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CompactPCI ® Express Specification Revision 2.0.pdf
CompactPCI® Express Specification
Contents
History
Introduction 1
1.1 Statement of Compliance
1.2 Terminology
1.3 Applicable Documents
1.4 Objectives
1.5 Name and Logo Usage
1.6 Signal Naming Conventions
1.7 Intellectual Property
1.8 Special Word Usage
1.9 Connectors
1.9.1 Legacy CompactPCI Connectors
1.9.2 High-Speed Advanced Differential Fabric Connectors
1.9.3 High-Speed Advanced Differential Plus Fabric Connectors
1.9.4 UPM Power Connectors
1.9.4.1 System Slot/Board and Type 1 Peripheral Slot/Board
1.9.4.2 Switch Slot/Board
1.9.5 eHM Connector
1.9.6 CompactPCI Pluggable Power Supply Connector
1.10 Slot and Board Descriptions
1.10.1 Connector Reference Designators
1.10.2 System Slot and Board
1.10.3 Type 1 Peripheral Slot and Board
1.10.4 Type 2 Peripheral Slot and Board
1.10.5 Hybrid Peripheral Slot
1.10.6 Legacy Slot
1.10.7 Switch Slot and Board
1.10.7.1 3U Switch Slot and Board
1.10.7.2 6U Switch Slot and Board
1.11 Example Configurations
Mechanical Requirements 2
2.1 Mechanical Overview
2.2 Drawing Standard
2.3 Units
2.4 Keepout Zones
2.5 Connector Requirements
2.5.1 Advanced Differential Fabric (ADF) Connectors
2.5.1.1 Board Connectors
2.5.1.2 Backplane Connectors without Hot-Plug Support
2.5.1.3 Backplane Connectors with Hot-Plug Support
2.5.2 Advanced Differential Fabric Plus (ADFplus) Connector
2.5.3 eHM Connectors
2.5.3.1 Board Connector Type Designation
2.5.3.2 Backplane Connectors without Hot-Plug Support
2.5.3.3 Backplane Connectors with Hot-Plug Support
2.5.4 UPM Connectors
2.5.4.1 Backplane Connectors
2.5.4.2 Board Connectors without Hot-Plug Support
2.5.4.3 Board Connectors with Hot-Plug Support
2.5.5 HM Connectors
2.5.6 47-Position Pluggable Power Supply Connector
2.6 Chassis Subrack Requirements
2.7 Backplane Requirements
2.7.1 3U Backplane Dimensions and Connector Locations
2.7.2 6U Backplane Dimensions and Connector Locations
2.8 Slot Numbering and Glyphs
2.9 Board Requirements
2.9.1 3U System/Type 1/Type 2 Board Dimensions and Connector Locations
2.9.2 6U System/Type 1/Type 2 Board Dimensions and Connector Locations
2.9.3 3U Switch Board Dimensions and Connector Locations
2.9.4 6U Switch Board Dimensions and Connector Locations
2.9.5 Board PCB Thickness
2.9.6 ESD Discharge Strip
2.9.7 ESD Clip
2.9.8 Front Panels
2.9.9 CompactPCI Express Logo
2.9.10 PMC/XMC Support
2.9.11 Cross Sectional View
2.9.12 Component Outline and Warpage
2.9.13 Solder Side Cover (Optional)
2.9.14 Component Heights
2.9.15 System Slot Identification
2.10 Rear-Panel I/O Board Requirements
2.10.1 3U Rear-Panel I/O Board Dimensions
2.10.2 6U Rear-Panel I/O Board Dimensions
Electrical Requirements 3
3.1 Signal Definitions
3.1.1 PCI Express Signals
3.1.1.1 PCI Express Transmit Signals
3.1.1.2 PCI Express Receive Signals
3.1.1.3 Interconnect Definition
3.1.1.4 Electrical Budgets
3.1.1.5 Jitter Budget Allocation
3.1.1.6 Eye Patterns
3.1.1.7 Receiver Tolerance Testing
3.1.1.8 Reference Clock
3.1.2 ESD
3.1.3 5 Vaux
3.1.4 SMBus
3.1.4.1 SMBus “Back Powering” Considerations
3.1.4.2 Backplane Identification and Capability Using SMBus
3.1.5 PWRBTN# Signal
3.1.6 PS_ON# Signal
3.1.7 PWR_OK Signal
