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PICMG_ATCA_3_1R3_0.pdf
Introduction and objectives 1
1.1 Objectives
1.2 Reference documents
1.2.1 Reference specifications
1.2.2 Environment and regulatory documents
1.3 Special word usage
1.4 Statement of compliance
1.5 Name and logo usage
1.6 Signal naming conventions
1.7 Intellectual property
1.7.1 Necessary claims
1.7.2 Unnecessary claims
1.7.3 Third party disclosures
1.8 Acronyms and definitions
PICMG 3.0 compliance 2
2.1 Mechanical
2.2 Power distribution
2.3 Thermal
Hardware platform management 3
3.1 Introduction
3.2 PICMG 3.1 implementation requirements
3.2.1 Implementation independent requirements
3.3 Messaging algorithm
3.4 E-Keying extensions
3.4.1 Link Descriptor
3.4.2 LDES: Link Designator
3.4.3 LTYPE: Link Type
3.4.4 LCLASS: Link Class
3.4.5 LEXT: Link Type Extension
3.4.6 LGID: Link Grouping ID
3.5 Link and Link Descriptor options
3.6 Channel E-keying extensions
3.6.1 Backplane Channel capabilities
3.6.2 Board Channel capabilities
3.6.3 E-Keying process
3.6.4 Updated Set and Get Port State Commands
Data transport 4
4.1 Introduction
4.2 Pin assignments
Backplane physical layer interfaces 5
5.1 Gigabit Backplane interface, 1000BASE-BX/FC-PI
5.1.1 1000BASE-BX/FC-PI transmitter electrical specifications
5.1.1.1 Transmitted electrical specifications at TP1
5.1.1.2 Transmitted electrical specifications at TPT
5.1.1.3 Transmitted eye mask at TPT
5.1.2 1000BASE-BX/FC-PI receiver electrical specifications
5.1.2.1 Receiver electrical specifications at TPR
5.1.2.2 Received eye mask at TPR
5.1.2.3 Receiver electrical specifications at TP4
5.1.3 1000BASE-BX/FC-PI jitter specifications
5.2 10 Gigabit Backplane interface, 10GBASE-BX4
5.2.1 10GBASE-BX4 transmitter electrical specifications
5.2.1.1 Transmitted electrical specifications at TP1
5.2.1.2 Transmitted electrical specifications at TPT
5.2.1.3 Compliance interconnect definition
5.2.2 10GBASE-BX4 receiver electrical specifications
5.2.2.1 Receiver electrical specifications at TPR
5.2.2.2 Receiver electrical specifications at TP4
5.2.3 10GBASE-BX4 TPT and TPR eye mask
5.3 1000BASE-KX and 10GBASE-KX4 specifications
5.4 10GBASE-KR and 40GBASE-KR4 Channel characteristics
5.4.1 Definitions of measurements and calculations (informative)
5.4.1.1 Fitted attenuation
5.4.1.2 Insertion loss deviation (ILD)
5.4.1.3 Power sum differential near-end crosstalk (PSNEXT)
5.4.1.4 Power sum differential far-end crosstalk (PSFEXT)
5.4.1.5 Power sum differential crosstalk (PEXT)
5.4.1.6 Insertion loss to crosstalk ratio (ICR) and fitted ICR
5.4.2 Backplane test assembly characteristics
5.4.2.1 Backplane test assembly common requirements
5.4.2.2 Short Backplane test assembly requirements
5.4.2.3 Long Backplane test assembly requirements
5.4.3 Front Board test card requirements
5.4.3.1 Fitted attenuation
5.4.4 Backplane test paddle card requirements
5.4.4.1 Fitted attenuation
5.4.4.2 Insertion loss deviation
5.4.4.3 Return loss
5.4.4.4 Common mode return loss
5.4.4.5 Common mode conversion loss
5.4.4.6 Insertion loss to crosstalk ratio
5.4.5 Front Board Channel requirements
5.4.5.1 Fitted attenuation
5.4.5.2 S-Parameter and jitter testing and requirements
5.4.5.3 Return loss
5.4.5.4 Common mode return loss
5.4.5.5 Crosstalk and error rate testing and requirements
5.4.6 Backplane Channel requirements
5.4.6.1 Fitted attenuation
