eMMC 8GB~64GB IT & AIT & AAT Datasheet.pdf-资料库

SK hynix e-NAND Product Family eMMC5.1 Compatible - Automotive Rev 1.2 / Jul. 2016 1

Revision History Revision No. History Date Remark 0.1 1.0 1.1 1.2 - Preliminary - Official Release - Modification of Temperature values (p.5) and Active Power value of SDP(p.11) - Modification of PKG Ball Size Value Apr. 20, 2016 Jun. 07, 2016 Jul. 07, 2016 Jul. 20, 2016 Rev 1.2 / Jul. 2016 2

Table of Contents 1. Introduction ................................................................................................................. 4 1.1 General Description ............................................................................................................................................................. 4 1.2 Product Line-up ................................................................................................................................................................. 4 1.3 Key Features ...................................................................................................................................................................... 5 2. Package Configurations ................................................................................................ 6 2.1 Pin connection .................................................................................................................................................................... 6 2.2 Package Mechanical Drawing ............................................................................................................................................... 8 3. e-NAND Characteristics ............................................................................................... 10 3.1 Performance ..................................................................................................................................................................... 10 3.2 Power .............................................................................................................................................................................. 11 4. e-NAND new features (eMMC5.0 and eMMC5.1).......................................................... 13 4.1 eMMC5.0 New features............................................................................................................................................ 13 4.1.1 HS400 mode .................................................................................................................................................................. 13 4.1.2 Field firmware update ..................................................................................................................................................... 20 4.1.3 Health(Smart) report ...................................................................................................................................................... 23 4.1.4 Production state awareness ............................................................................................................................................. 24 4.1.5 Sleep notification ............................................................................................................................................................ 26 4.1.6 Secure removal type ....................................................................................................................................................... 27 4.2 eMMC5.1 New features............................................................................................................................................ 28 4.2.1 Command queuing ......................................................................................................................................................... 28 4.2.2 Cache barrier ................................................................................................................................................................. 32 4.2.3 Cache Flushing report ..................................................................................................................................................... 34 4.2.4 Background operation(BKOP) control ............................................................................................................................... 34 4.2.5 Secure Write Protection .................................................................................................................................................. 35 4.2.6 Enhanced strobe ............................................................................................................................................................ 40 4.2.7 RPMB throughput improvement ....................................................................................................................................... 44 5. e-NAND general parameters ....................................................................................... 45 5.1 Timing ............................................................................................................................................................................. 45 5.2 Bus signal ......................................................................................................................................................................... 50 5.3 Power mode ..................................................................................................................................................................... 54 5.4 Connection guide .............................................................................................................................................................. 58 6. e-NAND basic operations ............................................................................................. 59 6.1 Partitioning ....................................................................................................................................................................... 59 6.2 Boot operation .................................................................................................................................................................. 62 7. Timeout ....................................................................................................................... 63 8. Register ....................................................................................................................... 65 8.1 Operation conditions register (OCR) .................................................................................................................................... 65 8.2 Card identification (CID) register ......................................................................................................................................... 66 8.3 Card specific data register(CSD) ......................................................................................................................................... 66 8.4 Extended CSD register ....................................................................................................................................................... 69 8.5 RCA (Relative Card Address) ............................................................................................................................................... 75 8.6 DSR (Driver Stage Register) .............................................................................................................................................. 75 Rev 1.2 / Jul. 2016 3