3.1.8 WAKE# Signal
3.1.8.1 Implementation Note
3.1.9 PERST# Signal
3.1.9.1 Initial Power-Up (G3 to L0)
3.1.9.2 Power Management States (S0 to S3/S4 to S0)
3.1.9.3 Power Down
3.1.10 SYSEN# Signal
3.1.11 Geographical Addressing
3.1.12 LINKCAP Signal
3.1.13 I/O Pins
3.1.14 Reserved Pins
3.2 Hot-Plug Support
3.2.1 Hot-Plug Sub-System Architecture
3.2.2 Power Enable
3.2.3 Wake#
3.2.4 Module Power Good
3.2.5 Present Detection
3.2.6 System Management Bus
3.2.7 System Management Bus Alert
3.2.8 Attention LED
3.2.9 Attention Switch
3.2.10 DC Specifications
3.3 Backplane Connector Pin Assignments
3.3.1 System Slot
3.3.1.1 4-Link Configuration
3.3.1.2 2-Link Combination Configuration
3.3.2 Peripheral Slot Type 1
3.3.3 Peripheral Slot Type 2
3.3.4 Hybrid Peripheral Slot
3.3.5 Legacy Slot
3.3.6 Switch Slot
3.3.6.1 3U Switch Slot
3.3.6.2 6U Switch Slot—x4 Link Width
3.3.6.3 6U Switch Slot—x8 Link Width
3.4 Power Supply Requirements
3.4.1 Current Available
3.4.2 Regulation and Ripple and Noise
3.4.3 Backplane Power Decoupling
3.4.4 Power Supply Timing
3.4.5 Additional Power Requirements for Boards Supporting Hot-Plug
Keying Requirements 4
4.1 Legacy Slots and Legacy Boards
4.2 eHM Keying
CompactPCI Express Advanced Differential Fabric Connector A
A.1 General Data
A.1.1 Objective of this Document
A.1.2 Scope
A.1.3 Intended Method of Mounting
A.1.4 Ratings and Characteristics
A.1.5 Normative References
A.1.6 Markings
A.1.7 Type Designation
A.1.8 Ordering Information
A.1.9 Special Connector Loadings
A.2 Technical Information
A.2.1 Contacts and Terminations
A.3 Dimensional Information
A.3.1 Isometric View and Common Features
A.3.2 Engagement Information
A.3.2.1 Electrical Engagement Length
A.3.2.2 First Contact Point
A.3.2.3 Perpendicular to Engagement Direction
A.3.2.4 Inclination
A.3.3 Backplane Connectors
A.3.3.1 Dimensions
A.3.3.2 Contacts
A.3.3.3 Contact Tip Geometry
A.3.3.4 Terminations
A.3.4 Front Board Connectors
A.3.4.1 Dimensions
A.3.4.2 Terminations
A.3.5 Mounting Information for Backplane Connectors
A.3.5.1 Hole Pattern on Backplanes
A.3.5.2 Backplane Contact Positional Requirements
A.3.5.3 True Position of Male Contacts
A.3.6 Mounting Information for Front Board Connectors
A.3.6.1 Hole Pattern on Printed Boards
A.4 Characteristics
A.4.1 Climatic Category
A.4.1.1 Climatic Category Test Batch P: Initial Examination
A.4.1.2 Climatic Category Test Batch A: Mechanical Tests
A.4.1.3 Climatic Category Test Batch B: Harsh Environments
A.4.1.4 Climatic Category Test Batch C: Damp Heat
A.4.1.5 Climatic Category Test Batch D: Extended Environmental Tests
A.4.1.6 Climatic Category Test Batch E: Extended Environmental Tests
A.4.2 Electrical Characteristics
A.4.2.1 Impedance
A.4.2.2 Crosstalk
A.4.2.3 Propagation Delay
A.4.2.4 Differential Skew
A.4.2.5 Insertion Loss
Enriched Hard-Metric Connector B
B.1 General Data
B.1.1 Objective of this Document
B.1.2 Description of the Connector’s Approach
B.1.3 Descriptive Partitions Found Further This Document
B.1.4 Normative References
B.1.4.1 Primary References Describing the Generic Part of the Connector
B.1.4.2 Additional References
B.1.5 Intended Method of Mounting
B.1.6 Markings
B.1.7 Type Designation (General)
B.2 Technical Information
B.2.1 Definitions
