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Wesentliche Merkmale
Anwendungen
Features
Applications
Grenzwerte (TA = 25 °C) Maximum Ratings
Kennwerte (TA = 25 °C) Characteristics
Directional Characteristics Srel = f (j)
Relative Spectral Sensitivity Srel = f (l)
Collector-Emitter Current ICE = f (VCE; EV)
Photocurrent IPCE = f (EV), VCE = 5 V
Photocurrent IPCE/IPCE(25 °C) = f (TA) Ev = 20 lx, VCE = 1 V º 5 V
Collector-Emitter Capacitance CCE = f (VCE)
Maßzeichnung Package Outlines
Empfohlenes Lötpaddesign Recommended Solderpad Design
NPN-Si-Fototransistor mit Vλ Charakteristik Silicon NPN Phototransistor with Vλ Characteristics Lead (Pb) Free Product - RoHS Compliant SFH 3410 Wesentliche Merkmale • Speziell geeignet für Anwendungen im Bereich Features Especially suitable for applications from von 350 nm bis 970 nm 350 nm to 970 nm Angepaßt an die Augenempfindlichkeit ( Vλ) SMT-Bauform ohne Basisanschluß, geeignet Adapted to human eye sensitivity ( Vλ) SMT package without base connection, für IR-Reflow-Löten Nur gegurtet lieferbar suitable for IR reflow soldering Only available on tape and reel Anwendungen Umgebungslicht-Detektor Beleuchtungsmesser Dimmungssensor für Hintergrundbeleuchtung „Messen/Steuern/Regeln“ Applications Ambient light detector Exposure meter for dayli ght and artificial light Sensor for Backlight-Dimming For control and drive circuits Typ Type Bestellnummer Ordering Code SFH 3410 SFH 3410-1/2 SFH 3410-2/3 SFH 3410-3/4 Q65110A1211 Q65110A2653 Q65110A2654 Q65110A2655 Fotostrom Ev = 20 lx, Standard light A, VCE = 5 V Photocurrent Ipce (μA) >3.2 3.2…10 5…16 8…25 2007-04-02 1
Grenzwerte (TA = 25 °C) Maximum Ratings Bezeichnung Parameter Betriebs- und Lagertemperatur Operating and storage temperature range Kollektor-Emitterspannung Collector-emitter voltage Kollektorstrom Collector current Emitter-Kollektorspannung Emitter-collector voltage Kennwerte (TA = 25 °C) Characteristics Bezeichnung Parameter Wellenlänge der max. Fotoempfindlichkeit Wavelength of max. sensitivity Spektraler Bereich der Fotoempfindlichkeit S = 10% von Smax Spectral range of sensitivity S = 10% of Smax Bestrahlungsempfindliche Fläche Radiant sensitive area Abmessung der Chipfläche Dimensions of chip area Halbwinkel Half angle Kapazität, VCE = 0 V, f = 1 MHz, E = 0 Capacitance Dunkelstrom Dark current VCE = 5 V Fotostrom Photocurrent Ev = 20 lx, Normlicht/standard light A, VCE = 5 V 2007-04-02 SFH 3410 Symbol Symbol Top; Tstg Wert Value – 40 … + 100 Einheit Unit °C VCE IC VEC 5.5 20 0.5 V mA V Symbol Symbol λSmax Wert Value 570 Einheit Unit nm 350 … 970 nm 0.29 mm2 0.75 × 0.75 mm × mm ± 60 3.9 3 (< 50) >3.2 Grad. deg. pF nA μA λ A L × B L × W ϕ CCE ICEO IPCE 2