5.4.6.2 Insertion loss deviation
5.4.6.3 Insertion loss to crosstalk ratio
5.4.7 Channel fitted attenuation (informative)
5.5 Auto-Negotiation (informative)
5.5.1 1000BASE-BX to 10GBASE-BX4 Auto-Negotiation
5.5.2 1000BASE-KX/10GBASE-KX4/10GBASE-KR/40GBASE-KR4 Auto-Negotiation
5.6 100GBASE-KR4 Channel characteristics
5.6.1 Definitions of measurements and calculations (informative)
5.6.1.1 Channel Operating Margin
5.6.2 100GBASE-KR4 Backplane test assembly characteristics
5.6.2.1 100GBASE-KR4 Backplane test assembly common requirements
5.6.2.2 Short 100GBASE-KR4 Backplane test assembly requirements
5.6.2.3 Long 100GBASE-KR4 Backplane test assembly requirements
5.6.3 100GBASE-KR4 Front Board test card requirements
5.6.3.1 Fitted attenuation
5.6.3.2 Insertion loss deviation
5.6.3.3 Return loss at TP A
5.6.3.4 Return loss at TP 2/TP 3
5.6.3.5 Common mode return loss at TP A
5.6.3.6 Common mode return loss at TP 2/TP 3
5.6.3.7 Common mode conversion loss TP 2/TP 3 to TP A
5.6.3.8 Common mode conversion loss TP A to TP 2/TP 3
5.6.3.9 Insertion loss to crosstalk ratio
5.6.4 100GBASE-KR4 Backplane test paddle card requirements
5.6.4.1 Fitted attenuation
5.6.4.2 Insertion loss deviation
5.6.4.3 Return loss at TP B
5.6.4.4 Return loss at TP 1/TP 4
5.6.4.5 Common mode return loss at TP B
5.6.4.6 Common mode return loss at TP 1/TP 4
5.6.4.7 Common mode conversion loss at TP 1/TP 4 to TP B
5.6.4.8 Common mode conversion loss TP B to TP 1/TP4
5.6.4.9 Insertion loss to crosstalk ratio
5.6.5 Front Board Channel requirements
5.6.5.1 Fitted attenuation
5.6.5.2 S-Parameter and jitter testing and requirements
5.6.5.3 Return loss
5.6.5.4 Common mode return loss
5.6.5.5 Crosstalk and error rate testing and requirements
5.6.5.6 Front Board Channel Operating Margin
5.6.6 Backplane Channel requirements
5.6.6.1 Backplane Channel Operating Margin
Advanced Differential Fabric connector generation 2 Definition - ADFplus (normative) A
A.1 General data
A.1.1 Objective of this Appendix
A.1.2 Scope
A.1.3 Intended method of mounting
A.1.4 Ratings and characteristics
A.1.5 Normative references
A.1.6 Markings
A.2 Technical information
A.2.1 Definitions
A.2.1.1 Contacts and terminations
A.2.1.2 Complete connectors (pairs)
A.3 Dimensional information
A.3.1 General isometric view and common features
A.3.2 Engagement information
A.3.3 Backplane connectors
A.3.4 Front Board connectors
A.3.4.1 Dimensions
A.3.4.2 Terminations
A.3.5 Mounting information for Backplane connectors
A.3.6 Mounting information for ADFplus Front Board connectors
A.4 Characteristics
A.4.1 Climatic category
A.4.2 Electrical characteristics
A.4.2.1 Impedance
A.4.2.2 Crosstalk
A.4.2.3 Insertion loss
A.4.2.4 Intra-pair skew (differential skew)
Advanced Differential Fabric connector generation 3 Definition - ADF++ (normative) B
B.1 General data
B.1.1 Objective of this Appendix
B.1.2 Scope
B.1.3 Intended method of mounting
B.1.4 Ratings and characteristics
B.1.5 Normative references
B.1.6 Markings
B.2 Technical information
B.2.1 Definitions
B.2.1.1 Contacts and terminations
B.2.1.2 Complete connectors (pairs)
B.3 Dimensional information
B.3.1 General isometric view and common features
B.3.2 Engagement information
B.3.2.1 Electrical engagement length
B.3.2.2 First contact point
B.3.2.3 Perpendicular to engagement direction
B.3.2.4 Inclination
B.3.3 Backplane connectors
B.3.3.1 Dimensions
B.3.3.2 Contacts