B.2.2 Contacts
B.2.3 Contact Performance Level
B.2.4 Keying
B.2.4.1 Mating Rules
B.2.4.2 Examples for Mating and Nonmating Configurations
B.2.5 Type Designation
B.2.6 Applicational Information
B.2.6.1 Alignment and Gathering
B.2.6.2 Polarization
B.3 Dimensional Information
B.3.1 General
B.3.2 View and Common Features
B.3.3 Remarks on Mating Properties of eHM Connector
B.3.4 Fixed Board Connector
B.3.4.1 Dimensions
B.3.4.2 Terminations
B.3.4.3 Mounting Information for Fixed Board Connectors
B.3.4.4 Hole Pattern on Fixed Board
B.3.4.5 Position of Connectors on Fixed Board
B.3.5 Free Board Connectors
B.3.5.1 Dimensions
B.3.5.2 Terminations
B.3.5.3 Mounting Information for Free Board Connectors
B.3.5.4 Hole Pattern on Free Board
B.3.5.5 Position of Connectors on Front Board
B.4 Characteristics
B.4.1 Climatic Category
B.4.2 Electrical Characteristics
B.4.2.1 Creepage and Clearance Distances
B.4.2.2 Voltage Proof
B.4.2.3 Current-Carrying Capacity
B.4.2.4 Contact Resistance
B.4.2.5 Insulation Resistance
B.4.3 Mechanical
B.4.3.1 Mechanical Operation
B.4.3.2 Engaging and Separating Forces
B.4.3.3 Contact Retention in Insert
B.4.3.4 Static Load, Transverse
B.4.3.5 Gauge Retention Force
B.4.3.6 Vibration (Sinusoidal)
B.4.3.7 Shock
B.4.3.8 Polarization Method
B.4.3.9 Robustness and Effectiveness of Coding Device
B.5 Test Schedule
B.6 Quality Assessment Procedures
Universal Power Connector (UPM) C
C.1 General Data
C.1.1 Objective of this Document
C.2 Dimensions
C.3 Perpendicular to Engagement Direction
C.4 Inclination
C.5 Mounting Information
C.6 Climatic Category
Advanced Differential Fabric Plus (ADFplus) Connectors D
D.1 General data
D.1.1 Objective of this document
D.1.2 Scope
D.1.3 Intended Method of Mounting
D.1.4 Ratings and Characteristics
D.1.5 Normative References
D.1.6 Markings
D.1.7 Type Designation and Ordering Information
D.2 Technical Information
D.2.1 Contacts and Terminations
D.3 Dimensional Information
D.3.1 General Isometric View and Common Features
D.3.2 Engagement Information
D.3.3 Backplane Connectors
D.3.4 Front Board Connectors
D.3.4.1 Dimensions
D.3.4.2 Terminations
D.3.5 Mounting Information for Backplane Connectors
D.3.6 Mounting Information for ADFplus Front Board Connectors
D.3.6.1 Hole Pattern for Printed Circuit Boards
D.4 Characteristics
D.4.1 Climatic Category
D.4.2 Electrical Characteristics
D.4.2.1 Impedance
D.4.2.2 Crosstalk
D.4.2.3 Insertion Loss
D.4.2.4 Propagation Delay
D.4.2.5 Intra-Pair Skew (Differential Skew)
PICMG® EXP.0 Revision 2.0
CompactPCI® Express Specification
March 22, 2013
Open Modular
Computing Specifications
© Copyright 2013, PCI Industrial Computer Manufacturers Group. The attention of adopters is directed to the possibility that compliance with or
adoption of PICMG® specifications may require use of an invention covered by patent rights. PICMG® shall not be responsible for identifying patents
for which a license may be required by any PICMG® specification or for conducting legal inquiries into the legal validity or scope of those patents that
are brought to its attention. PICMG® specifications are prospective and advisory only. Prospective users are responsible for protecting themselves
against liability for infringement of patents.
