 27 4.1.1 Data Transfer Protocol ....................................................................................................................... 27 4.1.2 Message Format ................................................................................................................................. 27 4.1.3 Read/Write Operation ......................................................................................................................... 29 4.2 CCI Timing ................................................................................................................................................. 31 5 FUNCTIONAL FEATURES ............................................................................. 33 5.1 Block Diagram ............................................................................................................................................ 33 5.2 Pixel Array Addresses ................................................................................................................................ 34 5.3 Horizontal Mirror and Vertical Flip.............................................................................................................. 35 5.4 Sub-Sampled Readout ............................................................................................................................... 37 5.4.1 Averaged Sub-Sampled Readout ....................................................................................................... 37 5.5 Frame Rate Control ................................................................................................................................... 38 5.5.1 Integration Time Control (Electronic Shutter Control) ........................................................................ 38 5.5.2 Functional Operation Modes .............................................................................................................. 39 5.6 PLL and Clock Generator .......................................................................................................................... 40 5.6.1 Clock Relationships ............................................................................................................................ 41 5.6.2 Master Clock Waveform Diagram ....................................................................................................... 43 5.7 Gain Control ............................................................................................................................................... 44 5.7.1 Analog Gain Control ........................................................................................................................... 44 5.7.2 Digital Gain Control............................................................................................................................. 44 5.8 Embedded Line .......................................................................................................................................... 45 5.9 ISP (Image Signal Processor) Functions ................................................................................................... 45 5.9.1 Dual Correlated Double Sampling Statistics ...................................................................................... 45 5.9.2 Analog Dark Level Correction ............................................................................................................. 45 5.9.3 De-speckle (Bad pixel correction) ....................................................................................................... 45 5.9.4 Lens shading correction ..................................................................................................................... 45 5.9.5 DPCM/PCM Image Compression ....................................................................................................... 45 5.9.6 Output Formatting ............................................................................................................................... 45 5.10 General Purpose IO Control .................................................................................................................... 46 coasia / albert_yang at 2017.05.15SAMSUNG Confidential

Samsung Confidential 5.11 Wide Dynamic Range (WDR) Support .................................................................................................... 46 5.12 Dual Camera synchronization .................................................................................................................. 47 5.13 System ..................................................................................................................................................... 48 5.13.1 Clock System .................................................................................................................................... 48 5.13.2 Reset System ................................................................................................................................... 48 5.13.3 CPU Sub-System.............................................................................................................................. 48 5.13.4 CCI Slave .......................................................................................................................................... 48 5.13.5 Memory System ................................................................................................................................ 48 5.14 OTP Memory ............................................................................................................................................ 49 5.14.1 OTP Read/Write Procedure .............................................................................................................. 49 5.15 Test Pattern .............................................................................................................................................. 49 5.16 Output Data Interface ............................................................................................................................... 49 6 ELECTRICAL CHARACTERISTICS............................................................... 50 6.1 Absolute Maximum Rating ......................................................................................................................... 50 6.2 Operating Conditions ................................................................................................................................. 51 6.3 DC Characteristics ..................................................................................................................................... 52 6.4 AC Characteristics ..................................................................................................................................... 53 7 LENS SPECIFICATION (CRA : CHIEF RAY ANGLE SPEC.) ........................ 54 7.1 Target CRA ................................................................................................................................................ 54 7.2 Pixel-Shading characteristics ..................................................................................................................... 54 7.3 Spectral Response ..................................................................................................................................... 56 7.4 IR-cut filter selection .................................................................................................................................. 57 8 REGISTER DESCRIPTION ............................................................................ 58 8.1 Configuration Register ............................................................................................................................... 58 coasia / albert_yang at 2017.05.15SAMSUNG Confidential

Samsung Confidential List of Figures Title Page Number Figure Number Figure 1 Pad Configuration .................................................................................................................................. 13 Figure 2 Module Application Circuit Top View ..................................................................................................... 18 Figure 3 Pixel Array Information ........................................................................................................................... 19 Figure 4 System State Diagram ........................................................................................................................... 20 Figure 5 Power Up Sequence (Serial Output Case) ............................................................................................ 22 Figure 6 Power Down Sequence (Serial Output Case) ....................................................................................... 25 Figure 7 CCI Message Type ................................................................................................................................ 28 Figure 8 CCI Read Operation .............................................................................................................................. 29 Figure 9 CCI Write Operation ............................................................................................................................... 30 Figure 10 CCI Timing ........................................................................................................................................... 31 Figure 11 Function Block Diagram ....................................................................................................................... 33 Figure 12 Window of Interest on Pixel Array ........................................................................................................ 34 Figure 13 Horizontal Mirror and Vertical Flip........................................................................................................ 36 Figure 14 Example of Sub-Sampled Readout...................................................................................................... 37 Figure 15 Frame Format Example ....................................................................................................................... 38 Figure 16 Clock System Block Diagram ............................................................................................................... 40 Figure 17 Clock Relationships ............................................................................................................................. 41 Figure 18 PLL Frequency Synthesis .................................................................................................................... 42 Figure 19 Master Clock Waveform Diagram ........................................................................................................ 43 Figure 20 Dual Camera Synchronization ............................................................................................................. 47 Figure 21 Target CRA .......................................................................................................................................... 54 Figure 22 Shading Characteristics of Green ........................................................................................................ 55 Figure 23 Shading Characteristics of Color ratio ................................................................................................. 55 Figure 24 Spectral Response ............................................................................................................................... 56 Figure 25 Shading Characteristics of Color ratio ................................................................................................. 57 coasia / albert_yang at 2017.05.15SAMSUNG Confidential

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