SFH 3410 Wert Value Einheit Unit -1 -2 -3 -4 3.2…6.3 5…10 8…16 12.5…25 VCEsat 100 100 100 100 μA mV Bezeichnung Parameter Symbol Symbol IPCE Fotostrom Photocurrent Ev = 20 lx, Normlicht/standard light A VCE = 5 V Kollektor-Emitter-Sättigungsspannung Collector-emitter saturation voltage IC = IPCEmin 1) 1) × 0.3, EV = 20 lx IPCEmin ist der minimale Fotostrom der jeweiligen Gruppe IPCEmin is the min. photocurrent of the specified group 1) Directional Characteristics Srel = f (ϕ) 40 30 20 10 ϕ 0 1.0 OHF01402 50 60 70 80 90 100 1.0 0.8 0.6 0.4 0.8 0.6 0.4 0.2 0 0 20 40 60 80 100 120 2007-04-02 3
Relative Spectral Sensitivity Srel = f (λ) Photocurrent IPCE = f (EV), VCE = 5 V Collector-Emitter Capacitance CCE = f (VCE) SFH 3410 OHF00851 nm 1100 λ OHF00854 S rel 100 % 80 70 60 50 40 30 20 10 λV 0 400 500 600 700 800 900 Collector-Emitter Current ICE = f (VCE; EV) I CE 80 μ A 70 60 50 40 30 20 10 200 lx 100 lx 20 lx 1000 Aμ I PCE 100 10 OHF00852 4.0 pF CCE 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 1 1 10 100 1000 lx VE 1E-03 1E-02 1E-01 1E+00 1E+01 1E+02 V VCE Photocurrent IPCE/IPCE(25 °C) = f (TA) Ev = 20 lx, VCE = 1 V … 5 V OHF01024 1.8 I PCE IPCE (25 ˚C) 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 0 1 2 3 5 4 V CEV 0 -50 -30 -10 10 30 50 90 ˚C AT 2007-04-02 4
SFH 3410 Maßzeichnung Package Outlines 0.8 (0.031) 0.6 (0.024) Collector 0.8 (0.031) 0.4 (0.016) ) 6 0 1 . 0 ( 7 . 2 ) 8 9 0 . 0 ( 5 . 2 Emitter 1.1 (0.043) 0.9 (0.035) 2.1 (0.083) 1.9 (0.075) ) 3 4 0 . 0 ( 1 . 1 ) 8 2 0 . 0 ( 7 . 0 (not connected) 0.5 (0.020) 0.3 (0.012) 1.15 (0.045) 0.95 (0.037) ) 9 8 1 . 0 ( 8 . 4 ) 3 7 1 . 0 ( 4 . 4 ) 5 7 0 . 0 ( 9 . 1 ) 7 6 0 . 0 ( 7 . 1 0.1 (0.004) 0.0 (0.000) 0.3 (0.012) 0.2 (0.008) GEOY6028 Maße in mm (inch) / Dimensions in mm (inch). 2007-04-02 5
SFH 3410 Lötbedingungen Soldering Conditions Reflow Lötprofil für bleifreies Löten Reflow Soldering Profile for lead free soldering Vorbehandlung nach JEDEC Level 4 Preconditioning acc. to JEDEC Level 4 (nach J-STD-020C) (acc. to J-STD-020C) T 300 ˚C 250 200 150 100 50 0 0 Maximum Solder Profile Recommended Solder Profile Minimum Solder Profile OHLA0687 260 ˚C +0 ˚C -5 ˚C 245 ˚C ±5 ˚C +5 ˚C 235 ˚C -0 ˚C 10 s min 30 s max Ramp Down 6 K/s (max) 120 s max 100 s max min. condition for IR Reflow Soldering: solder point temperature ≥ 235 °C for at least 10 sec. 255 ˚C 240 ˚C 217 ˚C Ramp Up 3 K/s (max) 25 ˚C 50 100 150 200 250 s 300 t Empfohlenes Lötpaddesign Recommended Solderpad Design 3 . 1 1.8 2.4 1.8 Maße in mm (inch) / Dimensions in mm (inch). 1 Padgeometrie für verbesserte Wärmeableitung 3 . 0 Paddesign for improved heat dissipation OHF02393 2007-04-02 6
SFH 3410 Published by OSRAM Opto Semiconductors GmbH Wernerwerkstrasse 2, D-93049 Regensburg www.osram-os.com © All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 2007-04-02 7
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