NOTICE:
The information contained in this document is subject to change without notice. The material in this document details a PICMG® specification in
accordance with the license and notices set forth on this page. This document does not represent a commitment to implement any portion of this
specification in any company's products.
WHILE THE INFORMATION IN THIS PUBLICATION IS BELIEVED TO BE ACCURATE, PICMG® MAKES NO WARRANTY OF ANY KIND,
EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL INCLUDING, BUT NOT LIMITED TO, ANY WARRANTY OF TITLE OR OWNERSHIP,
IMPLIED WARRANTY OF MERCHANTABILITY OR WARRANTY OF FITNESS FOR PARTICULAR PURPOSE OR USE.
In no event shall PICMG® be liable for errors contained herein or for indirect, incidental, special, consequential, reliance or cover damages, including
loss of profits, revenue, data or use, incurred by any user or any third party. Compliance with this specification does not absolve manufacturers of
equipment from the requirements of safety and regulatory agencies (UL, CSA, FCC, IEC, etc.).
IMPORTANT NOTICE:
This document includes references to specifications, standards or other material not created by PICMG. Such referenced materials will typically have
been created by organizations that operate under IPR policies with terms that vary widely, and under process controls with varying degrees of
strictness and efficacy. PICMG has not made any enquiry into the nature or effectiveness of any such policies, processes or controls, and therefore
ANY USE OF REFERENCED MATERIALS IS ENTIRELY AT THE RISK OF THE USER. Users should therefore make such investigations regarding
referenced materials, and the organizations that have created them, as they deem appropriate.
PICMG®, CompactPCI®, AdvancedTCA®, AdvancedTCA® 300,ATCA®, ATCA® 300, AdvancedMC®, CompactPCI® Express, COM Express®, SHB
Express®, and the PICMG, CompactPCI, AdvancedTCA, µTCA and ATCA logos are registered trademarks, and MicroTCA™, xTCA™, IRTM™ and
the IRTM logo are trademarks of the PCI Industrial Computer Manufacturers Group. All other brand or product names may be trademarks or
registered trademarks of their respective holders.
PICMG® EXP.0 CompactPCI Express Specification R2.0, March 22, 2013
Contents
1
2
Introduction ..........................................................................................................15
Statement of Compliance ............................................................................15
1.1
Terminology.................................................................................................15
1.2
1.3
Applicable Documents.................................................................................20
Objectives....................................................................................................21
1.4
Name and Logo Usage ...............................................................................22
1.5
Signal Naming Conventions ........................................................................23
1.6
1.7
Intellectual Property.....................................................................................23
Special Word Usage....................................................................................24
1.8
Connectors ..................................................................................................24
1.9
1.9.1
Legacy CompactPCI Connectors ...................................................24
1.9.2 High-Speed Advanced Differential Fabric Connectors...................25
1.9.3 High-Speed Advanced Differential Plus Fabric Connectors...........27
1.9.4 UPM Power Connectors.................................................................28
System Slot/Board and Type 1 Peripheral Slot/Board....28
1.9.4.1
Switch Slot/Board ...........................................................29
1.9.4.2
1.9.5
eHM Connector ..............................................................................30
1.9.6 CompactPCI Pluggable Power Supply Connector .........................30
1.10 Slot and Board Descriptions........................................................................31
1.10.1 Connector Reference Designators .................................................34
1.10.2 System Slot and Board...................................................................34
1.10.3 Type 1 Peripheral Slot and Board ..................................................35
1.10.4 Type 2 Peripheral Slot and Board ..................................................36
1.10.5 Hybrid Peripheral Slot ....................................................................38
1.10.6 Legacy Slot.....................................................................................39
1.10.7 Switch Slot and Board ....................................................................39
1.10.7.1 3U Switch Slot and Board...............................................39
1.10.7.2 6U Switch Slot and Board...............................................40
1.11 Example Configurations ..............................................................................43
Mechanical Requirements ..................................................................................48
2.1 Mechanical Overview ..................................................................................48
2.2
Drawing Standard........................................................................................48
Units ............................................................................................................48
2.3
Keepout Zones ............................................................................................48
2.4
Connector Requirements ............................................................................48
2.5
2.5.1
Advanced Differential Fabric (ADF) Connectors ............................48