B.3.3.3 Contact tip geometry
B.3.3.4 Terminations
B.3.4 Front Board connectors
B.3.4.1 Dimensions
B.3.4.2 Terminations
B.3.5 Mounting information for ADF++ Backplane connectors
B.3.6 Mounting information for ADF++ Front Board connectors
B.4 Characteristics
B.4.1 Climatic category
B.4.2 Electrical characteristics
B.4.2.1 General Remarks
B.4.2.2 Impedance
B.4.2.3 Crosstalk
B.4.2.4 Insertion loss
B.4.2.5 Intra-pair skew (differential skew)
B.4.2.6 Return loss
Revision History C
PICMG® 3.1 Revision 3.0
Specification
Ethernet/Fibre Channel
for AdvancedTCA® Systems
Revision 3.0 - May 5, 2016
© Copyright 2016, PCI Industrial Computer Manufacturers Group. The attention of adopters is
directed to the possibility that compliance with or adoption of PICMG® specifications may
require use of an invention covered by patent rights. PICMG® shall not be responsible for
identifying patents for which a license may be required by any PICMG® specification or for
conducting legal inquiries into the legal validity or scope of those patents that are brought to its
attention. PICMG® specifications are prospective and advisory only. Prospective users are
responsible for protecting themselves against liability for infringement of patents.
NOTICE:
The information contained in this document is subject to change without notice. The material in
this document details a PICMG® specification in accordance with the license and notices set
forth on this page. This document does not represent a commitment to implement any portion of
this specification in any company's products.
WHILE THE INFORMATION IN THIS PUBLICATION IS BELIEVED TO BE
ACCURATE, PICMG® MAKES NO WARRANTY OF ANY KIND, EXPRESS OR
IMPLIED, WITH REGARD TO THIS MATERIAL INCLUDING, BUT NOT LIMITED TO,
ANY WARRANTY OF TITLE OR OWNERSHIP, IMPLIED WARRANTY OF
MERCHANTABILITY OR WARRANTY OF FITNESS FOR PARTICULAR PURPOSE OR
USE.
In no event shall PICMG® be liable for errors contained herein or for indirect, incidental,
special, consequential, reliance or cover damages, including loss of profits, revenue, data or use,
incurred by any user or any third party. Compliance with this specification does not absolve
manufacturers of equipment from the requirements of safety and regulatory agencies (UL, CSA,
FCC, IEC, etc.).
IMPORTANT NOTICE:
This document includes references to specifications, standards or other material not created by
PICMG. Such referenced materials will typically have been created by organizations that
operate under IPR policies with terms that vary widely, and under process controls with varying
degrees of strictness and efficacy. PICMG has not made any enquiry into the nature or
effectiveness of any such policies, processes or controls, and therefore ANY USE OF
REFERENCED MATERIALS IS ENTIRELY AT THE RISK OF THE USER. Users should
therefore make such investigations regarding referenced materials, and the organizations that
have created them, as they deem appropriate.
PICMG®, CompactPCI®, AdvancedTCA®, AdvancedTCA® 300,ATCA®, ATCA® 300,
AdvancedMC®, CompactPCI® Express, COM Express®, MicroTCA®, SHB Express®, and
the PICMG, CompactPCI, AdvancedTCA, µTCA and ATCA logos are registered trademarks,
and xTCA™, IRTM™ and the IRTM logo are trademarks of the PCI Industrial Computer
Manufacturers Group. All other brand or product names may be trademarks or registered
trademarks of their respective holders.
