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XR872_Datasheet_V0.1.pdf
Declaration
Revision History
Contents
Tables
Figures
1 Overview
1.1 General Description
1.2 Features
1.3 Application
1.4 Block Diagram
2 Function Description
2.1 System Overview
2.1.1 Power Management
2.1.2 Clock and Reset
2.1.2.1 Clock
2.1.2.2 Reset
2.1.3 Power State and Power Sequence
2.1.3.1 Power-on Sequences
2.1.3.2 Wakeup from Standby
2.1.3.3 Wakeup from Hibernation
2.1.3.4 Shutdown Sequence
2.1.4 Memory Mapping
2.1.5 CPU
2.1.6 DMA
2.1.7 Cache
2.1.8 Crypto Engine
2.1.9 Timer
2.1.10 RTC
2.2 Peripherals
2.2.1 GPIO
2.2.2 UART
2.2.3 SPI
2.2.4 TWI
2.2.5 PWM
2.2.6 SD/MMC/SDIO
2.2.7 CIR
2.2.8 GPADC
2.2.9 I2S
2.3 Video Subsystem
2.3.1 CSI
2.3.2 JPEG
2.4 AUDIO Subsystem
2.4.1 DMIC
2.4.2 AUDIO CODEC
2.5 Wi-Fi Subsystem
2.5.1 Wi-Fi MAC
2.5.2 Wi-Fi Baseband
2.5.3 Wi-Fi Radio
2.5.4 Front End Module Control
3 Electrical Characteristics
3.1 Absolute Maximum Ratings
3.2 Recommended Operating Conditions
3.3 Digital IO Characteristics
3.4 Bootstrap Modes and Pins
3.5 High Frequency Reference Clock
3.6 Low Frequency Reference Clock
3.7 Audio Codec Specifications
3.8 Wi-Fi 2.4G RF Receiver Specifications
3.9 Wi-Fi 2.4G RF Transmitter Specifications
3.10 Power Consumption
4 Package Specifications
4.1 Pin Layout
4.2 Pin Descriptions
4.3 Package Information
4.4 Package Thermal Characteristics
5 Carrier Information
6 Application Circuit
XR872 Datasheet
High Performance Wireless MCU for Artificial Intelligence
and Internet of Things (AIoT) Applications
Revision 0.1
Jun. 23, 2019
Copyright @2019 Xradio Technology Co., Ltd. All Rights Reserved
Declaration
THIS DOCUMENTATION IS THE ORIGINAL WORK AND COPYRIGHTED PROPERTY OF XRADIO TECHNOLOGY
(“XRADIO”). REPRODUCTION IN WHOLE OR IN PART MUST OBTAIN THE WRITTEN APPROVAL OF XRADIO AND GIVE
CLEAR ACKNOWLEDGEMENT TO THE COPYRIGHT OWNER.
THE PURCHASED PRODUCTS, SERVICES AND FEATURES ARE STIPULATED BY THE CONTRACT MADE BETWEEN
XRADIO AND THE CUSTOMER. PLEASE READ THE TERMS AND CONDITIONS OF THE CONTRACT AND RELEVANT
INSTRUCTIONS CAREFULLY BEFORE USING, AND FOLLOW THE INSTRUCTIONS IN THIS DOCUMENTATION STRICTLY.
XRADIO ASSUMES NO RESPONSIBILITY FOR THE CONSEQUENCES OF IMPROPER USE (INCLUDING BUT NOT
LIMITED TO OVERVOLTAGE, OVERCLOCK, OR EXCESSIVE TEMPERATURE).
THE INFORMATION FURNISHED BY XRADIO IS PROVIDED JUST AS A REFERENCE OR TYPICAL APPLICATIONS, ALL
STATEMENTS, INFORMATION, AND RECOMMENDATIONS IN THIS DOCUMENT DO NOT CONSTITUTE A WARRANTY
OF ANY KIND, EXPRESS OR IMPLIED. XRADIO RESERVES THE RIGHT TO MAKE CHANGES IN CIRCUIT DESIGN
AND/OR SPECIFICATIONS AT ANY TIME WITHOUT NOTICE.