Board Connectors...........................................................48
2.5.1.1
Backplane Connectors without Hot-Plug Support ..........49
2.5.1.2
2.5.1.3
Backplane Connectors with Hot-Plug Support ...............49
Advanced Differential Fabric Plus (ADFplus) Connector................49
eHM Connectors ............................................................................49
Board Connector Type Designation ...............................49
2.5.3.1
Backplane Connectors without Hot-Plug Support ..........49
2.5.3.2
2.5.3.3
Backplane Connectors with Hot-Plug Support ...............49
2.5.4 UPM Connectors ............................................................................49
Backplane Connectors ...................................................50
2.5.2
2.5.3
2.5.4.1
PICMG® EXP.0 CompactPCI Express Specification R2.0, March 22, 2013
3
2.9.2
2.6
2.7
2.8
2.9
2.5.4.2
2.5.4.3
Board Connectors without Hot-Plug Support.................. 50
Board Connectors with Hot-Plug Support....................... 50
2.5.5 HM Connectors .............................................................................. 50
2.5.6
47-Position Pluggable Power Supply Connector............................ 50
Chassis Subrack Requirements.................................................................. 50
Backplane Requirements ............................................................................ 50
2.7.1
3U Backplane Dimensions and Connector Locations ....................50
2.7.2
6U Backplane Dimensions and Connector Locations ....................52
Slot Numbering and Glyphs ........................................................................ 54
Board Requirements ................................................................................... 54
2.9.1
3U System/Type 1/Type 2 Board Dimensions and Connector
Locations........................................................................................ 54
6U System/Type 1/Type 2 Board Dimensions and Connector
Locations........................................................................................ 56
3U Switch Board Dimensions and Connector Locations................ 57
2.9.3
6U Switch Board Dimensions and Connector Locations................ 58
2.9.4
Board PCB Thickness .................................................................... 59
2.9.5
ESD Discharge Strip ...................................................................... 59
2.9.6
ESD Clip......................................................................................... 59
2.9.7
Front Panels................................................................................... 59
2.9.8
2.9.9 CompactPCI Express Logo ............................................................ 60
2.9.10 PMC/XMC Support......................................................................... 60
2.9.11 Cross Sectional View ..................................................................... 61
2.9.12 Component Outline and Warpage.................................................. 61
2.9.13 Solder Side Cover (Optional) ......................................................... 61
2.9.14 Component Heights........................................................................ 62
2.9.15 System Slot Identification............................................................... 62
2.10 Rear-Panel I/O Board Requirements .......................................................... 62
2.10.1 3U Rear-Panel I/O Board Dimensions ........................................... 62
2.10.2 6U Rear-Panel I/O Board Dimensions ........................................... 63
Electrical Requirements ...................................................................................... 65
3.1
Signal Definitions......................................................................................... 65
PCI Express Signals....................................................................... 65
3.1.1
PCI Express Transmit Signals........................................ 65
3.1.1.1
PCI Express Receive Signals......................................... 66
3.1.1.2
3.1.1.3
Interconnect Definition.................................................... 66
Link Definition .............................................. 67
3.1.1.3.1
3.1.1.3.2
Link Grouping .............................................. 67
Electrical Budgets........................................................... 68
3.1.1.4.1 AC Coupling.................................................68
3.1.1.4.2
Insertion Loss .............................................. 69
3.1.1.4.3 Crosstalk...................................................... 70
3.1.1.4.4
Lane-to-Lane Skew...................................... 71
3.1.1.4.5 Equalization .................................................72
3.1.1.4.6 Skew within the Differential Pair
3
3.1.1.4
3.1.1.5
3.1.1.6
(Intra-Pair Skew).......................................... 72
Jitter Budget Allocation................................................... 73
3.1.1.5.1 Random Jitter (Rj)........................................ 73
3.1.1.5.2 System Level Jitter Distribution ................... 74
3.1.1.5.3
Interconnect Jitter Budget............................ 75
Eye Patterns................................................................... 76
4
PICMG® EXP.0 CompactPCI Express Specification R2.0, March 22, 2013
3.1.1.6.1
Table of Touchstone Files Used for
Testing .........................................................76
3.1.1.6.2
Type 2 Peripheral Transmitter Eye ..............77
3.1.1.6.3 Controller Transmitter Eye...........................80
3.1.1.6.4 Backplane Type 2 Peripheral Slot
Transmitter Eye............................................82
3.1.1.6.5 Controller Slot Transmitter Eye....................84
3.1.1.6.6 Backplane Compliance Testing ...................86