ii
PICMG 3.1 R3.0, May 5, 2016
Contents
iContents
1
2
3
4
5
1.3
1.4
1.5
1.6
1.7
Introduction and objectives..........................................................................................................1
Objectives ............................................................................................................................1
1.1
1.2
Reference documents...........................................................................................................2
1.2.1 Reference specifications..........................................................................................2
1.2.2
Environment and regulatory documents .................................................................3
Special word usage .............................................................................................................3
Statement of compliance ......................................................................................................3
Name and logo usage...........................................................................................................4
Signal naming conventions ..................................................................................................5
Intellectual property ..............................................................................................................5
1.7.1 Necessary claims.....................................................................................................6
1.7.2 Unnecessary claims.................................................................................................6
1.7.3
Third party disclosures.............................................................................................6
1.8
Acronyms and definitions......................................................................................................6
PICMG 3.0 compliance ..................................................................................................................9
2.1 Mechanical............................................................................................................................9
Power distribution .................................................................................................................9
2.2
2.3
Thermal.................................................................................................................................9
Hardware platform management................................................................................................11
Introduction .........................................................................................................................11
3.1
PICMG 3.1 implementation requirements...........................................................................11
3.2
3.2.1
Implementation independent requirements ..........................................................11
3.3 Messaging algorithm ..........................................................................................................11
E-Keying extensions ..........................................................................................................12
3.4
Link Descriptor ......................................................................................................12
3.4.1
LDES: Link Designator .........................................................................................13
3.4.2
3.4.3
LTYPE: Link Type .................................................................................................13
LCLASS: Link Class .............................................................................................13
3.4.4
LEXT: Link Type Extension ..................................................................................13
3.4.5
3.4.6
LGID: Link Grouping ID ........................................................................................14
Link and Link Descriptor options.........................................................................................15
Channel E-keying extensions .............................................................................................47
Backplane Channel capabilities.............................................................................47
3.6.1
Board Channel capabilities ....................................................................................50
3.6.2
3.6.3
E-Keying process...................................................................................................53
3.6.4 Updated Set and Get Port State Commands.........................................................54
Data transport .............................................................................................................................57
Introduction ........................................................................................................................57
4.1
4.2
Pin assignments ................................................................................................................59
Backplane physical layer interfaces..........................................................................................63
Gigabit Backplane interface, 1000BASE-BX/FC-PI............................................................64
5.1
5.1.1
1000BASE-BX/FC-PI transmitter electrical specifications .....................................65
3.5
3.6
May 5, 201
iii
Contents
5.2
5.3
5.4
5.5
iv
5.2.2
5.1.2
Transmitted electrical specifications at TP1...........................................65
5.1.1.1
Transmitted electrical specifications at TPT ..........................................65
5.1.1.2
5.1.1.3
Transmitted eye mask at TPT................................................................66
1000BASE-BX/FC-PI receiver electrical specifications .........................................68
5.1.2.1 Receiver electrical specifications at TPR...............................................68
5.1.2.2 Received eye mask at TPR ...................................................................69
5.1.2.3 Receiver electrical specifications at TP4 ...............................................71
5.1.3
1000BASE-BX/FC-PI jitter specifications ..............................................................71
10 Gigabit Backplane interface, 10GBASE-BX4 ................................................................72
10GBASE-BX4 transmitter electrical specifications...............................................73
5.2.1
Transmitted electrical specifications at TP1...........................................73
5.2.1.1
5.2.1.2
Transmitted electrical specifications at TPT ..........................................74
5.2.1.3 Compliance interconnect definition........................................................74
10GBASE-BX4 receiver electrical specifications..................................................75
5.2.2.1 Receiver electrical specifications at TPR...............................................76
5.2.2.2 Receiver electrical specifications at TP4 ...............................................76
5.2.3
10GBASE-BX4 TPT and TPR eye mask...............................................................76
1000BASE-KX and 10GBASE-KX4 specifications .............................................................77
10GBASE-KR and 40GBASE-KR4 Channel characteristics ..............................................77
5.4.1 Definitions of measurements and calculations (informative) .................................79