NOR FOR ANY INFRINGEMENTS OF PATENTS OR OTHER RIGHTS OF THE THIRD PARTIES WHICH MAY RESULT FROM
ITS USE. NO LICENSE IS GRANTED BY IMPLICATION OR OTHERWISE UNDER ANY PATENT OR PATENT RIGHTS OF
XRADIO.THIRD PARTY LICENCES MAY BE REQUIRED TO IMPLEMENT THE SOLUTION/PRODUCT. CUSTOMERS SHALL
BE SOLELY RESPONSIBLE TO OBTAIN ALL APPROPRIATELY REQUIRED THIRD PARTY LICENCES. XRADIO SHALL NOT BE
LIABLE FOR ANY LICENCE FEE OR ROYALTY DUE IN RESPECT OF ANY REQUIRED THIRD PARTY LICENCE. XRADIO
SHALL HAVE NO WARRANTY, INDEMNITY OR OTHER OBLIGATIONS WITH RESPECT TO MATTERS COVERED UNDER
ANY REQUIRED THIRD PARTY LICENCE.
Copyright @2019 Xradio Technology Co., Ltd. All Rights Reserved Page 2
Revision History
Version
Data
Summary of Changes
0.1
2019-6-23
Initial Version
Copyright @2019 Xradio Technology Co., Ltd. All Rights Reserved Page 3
Contents
Declaration .................................................................................................................................................................... 2
Revision History ............................................................................................................................................................ 3
Contents ........................................................................................................................................................................ 4
Tables ............................................................................................................................................................................ 4
Figures .......................................................................................................................................................................... 8
1 Overview .................................................................................................................................................................... 9
1.1 General Description ........................................................................................................................................ 9
1.2 Features .......................................................................................................................................................... 9
1.3 Application .................................................................................................................................................... 12
1.4 Block Diagram ............................................................................................................................................... 13
2 Function Description ................................................................................................................................................ 14
2.1 System Overview ........................................................................................................................................... 14
2.1.1 Power Management .......................................................................................................................... 14
2.1.2 Clock and Rest .................................................................................................................................... 15
2.1.3 Power State and Power Sequence ..................................................................................................... 17
2.1.4 Memory Mapping .............................................................................................................................. 19
2.1.5 CPU .................................................................................................................................................... 20
2.1.6 DMA ................................................................................................................................................... 21
2.1.7 Cache ................................................................................................................................................. 21
2.1.8 Crypto Engine ..................................................................................................................................... 22
2.1.9 Timer .................................................................................................................................................. 22
2.1.10 RTC ................................................................................................................................................... 22
2.2 Peripherals .................................................................................................................................................... 23
2.2.1 GPIO ................................................................................................................................................... 23
2.2.2 UART .................................................................................................................................................. 26
2.2.3 SPI ...................................................................................................................................................... 26
2.2.4 TWI ..................................................................................................................................................... 27
Copyright @2019 Xradio Technology Co., Ltd. All Rights Reserved Page 4
2.2.5 PWM .................................................................................................................................................. 27
2.2.6 SD/MMC/SDIO ................................................................................................................................... 28
2.2.7 CIR ...................................................................................................................................................... 28
2.2.8 GPADC ................................................................................................................................................ 29
2.2.9 I2S ...................................................................................................................................................... 29
2.3 Video Subsystem .......................................................................................................................................... 30
2.3.1 CSI ...................................................................................................................................................... 30
2.3.2 JPEG ................................................................................................................................................... 30
2.4 AUDIO Subsystem ......................................................................................................................................... 31
2.4.1 DMIC .................................................................................................................................................. 31
2.4.2 AUDIO CODEC .................................................................................................................................... 31
2.5 Wi-Fi Subsystem ........................................................................................................................................... 32
2.5.1 Wi-Fi MAC .......................................................................................................................................... 32
2.5.2 Wi-Fi Baseband .................................................................................................................................. 32
2.5.3 Wi-Fi Radio ........................................................................................................................................ 33
2.5.4 Front End Module Control ................................................................................................................. 33
3 Electrical Characteristics .......................................................................................................................................... 34
3.1 Absolute Maximum Ratings .......................................................................................................................... 34
3.2 Recommended Operating Conditions ........................................................................................................... 35