3.1.1.6.7 Backplane Loss Approximation....................88
3.1.1.6.8 Alternative Controller TX Measurement.......89
3.1.1.7 Receiver Tolerance Testing............................................90
3.1.1.7.1 Peripheral Board Minimum Receiver Path
Sensitivity.....................................................90
3.1.1.7.2 System Controller Board Minimum
Receiver Path Sensitivity .............................93
3.1.1.7.3 Backplane System Slot Minimum
Receiver Path Sensitivity .............................94
3.1.1.7.4 Backplane Peripheral Slot Minimum
3.1.2
3.1.3
3.1.4
Receiver Path Sensitivity .............................96
3.1.1.8 Reference Clock .............................................................98
3.1.1.8.1 Hot-Plug.......................................................98
3.1.1.8.2 Clock Fan-Out..............................................99
3.1.1.8.3 Clocking Dependencies ...............................99
3.1.1.8.4 AC-Coupling and Biasing.............................99
3.1.1.8.5 Routing Length...........................................100
3.1.1.8.6 Reference Clock Specification...................101
3.1.1.8.7 REFCLK Phase Jitter Specification ...........104
ESD ..............................................................................................108
5 Vaux ..........................................................................................109
SMBus..........................................................................................109
3.1.4.1
SMBus “Back Powering” Considerations......................111
Backplane Identification and Capability Using
3.1.4.2
SMBus ..........................................................................111
PWRBTN# Signal.........................................................................120
3.1.5
PS_ON# Signal ............................................................................120
3.1.6
3.1.7
PWR_OK Signal...........................................................................121
3.1.8 WAKE# Signal..............................................................................122
3.1.8.1
Implementation Note ....................................................124
PERST# Signal ............................................................................125
Initial Power-Up (G3 to L0) ...........................................126
3.1.9.1
Power Management States (S0 to S3/S4 to S0) ..........127
3.1.9.2
3.1.9.3
Power Down .................................................................128
3.1.10 SYSEN# Signal ............................................................................129
3.1.11 Geographical Addressing .............................................................129
3.1.12 LINKCAP Signal ...........................................................................130
3.1.13 I/O Pins.........................................................................................130
3.1.14 Reserved Pins ..............................................................................130
Hot-Plug Support.......................................................................................130
3.2.1 Hot-Plug Sub-System Architecture...............................................130
3.2.2
Power Enable ...............................................................................133
3.2.3 Wake# ..........................................................................................134
3.2.4 Module Power Good.....................................................................134
Present Detection.........................................................................134
3.2.5
3.1.9
3.2
PICMG® EXP.0 CompactPCI Express Specification R2.0, March 22, 2013
5
3.3
3.4
System Management Bus ............................................................134
3.2.6
System Management Bus Alert....................................................134
3.2.7
Attention LED ...............................................................................135
3.2.8
3.2.9
Attention Switch............................................................................135
3.2.10 DC Specifications.........................................................................135
Backplane Connector Pin Assignments ....................................................135
System Slot ..................................................................................136
3.3.1
3.3.1.1
4-Link Configuration .....................................................136
3.3.1.2
2-Link Combination Configuration ................................139
Peripheral Slot Type 1..................................................................140
3.3.2
3.3.3
Peripheral Slot Type 2..................................................................142
3.3.4 Hybrid Peripheral Slot ..................................................................142
Legacy Slot...................................................................................144
3.3.5
Switch Slot....................................................................................144
3.3.6
3U Switch Slot ..............................................................144
3.3.6.1
3.3.6.2
6U Switch Slot—x4 Link Width.....................................145
6U Switch Slot—x8 Link Width.....................................148
3.3.6.3
Power Supply Requirements.....................................................................150
3.4.1 Current Available..........................................................................150
3.4.2 Regulation and Ripple and Noise.................................................151
Backplane Power Decoupling ......................................................151
3.4.3
Power Supply Timing ...................................................................151
3.4.4
Additional Power Requirements for Boards Supporting