Fitted attenuation ...................................................................................79
5.4.1.1
Insertion loss deviation (ILD) .................................................................79
5.4.1.2
Power sum differential near-end crosstalk (PSNEXT)...........................80
5.4.1.3
Power sum differential far-end crosstalk (PSFEXT) ..............................80
5.4.1.4
Power sum differential crosstalk (PEXT) ...............................................80
5.4.1.5
5.4.1.6
Insertion loss to crosstalk ratio (ICR) and fitted ICR..............................81
Backplane test assembly characteristics ...............................................................81
Backplane test assembly common requirements ..................................83
5.4.2.1
5.4.2.2
Short Backplane test assembly requirements........................................84
5.4.2.3
Long Backplane test assembly requirements ........................................88
Front Board test card requirements .......................................................................91
5.4.3.1
Fitted attenuation ...................................................................................94
Backplane test paddle card requirements .............................................................99
5.4.4.1
Fitted attenuation .................................................................................102
5.4.4.2
Insertion loss deviation ........................................................................104
5.4.4.3 Return loss...........................................................................................105
5.4.4.4 Common mode return loss...................................................................105
5.4.4.5 Common mode conversion loss...........................................................106
5.4.4.6
Insertion loss to crosstalk ratio.............................................................107
Front Board Channel requirements .....................................................................108
Fitted attenuation .................................................................................109
5.4.5.1
5.4.5.2
S-Parameter and jitter testing and requirements .................................110
5.4.5.3 Return loss...........................................................................................111
5.4.5.4 Common mode return loss...................................................................112
5.4.5.5 Crosstalk and error rate testing and requirements...............................114
Backplane Channel requirements........................................................................116
5.4.6.1
Fitted attenuation .................................................................................117
Insertion loss deviation ........................................................................118
5.4.6.2
5.4.6.3
Insertion loss to crosstalk ratio.............................................................119
5.4.7 Channel fitted attenuation (informative)...............................................................120
Auto-Negotiation (informative)..........................................................................................122
1000BASE-BX to 10GBASE-BX4 Auto-Negotiation............................................122
5.5.1
5.4.5
5.4.2
5.4.3
5.4.4
5.4.6
May 5, 2016
Contents
5.6
5.5.2
5.6.2
5.6.4
5.6.3
1000BASE-KX/10GBASE-KX4/10GBASE-KR/40GBASE-KR4 Auto-Negotiation.....
.............................................................................................................................122
100GBASE-KR4 Channel characteristics.........................................................................122
5.6.1 Definitions of measurements and calculations (informative)................................123
5.6.1.1 Channel Operating Margin...................................................................124
100GBASE-KR4 Backplane test assembly characteristics..................................124
100GBASE-KR4 Backplane test assembly common requirements.....125
5.6.2.1
5.6.2.2
Short 100GBASE-KR4 Backplane test assembly requirements ..........126
5.6.2.3
Long 100GBASE-KR4 Backplane test assembly requirements...........130
100GBASE-KR4 Front Board test card requirements..........................................134
5.6.3.1
Fitted attenuation .................................................................................136
5.6.3.2
Insertion loss deviation ........................................................................137
5.6.3.3 Return loss at TP A..............................................................................138
5.6.3.4 Return loss at TP 2/TP 3......................................................................139
5.6.3.5 Common mode return loss at TP A......................................................140
5.6.3.6 Common mode return loss at TP 2/TP 3 .............................................141
5.6.3.7 Common mode conversion loss TP 2/TP 3 to TP A ............................142
5.6.3.8 Common mode conversion loss TP A to TP 2/TP 3 ............................143
5.6.3.9
Insertion loss to crosstalk ratio.............................................................144
100GBASE-KR4 Backplane test paddle card requirements................................146
5.6.4.1
Fitted attenuation .................................................................................149
5.6.4.2
Insertion loss deviation ........................................................................150
5.6.4.3 Return loss at TP B..............................................................................151
5.6.4.4 Return loss at TP 1/TP 4......................................................................152
5.6.4.5 Common mode return loss at TP B......................................................153
5.6.4.6 Common mode return loss at TP 1/TP 4 .............................................154
5.6.4.7 Common mode conversion loss at TP 1/TP 4 to TP B ........................155
5.6.4.8 Common mode conversion loss TP B to TP 1/TP4 .............................156
5.6.4.9
Insertion loss to crosstalk ratio.............................................................157
Front Board Channel requirements .....................................................................159
Fitted attenuation ................................................................................160
5.6.5.1
5.6.5.2
S-Parameter and jitter testing and requirements .................................161
5.6.5.3 Return loss...........................................................................................162
5.6.5.4 Common mode return loss...................................................................163
5.6.5.5 Crosstalk and error rate testing and requirements...............................164
5.6.5.6
Front Board Channel Operating Margin...............................................166
Backplane Channel requirements........................................................................167
5.6.6.1
Backplane Channel Operating Margin .................................................168
Advanced Differential Fabric connector generation 2 Definition - ADFplus (normative)...171
A.1 General data .....................................................................................................................171
A.1.1 Objective of this Appendix ...................................................................................171
A.1.2 Scope...................................................................................................................171