3.3 Digital IO Characteristics ............................................................................................................................... 35
3.4 Bootstrap Modes and Pins ............................................................................................................................ 36
3.5 High Frequency Reference Clock .................................................................................................................. 37
3.6 Low Frequency Reference Clock ................................................................................................................... 37
3.7 Audio Codec Specifications ........................................................................................................................... 39
3.8 Wi-Fi 2.4G RF Receiver Specifications .......................................................................................................... 40
3.9 Wi-Fi 2.4G RF Transmitter Specifications ...................................................................................................... 41
3.10 Power Consumption ...................................................................................................................................44
4 Package Specifications ............................................................................................................................................. 47
4.1 Pin Layout ..................................................................................................................................................... 47
Copyright @2019 Xradio Technology Co., Ltd. All Rights Reserved Page 5
4.2 Pin Descriptions ............................................................................................................................................ 49
4.3 Package Information ..................................................................................................................................... 51
4.4 Package Thermal Characteristics .................................................................................................................. 52
5 Carrier Information .................................................................................................................................................. 53
6 Application Circuit .................................................................................................................................................... 54
Copyright @2019 Xradio Technology Co., Ltd. All Rights Reserved Page 6
Tables
Table 1-1 XR872 Features ............................................................................................................................................. 9
Table 2-1 Power Management States ........................................................................................................................ 14
Table 2-2 SRAM Memory Mapping ............................................................................................................................ 19
Table 2-3 XR872AT GPIO Multiplexing ....................................................................................................................... 24
Table 3-1 Absolute Maximum Ratings ....................................................................................................................... 34
Table 3-2 Recommended Operating Conditions ........................................................................................................ 35
Table 3-3 DC Characteristics of VDD_IO=3.3V ........................................................................................................... 35
Table 3-4 DC Characteristics of VDD_IO=1.8V ........................................................................................................... 35
Table 3-5 Bootstrap pins ............................................................................................................................................ 36
Table 3-6 External High Frequency Crystal Characteristics Requirements ................................................................ 37
Table 3-7 External Low Frequency Crystal Characteristics Requirements ................................................................. 37
Table 3-8 ADC Specifications ...................................................................................................................................... 39
Table 3-9 Line-in Specifications .................................................................................................................................. 39
Table 3-10 DAC Specifications .................................................................................................................................... 39
Table 3-11 RF Receiver Specifications ........................................................................................................................ 40
Table 3-12 RF Transmitter Specifications 1 ................................................................................................................ 41
Table 3-13 RF Transmitter Specifications 2 ................................................................................................................ 42
Table 3-14 RF Transmitter Specifications 3 ................................................................................................................ 43
Table 3-15 Power Consumption 1 .............................................................................................................................. 44
Table 3-16 Power Consumption 2 .............................................................................................................................. 45
Table 4-1 Pin Description ........................................................................................................................................... 49
Table 4-2 QFN52 Package Thermal Characteristics .................................................................................................... 52
Table 4-3 QFN40 Package Thermal Characteristics .................................................................................................... 52
Copyright @2019 Xradio Technology Co., Ltd. All Rights Reserved Page 7
Figures
Figure 1-1 XR872 Functional Block Diagram .............................................................................................................. 13
Figure 2-1 Power Architecture ................................................................................................................................... 15
Figure 2-2 Clock Control ............................................................................................................................................ 16
Figure 2-3 Power-on Sequence .................................................................................................................................. 17
Figure 2-4 Memory Mapping ..................................................................................................................................... 19
Figure 2-5 SPI Phase 0 Transfer Format ..................................................................................................................... 26
Figure 2-6 SPI Phase 1 Transfer Format ..................................................................................................................... 27
Figure 2-7 FEM Control Application Diagram ............................................................................................................ 33
Figure 4-1 XR872AT Pin Layout .................................................................................................................................. 47
Figure 4-2 XR872ET Pin Layout .................................................................................................................................. 48
Figure 4-3 QFN52 Package Outline Drawing .............................................................................................................. 51
Figure 4-4 QFN40 Package Outline Drawing .............................................................................................................. 51
Figure 6-1 Reference Design of XR872AT ................................................................................................................... 54
Copyright @2019 Xradio Technology Co., Ltd. All Rights Reserved Page 8
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