1. Introduction 1.1 General Description SK hynix e-NAND consists of NAND flash and MMC controller. e-NAND has the built-in intelligent controller which manages interface protocols, wear leveling, bad block management, garbage col- lection, and ECC. e-NAND protects the data contents from the host sudden power off failure. e-NAND is compatible with JEDEC standard eMMC5.1 specification. 1.2 Product Line-up Device Density Part Number NAND Stack PKG Size (mm) Package Type AAT AIT IT CT 8GB 16GB 32GB 64GB 8GB 16GB 32GB 64GB 8GB 16GB 32GB 64GB 8GB 16GB 32GB 64GB H26M41208HPRQ H26M52208FPRQ H26M64208EMRQ H26M78208CMRQ H26M41208HPRA H26M52208FPRA H26M64208EMRA H26M78208CMRA H26M41208HPRI H26M52208FPRI H26M64208EMRI H26M78208CMRI H26M41208HPRN H26M52208FPRN H26M64208EMRN H26M78208CMRN 64Gb x 1 64Gb x 2 64Gb x 4 64Gb x 8 64Gb x 1 64Gb x 2 64Gb x 4 64Gb x 8 64Gb x 1 64Gb x 2 64Gb x 4 64Gb x 8 64Gb x 1 64Gb x 2 64Gb x 4 64Gb x 8 AAT (-40ºC ~ 105ºC) : Automotive grade Automotive Temperature device AIT (-40ºC ~ 85ºC) : Automotive grade Industrial Temperature device IT (-40ºC ~ 85ºC) : Industrial Temperature device CT (-25ºC ~ 85ºC) : Commercial Temperature device 11.5x13x0.8 11.5x13x0.8 11.5x13x1.0 11.5x13x1.0 11.5x13x0.8 11.5x13x0.8 11.5x13x1.0 11.5x13x1.0 11.5x13x0.8 11.5x13x0.8 11.5x13x1.0 11.5x13x1.0 11.5x13x0.8 11.5x13x0.8 11.5x13x1.0 11.5x13x1.0 153FBGA Rev 1.2 / Jul. 2016 4

1.3 Key Features • eMMC5.1 compatible (Backward compatible to eMMC4.5&eMMC5.0) • Bus mode - Data bus width : 1bit(default), 4bits, 8bits - Data transfer rate: up to 400MB/s (HS400) - MMC I/F Clock frequency : 0~200MHz - MMC I/F Boot frequency : 0~52MHz • Operating Voltage Range - Vcc (NAND) : 2.7V - 3.6V - Vccq (Controller) : 1.7V - 1.95V / 2.7V ~ 3.6V • Temperature - AAT(Ta) : -40ºC ~105ºC, Tc MAX =107ºC - AIT(Ta) : -40ºC ~ 85ºC, Tc MAX = 90ºC - IT(Ta) : -40ºC ~ 85ºC, Tc MAX = 90ºC - CT(Ta) : -25ºC ~ 85ºC, Tc MAX = 90ºC * The values for Ta and Tc mentioned above are measured from SK hynix’s test equipment. • Others - All products are compliance with the RoHS directive - All products are compliance with TS16949 - AAT/AIT products are compliance with AEC-Q100 • Supported Features - HS400, HS200 - HPI, BKOPS, BKOP operation control - Packed CMD, CMD queuing - Cache, Cache barrier, Cache flushing report - Partitioning, RPMB, RPMB throughput improve - Discard, Trim, Erase, Sanitize - Write protect, Secure write protection - Lock/Unlock - PON, Sleep/Awake - Reliable Write - Boot feature, Boot partition - HW/SW Reset - Field Firmware Update - Configurable driver strength - Health(Smart) report - Production state awareness - Secure removal type - Data Strobe pin, Enhanced data strobe (Bold features are added in eMMC5.1) - Do not support Extended Attribute scheme Rev 1.2 / Jul. 2016 5