3.4.5
Hot-Plug .......................................................................................152
Keying Requirements ........................................................................................153
Legacy Slots and Legacy Boards..............................................................153
4.1
4.2
eHM Keying...............................................................................................153
CompactPCI Express Advanced Differential Fabric Connector ....................156
A.1 General Data.............................................................................................156
A.1.1 Objective of this Document .........................................................156
A.1.2 Scope ...........................................................................................156
A.1.3
Intended Method of Mounting.......................................................156
A.1.4 Ratings and Characteristics .........................................................157
A.1.5 Normative References..................................................................157
A.1.6 Markings.......................................................................................158
A.1.7
Type Designation .........................................................................158
A.1.8 Ordering Information ....................................................................159
A.1.9 Special Connector Loadings ........................................................159
Technical Information................................................................................160
A.2.1 Contacts and Terminations ..........................................................160
Dimensional Information............................................................................161
A.3.1
Isometric View and Common Features ........................................161
A.3.2 Engagement Information ..............................................................161
A.3.2.1 Electrical Engagement Length......................................161
A.3.2.2
First Contact Point........................................................162
A.3.2.3 Perpendicular to Engagement Direction.......................162
A.3.2.4
Inclination .....................................................................162
A.3.3 Backplane Connectors .................................................................163
A.3.3.1 Dimensions...................................................................163
A.2
A.3
4
A
6
PICMG® EXP.0 CompactPCI Express Specification R2.0, March 22, 2013
A.3.4
A.3.3.2 Contacts .......................................................................163
A.3.3.3 Contact Tip Geometry ..................................................164
A.3.3.4
Terminations.................................................................164
Front Board Connectors ...............................................................165
A.3.4.1 Dimensions...................................................................165
A.3.4.2
Terminations.................................................................165
A.3.5 Mounting Information for Backplane Connectors .........................165
A.3.5.1 Hole Pattern on Backplanes .........................................166
A.3.5.2 Backplane Contact Positional Requirements ...............166
A.3.5.3
True Position of Male Contacts ....................................166
A.3.6 Mounting Information for Front Board Connectors .......................167
A.3.6.1 Hole Pattern on Printed Boards....................................167
Characteristics...........................................................................................168
A.4.1 Climatic Category .........................................................................168
A.4.1.1 Climatic Category Test Batch P: Initial Examination ....168
A.4.1.2 Climatic Category Test Batch A: Mechanical Tests......168
A.4.1.3 Climatic Category Test Batch B: Harsh
Environments................................................................171
A.4.1.4 Climatic Category Test Batch C: Damp Heat ...............173
A.4.1.5 Climatic Category Test Batch D: Extended
Environmental Tests.....................................................174
A.4.1.6 Climatic Category Test Batch E: Extended
A.4
B.2
Environmental Tests.....................................................175
A.4.2 Electrical Characteristics ..............................................................175
Impedance....................................................................175
A.4.2.1
A.4.2.2 Crosstalk.......................................................................176
A.4.2.3 Propagation Delay ........................................................176
A.4.2.4 Differential Skew...........................................................176
A.4.2.5
Insertion Loss ...............................................................176
Enriched Hard-Metric Connector......................................................................177
B.1 General Data .............................................................................................177
B.1.1 Objective of this Document ..........................................................177
B.1.2 Description of the Connector’s Approach.....................................177
B.1.3 Descriptive Partitions Found Further This Document...................177
B.1.4 Normative References..................................................................178
B
B.1.4.1 Primary References Describing the Generic Part of
the Connector ...............................................................178
B.1.4.2 Additional References ..................................................178
B.1.5
Intended Method of Mounting.......................................................178
