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cd4011b(智能车电机驱动).pdf
Data sheet acquired from Harris Semiconductor
SCHS021D – Revised September 2003
The CD4011B, CD4012B, and CD4023B types
are supplied in 14-lead hermetic dual-in-line
ceramic packages
(F3A suffix), 14-lead
dual-in-line plastic packages (E suffix), 14-lead
small-outline packages (M, MT, M96, and NSR
suffixes), and 14-lead thin shrink small-outline
packages (PWR suffix). The CD4011B and
CD4023B types also are supplied in 14-lead thin
shrink small-outline packages (PW suffix).
Copyright © 2003, Texas Instruments Incorporated
www.ti.com
PACKAGING INFORMATION
PACKAGE OPTION ADDENDUM
25-Jan-2012
Orderable Device
Status (1) Package Type Package
Drawing
Pins
Package Qty
Eco Plan (2)
Lead/
Ball Finish
MSL Peak Temp (3)
Samples
(Requires Login)
89265AKB3T
89266AKB3T
89273AKB3T
CD4011BE
CD4011BEE4
CD4011BF
CD4011BF3A
CD4011BF3AS2534
CD4011BK3
CD4011BM
OBSOLETE
OBSOLETE
OBSOLETE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
OBSOLETE
OBSOLETE
ACTIVE
CFP
CFP
CFP
PDIP
PDIP
CDIP
CDIP
CDIP
CFP
SOIC
CD4011BM96
ACTIVE
SOIC
CD4011BM96E4
ACTIVE
SOIC
CD4011BM96G4
ACTIVE
SOIC
CD4011BME4
ACTIVE
SOIC
CD4011BMG4
ACTIVE
SOIC
CD4011BMT
ACTIVE
SOIC
CD4011BMTE4
ACTIVE
SOIC
CD4011BMTG4
ACTIVE
SOIC
CD4011BNSR
ACTIVE
CD4011BNSRE4
ACTIVE
CD4011BNSRG4
ACTIVE
SO
SO
SO
WR
WR
WR
N
N
J
J
J
WR
D
D
D
D
D
D
D
D
D
NS
NS
NS
14
16
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
TBD
TBD
TBD
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Pb-Free (RoHS)
Pb-Free (RoHS)
TBD
TBD
TBD
TBD
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
CU NIPDAU N / A for Pkg Type
CU NIPDAU N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
Call TI
Call TI
A42
A42
Call TI
Call TI
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
25
25
1
1
50
2500
2500
2500
50
50
250
250
250
2000
2000
2000
Addendum-Page 1
www.ti.com
25-Jan-2012
PACKAGE OPTION ADDENDUM
Orderable Device
Status (1) Package Type Package
Drawing
Pins
Package Qty
Eco Plan (2)
CD4011BPW
ACTIVE
TSSOP
CD4011BPWE4
ACTIVE
TSSOP
CD4011BPWG4
ACTIVE
TSSOP
CD4011BPWR
ACTIVE
TSSOP
CD4011BPWRE4
ACTIVE
TSSOP
CD4011BPWRG4
ACTIVE
TSSOP
CD4012BE
CD4012BEE4
CD4012BF3A
ACTIVE
ACTIVE
ACTIVE
CD4012BF3AS2534
OBSOLETE
CD4012BM
ACTIVE
PDIP
PDIP
CDIP
CDIP
SOIC
CD4012BM96
ACTIVE
SOIC
CD4012BM96E4
ACTIVE
SOIC
CD4012BM96G4
ACTIVE
SOIC
CD4012BME4
ACTIVE
SOIC
CD4012BMG4
ACTIVE
SOIC
CD4012BMT
ACTIVE
SOIC
CD4012BMTE4
ACTIVE
SOIC
CD4012BMTG4
ACTIVE
SOIC
PW
PW
PW
PW
PW
PW
N
N
J
J
D
D
D
D
D
D
D
D
D
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
90
90
90
2000
2000
2000
25
25
1
50
2500
2500
2500
50
50
250
250
250
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Pb-Free (RoHS)
Pb-Free (RoHS)
TBD
TBD
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Addendum-Page 2
Lead/
Ball Finish
MSL Peak Temp (3)
CU NIPDAU Level-1-260C-UNLIM
Samples
(Requires Login)
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU N / A for Pkg Type
CU NIPDAU N / A for Pkg Type
N / A for Pkg Type
Call TI
A42
Call TI
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
www.ti.com
25-Jan-2012
PACKAGE OPTION ADDENDUM
Orderable Device
Status (1) Package Type Package
Drawing
Pins
Package Qty
Eco Plan (2)
CD4012BNSR
ACTIVE
CD4012BNSRE4
ACTIVE
CD4012BNSRG4
ACTIVE
SO
SO
SO
CD4012BPWR
ACTIVE
TSSOP
CD4012BPWRE4
ACTIVE
TSSOP
CD4012BPWRG4
ACTIVE
TSSOP
CD4023BE
CD4023BEE4
CD4023BF
CD4023BF3A
ACTIVE
ACTIVE
ACTIVE
ACTIVE
CD4023BF3AS2534
OBSOLETE
CD4023BM
ACTIVE
PDIP
PDIP
CDIP
CDIP
CDIP
SOIC
CD4023BM96
ACTIVE
SOIC
CD4023BM96E4
ACTIVE
SOIC
CD4023BM96G4
ACTIVE
SOIC
CD4023BME4
ACTIVE
SOIC
CD4023BMG4
ACTIVE
SOIC
CD4023BMT
ACTIVE
SOIC
CD4023BMTE4
ACTIVE
SOIC
CD4023BMTG4
ACTIVE
SOIC
NS
NS
NS
PW
PW
PW
N
N
J
J
J
D
D
D
D
D
D
D
D
D
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
2000
2000
2000
2000
2000
2000
25
25
1
1
50
2500
2500
2500
50
50
250
250
250
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Pb-Free (RoHS)
Pb-Free (RoHS)
TBD
TBD
TBD
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Addendum-Page 3
Lead/
Ball Finish
MSL Peak Temp (3)
CU NIPDAU Level-1-260C-UNLIM
Samples
(Requires Login)
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU N / A for Pkg Type
CU NIPDAU N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
Call TI
A42
A42
Call TI
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com
25-Jan-2012
Orderable Device
Status (1) Package Type Package
Drawing
Pins
Package Qty
Eco Plan (2)
CD4023BNSR
ACTIVE
CD4023BNSRE4
ACTIVE
CD4023BNSRG4
ACTIVE
SO
SO
SO
CD4023BPW
ACTIVE
TSSOP
CD4023BPWE4
ACTIVE
TSSOP
CD4023BPWG4
ACTIVE
TSSOP
CD4023BPWR
ACTIVE
TSSOP
CD4023BPWRE4
ACTIVE
TSSOP
CD4023BPWRG4
ACTIVE
TSSOP
JM38510/05051BCA
JM38510/05052BCA
JM38510/05053BCA
M38510/05051BCA
M38510/05052BCA
M38510/05053BCA
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
CDIP
CDIP
CDIP
CDIP
CDIP
CDIP
NS
NS
NS
PW
PW
PW
PW
PW
PW
J
J
J
J
J
J
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
2000
2000
2000
90
90
90
2000
2000
2000
1
1
1
1
1
1
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
TBD
TBD
TBD
TBD
TBD
TBD
Lead/
Ball Finish
MSL Peak Temp (3)
CU NIPDAU Level-1-260C-UNLIM
Samples
(Requires Login)
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
A42
A42
A42
A42
A42
A42
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Addendum-Page 4