2. Package Configurations 2.1 Pin connection 1 2 3 4 5 6 7 8 9 10 11 12 13 14 NC NC DAT0 DAT1 DAT2 Vss RFU NC NC NC NC NC NC NC NC DAT3 DAT4 DAT5 DAT6 DAT7 NC NC NC NC NC NC NC NC NC VDDi NC Vssq NC Vccq NC NC NC NC NC NC NC NC NC Index NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC RFU NC NC NC NC NC NC NC NC RFU Vcc Vss VSF VSF Vcc Vss DS VSS VSF VSF VSF Vss Vcc RSTN RFU RFU Vss Vcc VSF NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC Vccq CMD CLK NC Vssq NC Vccq Vssq NC NC NC NC NC NC NC NC NC NC NC NC NC Vccq Vssq Vccq Vssq NC NC NC VSF NC NC A B C D E F G H J K L M N P [Figure 1] FBGA153 Package Connection (Top view through Package) Pin number A3 A4 A5 A6 B2 B3 B4 B5 B6 C2 Name DAT0 DAT1 DAT2 Vss DAT3 DAT4 DAT5 DAT6 DAT7 VDDi Pin number C4 C6 E6 E7 E8 E9 E10 F5 F10 G5 Name Vssq Vccq Vcc Vss VSF VSF VSF Vcc VSF Vss Pin number G10 H5 H10 J5 J10 K5 K8 K9 K10 M4 Name VSF DS Vss Vss Vcc RSTN Vss Vcc VSF Vccq Pin number M5 M6 N2 N4 N5 P3 P4 P5 P6 P10 Name CMD CLK Vssq Vccq Vssq Vccq Vssq Vccq Vssq VSF Rev 1.2 / Jul. 2016 6

Name CLK Type Input CMD Input I/O I/O I/O I/O I/O I/O I/O I/O Input Supply Supply Supply Supply Out put Supply DAT0 DAT1 DAT2 DAT3 DAT4 DAT5 DAT6 DAT7 RSTN Vcc Vccq Vss Vssq VDDi DS VSF RFU Ball No. Description M6 M5 A3 A4 A5 B2 B3 B4 B5 B6 K5 E6,F5,J10,K9 C6,M4,N4,P3,P5 A6,E7,G5,H10,J5,K8 C4,N2,N5,P4,P6 C2 H5 Clock: Each cycle directs a 1-bit transfer on the command and DAT lines. Command: A bidirectional channel used for device initialization and command transfers. Command has two operating modes: 1) Open-drain for initialization. 2) Push-pull for fast command transfer. Data I/O0: Bidirectional channel used for data transfer. Data I/O1: Bidirectional channel used for data transfer. Data I/O2: Bidirectional channel used for data transfer. Data I/O3: Bidirectional channel used for data transfer. Data I/O4: Bidirectional channel used for data transfer. Data I/O5: Bidirectional channel used for data transfer. Data I/O6: Bidirectional channel used for data transfer. Data I/O7: Bidirectional channel used for data transfer. Reset signal pin Vcc: Flash memory I/F and Flash memory power supply. Vccq: Memory controller core and MMC interface I/O power supply. Vss: Flash memory I/F and Flash memory ground connection. Vssq: Memory controller core and MMC I/F ground connection VDDi: Connect 0.1uF capacitor from VDDi to ground. DS: Data Strobe E8,E9,E10,F10, G10, K10, P10 VSF: Vendor Specific Function SK hynix use E9, E10 Pin as VSF Pin Reserved for future use [Table 1] FBGA153 Ball Description Rev 1.2 / Jul. 2016 7

2.2 Package Mechanical Drawing 2.2.1 11.5mm x13.0mm x0.8mm Top view Bottom view 11.500±0.100 A1 INDEX MARK 0 0 1 . 0 ± 0 0 7 . 0 0 5 0 . 0 ± 0 0 2 . 0 B A 0 0 1 . 0 ± 0 0 0 . 3 1 SEATING PLANE C 0.08 C <11.500> 0.300 0 0 3 . 0 I > E N L T U O G K P < > 0 0 . 3 1 < 0 0 5 . 6 = 3 1 x H C T P 0 0 5 I . 0 I > H C T P < 0 0 5 . 0 0 0 5 > H C T P < I . 0 0 0 5 , 8 ) 0 5 0 0 5 0 0.500 0.500 0.500 PITCH x 13 = 6.500 8,500 . 0 ± 0 0 3 . 0 Ø x 3 5 1 B A C M 5 1 . 0 Ø . 0 ± 0 2 3 . 0 Ø x 3 5 1 w o l f e R t s o P ( [Figure 2] 11.5mm x 13.0mm x 0.8mm Package dimension Rev 1.2 / Jul. 2016 8

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eMMC 8GB~64GB IT & AIT & AAT Datasheet.pdf

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