B.1.6 Markings.......................................................................................179
B.1.7
Type Designation (General) .........................................................179
Technical Information ................................................................................179
B.2.1 Definitions.....................................................................................179
B.2.2 Contacts .......................................................................................179
B.2.3 Contact Performance Level..........................................................181
B.2.4 Keying ..........................................................................................181
B.2.4.1 Mating Rules.................................................................182
B.2.4.2 Examples for Mating and Nonmating Configurations ...183
B.2.5
Type Designation .........................................................................183
B.2.6 Applicational Information ..............................................................184
B.2.6.1 Alignment and Gathering..............................................184
PICMG® EXP.0 CompactPCI Express Specification R2.0, March 22, 2013
7
B.3
B.4
B.3.5
B.2.6.2 Polarization...................................................................185
Dimensional Information............................................................................185
B.3.1 General.........................................................................................185
B.3.2 View and Common Features........................................................185
B.3.3 Remarks on Mating Properties of eHM Connector.......................186
Fixed Board Connector ................................................................187
B.3.4
B.3.4.1 Dimensions...................................................................187
B.3.4.2
Terminations.................................................................188
B.3.4.3 Mounting Information for Fixed Board Connectors.......188
B.3.4.4 Hole Pattern on Fixed Board ........................................188
B.3.4.5 Position of Connectors on Fixed Board........................188
Free Board Connectors................................................................189
B.3.5.1 Dimensions...................................................................189
B.3.5.2
Terminations.................................................................190
B.3.5.3 Mounting Information for Free Board Connectors ........190
B.3.5.4 Hole Pattern on Free Board..........................................190
B.3.5.5 Position of Connectors on Front Board ........................190
Characteristics...........................................................................................190
B.4.1 Climatic Category.........................................................................190
B.4.2 Electrical Characteristics ..............................................................190
B.4.2.1 Creepage and Clearance Distances.............................190
B.4.2.2 Voltage Proof................................................................191
B.4.2.3 Current-Carrying Capacity............................................191
B.4.2.4 Contact Resistance ......................................................191
B.4.2.5
Insulation Resistance ...................................................191
B.4.3 Mechanical ...................................................................................191
B.4.3.1 Mechanical Operation...................................................191
B.4.3.2 Engaging and Separating Forces.................................191
B.4.3.3 Contact Retention in Insert...........................................191
B.4.3.4 Static Load, Transverse................................................191
B.4.3.5 Gauge Retention Force ................................................191
B.4.3.6 Vibration (Sinusoidal) ...................................................191
B.4.3.7 Shock............................................................................191
B.4.3.8 Polarization Method......................................................192
B.4.3.9 Robustness and Effectiveness of Coding Device.........192
B.4.3.9.1 Conditions According to IEC60512-7,
Test 13e.....................................................192
B.5
Test Schedule ...........................................................................................192
B.6 Quality Assessment Procedures ...............................................................192
Universal Power Connector (UPM)...................................................................193
C.1 General Data.............................................................................................193
C.1.1 Objective of this Document ..........................................................193
Dimensions................................................................................................194
C.2
Perpendicular to Engagement Direction....................................................196
C.3
C.4
Inclination ..................................................................................................196
C.5 Mounting Information.................................................................................196
C.6
Climatic Category......................................................................................198
Advanced Differential Fabric Plus (ADFplus) Connectors.............................202
D.1 General data..............................................................................................202
D.1.1 Objective of this document ...........................................................202
C
D
8
PICMG® EXP.0 CompactPCI Express Specification R2.0, March 22, 2013
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