A.1.3
Intended method of mounting ..............................................................................172
A.1.4 Ratings and characteristics..................................................................................172
A.1.5 Normative references ..........................................................................................172
A.1.6 Markings ..............................................................................................................172
Technical information........................................................................................................172
A.2.1 Definitions ............................................................................................................172
A.2.1.1 Contacts and terminations ...................................................................172
A.2.1.2 Complete connectors (pairs)................................................................172
Dimensional information ...................................................................................................173
5.6.6
A.2
A.3
5.6.5
A
May 5, 2016 v
Contents
A.4
A.3.1 General isometric view and common features.....................................................173
A.3.2 Engagement information......................................................................................173
A.3.3 Backplane connectors .........................................................................................173
Front Board connectors .......................................................................................174
A.3.4
A.3.4.1 Dimensions ..........................................................................................174
A.3.4.2
Terminations ........................................................................................176
A.3.5 Mounting information for Backplane connectors..................................................176
A.3.6 Mounting information for ADFplus Front Board connectors.................................177
Characteristics..................................................................................................................177
A.4.1 Climatic category .................................................................................................177
A.4.2 Electrical characteristics ......................................................................................178
A.4.2.1
Impedance ...........................................................................................178
A.4.2.2 Crosstalk..............................................................................................179
Insertion loss........................................................................................179
A.4.2.3
A.4.2.4
Intra-pair skew (differential skew) ........................................................180
Advanced Differential Fabric connector generation 3 Definition - ADF++ (normative)......181
B.1 General data.....................................................................................................................181
B.1.1 Objective of this Appendix ...................................................................................181
B.1.2 Scope...................................................................................................................181
B.1.3
Intended method of mounting..............................................................................182
B.1.4 Ratings and characteristics..................................................................................182
B.1.5 Normative references ..........................................................................................182
B.1.6 Markings ..............................................................................................................182
Technical information........................................................................................................183
B.2.1 Definitions............................................................................................................183
B.2.1.1 Contacts and terminations ...................................................................183
B.2.1.2 Complete connectors (pairs)................................................................183
Dimensional information ...................................................................................................183
B.3.1 General isometric view and common features.....................................................183
B.3.2 Engagement information......................................................................................183
B.3.2.1 Electrical engagement length...............................................................183
B.3.2.2
First contact point.................................................................................183
B.3.2.3 Perpendicular to engagement direction ...............................................184
B.3.2.4
Inclination.............................................................................................184
B.3.3 Backplane connectors .........................................................................................184
B.3.3.1 Dimensions ..........................................................................................184
B.3.3.2 Contacts...............................................................................................184
B.3.3.3 Contact tip geometry............................................................................184
B.3.3.4
Terminations ........................................................................................184
Front Board connectors .......................................................................................184
B.3.4.1 Dimensions ..........................................................................................184
Terminations ........................................................................................185
B.3.4.2
B.3.5 Mounting information for ADF++ Backplane connectors .....................................185
B.3.6 Mounting information for ADF++ Front Board connectors ...................................185
Characteristics..................................................................................................................185
B.4.1 Climatic category .................................................................................................185
B.4.2 Electrical characteristics ......................................................................................186
B.4.2.1 General Remarks.................................................................................186
B.4.2.2
Impedance ...........................................................................................186
B.4.2.3 Crosstalk..............................................................................................187
B.3.4
B.2
B.3
B.4
May 5, 2016
B
vi
Insertion loss........................................................................................188
B.4.2.4
B.4.2.5
Intra-pair skew (differential skew) ........................................................189
B.4.2.6 Return loss...........................................................................................190
Revision History .......................................................................................................................193
C
Contents
May 5, 2016
vii
Contents
viii
May 5, 2016
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