logo资料库

电池电量检测及充放电管理.pdf

第1页 / 共64页
第2页 / 共64页
第3页 / 共64页
第4页 / 共64页
第5页 / 共64页
第6页 / 共64页
第7页 / 共64页
第8页 / 共64页
资料共64页,剩余部分请下载后查看
TI Designs Industrial Battery Management Module for 20S applications Reference Design Design Overview Design Features High serial cell count battery (>15s) systems are becoming more and more common for industrial applications. These applications are cost sensitive and require a simple solution that includes monitoring, protection, and control or even SOC (State Of Charge) information rather than only basic independent hardware protection. This design offers a platform for the complete pack side solution. Design Resources TIDA-01093 Bq76930 MSP430G2955 LM25018 ISO1541 ISO1050 Block Diagram Design Folder Product Folder Product Folder Product Folder Product Folder Product Folder  Supports 16-Series to 20-Series cell application.  All independent hardware protecting function inherited from bq76930.  Charger insertion detectable.  Load Removal detectable.  Isolated differentiated CAN PHY for communication with host system.  Supports up to 128k Baud Rate UART communication with external host.  External Cell Balancing available.  Programmable and independent hardware protection for OV, UV, OCD, SCD protection. Featured Applications  Power and Garden Tool  LEVs: EBike, Scooters, Pedelec and Pedal- Assist Bicycles  ESS and UPS Board Image TIDUC43 – August 2016 Industrial Battery Management Module for 20S applications Reference Design 1 Copyright © 2016, Texas Instruments Incorporated
www.ti.com 1 Key System Specifications PARAMETER Cell Series Number Max Stack Voltage Consumption Current Balancing Current Additional FETs Shutdown Delay caused by the OR circuits in block diagram Support Baud Rate Minimum Gap Between PACK- and BAT- for Charger Detection Load Detect removal Delay Table 1: Key System Specifications SPEDIFICATION Details Shutdown Normal(MCU in LPM3, bq76930 ADC On, bq76930 CC Off) Normal(MCU On, bq76930 ADC On, bq76930 CC On) Communication with host Discharge Charge 16s to 20s 144V 0.6uA typical 60uA typical 4.5mA typical 17.5mA typical 40mA typical 48.6uS typical 372.4uS typical 38.4kBit/S ~ 128kBit/S 2V ~408.1s Stack Voltage = 80v TIDUC43 - August 2016 Industrial Battery Management Module for 20S applications Reference Design 2 Copyright © 2016, Texas Instruments Incorporated
www.ti.com 2 System Description This design incorporates two bq76930 devices and one MCU MSP430G2955 to monitor 16 to 20 cells connected in series, with the typical overall battery stack voltage ranges from 50v(2.5v for each cell) to 84v(4.2v for each cell). The MCU communicates with each bq76930 with multiplexed I2C buses alternately. An I2C isolator ISO1541 is used for the MCU to access the upper bq76930. The MCU can also act as a slave device to respond the access from external host with isolated differentiated CAN PHY, facilitated with ISO1050 and its internal UART module. A FLYBUCK DCDC controller is used to provide 2 isolated power rails to ISO1050. The FETs control signals from each bq76930 are synthesized with the OR circuits in Figure 1 to control charge and discharge FETs respectively. All independent hardware controlled protect functions are inherited from bq76930. 2.1 Bq76930 The bq76930 device supports 6-series to 10-series cell battery pack, a variety of battery chemistries including Lithium ion, Lithium Iron Phosphate and more may be managed by this device. Via I2C, a host controller can use the bq769x0 to implement many battery pack management functions, such as monitoring (cell voltages, pack current, pack temperatures), protection (controlling charge/discharge FETs), and balancing. Integrated A/D converters enable a purely digital readout of critical system parameters, with calibration handled in TI’s manufacturing process. 2.2 MSP430G2955 The MSP430G2955 series is an ultra-low-power mixed signal microcontrollers with built-in 16-bit timers, up to 32 I/O touch-sense-enabled pins, a versatile analog comparator, and built-in communication capability using the universal serial communication interface. For detail configurations, please refer to table 2 Table 2: MSP430G2955 Configurations Device BSL EEM Flash (KB) RAM (B) Timer_A Timer_B COMP_A+ Channels ADC10 Channels USCI_A0 USCI_B0 Clock I/O Package Type MSP430G2955IDA38 1 1 56 4096 2xTA3 1xTB3 8 12 1 HF, LF, DCO, VLO 32 38-TSSOP 2.3 ISO1541 ISO1451 device is a lower power, bidirectional isolators that are compatible with I2C interfaces, the device has its logic input and output buffers separated by TI’s Capacitive Isolation technology using a silicon dioxide barrier. When used with isolated power supplies, this device blocks high voltages, isolates grounds, and prevents noise currents from entering the local ground and interfering with or damaging sensitive circuitry. The ISO1541 has a bidirectional data and a unidirectional clock channel which is suitable for a single master system. 2.4 ISO1050 The ISO1050 is a galvanically isolated CAN transceiver that meets the specification of the ISO11898-2 standard. The device has the input and output logical buffers separated by silicon oxide insulation barrier that provides galvanic isolation of up to 2500VRMS for ISO1050DUB. Used in conjunction with isolated power supplies, the device prevents noise current on a data TIDUC43 - August 2016 Industrial Battery Management Module for 20S applications Reference Design 3 Copyright © 2016, Texas Instruments Incorporated
www.ti.com bus or other circuits from entering the local ground and interfering with or damaging sensitive circuitry. As a CAN transceiver, the device provides differential transmit capability to the bus and differential receiver capability to a CAN controller at signaling up to 1 megabit per second. The device is designed for operation especially in harsh environments, and it features cross-wire, overvoltage and loss of ground protection from -27V to 40V and over temperature shutdown, as well as -12V to 12V common mode range. 2.5 LM25018 The LM25018 device is a 48V, 325mA synchronous step down voltage regulator with integrated high side and low side MOSFETs. The constant on-time(COT) control scheme employed in LM25018 device requires no loop compensation, provide excellent transient response, and enable very high step down ratios. The on-time varies inversely with the input voltage resulting in nearly constant frequency over the input voltage range. A high-voltage startup regulator provides bias power for internal operation of the IC and for integrated gate drivers. 3 Block Diagram Figure 1: TIDA-01093 Block Diagram 3.1 Highlighted Products 3.1.1 Bq76930 TIDUC43 - August 2016 Industrial Battery Management Module for 20S applications Reference Design Copyright © 2016, Texas Instruments Incorporated 4
The following figure shows the function block diagram of bq76930 www.ti.com Figure 2: Bq76930 Function Block Diagram Features: AFE Monitoring Features – Pure digital interface – Internal ADC measures cell voltage, die temperature, and external thermistor – A separate, internal ADC measures pack current (coulomb counter) – Directly supports up to three thermistors (103AT) • Hardware Protection Features – Overcurrent in discharge (OCD) – Short circuit in discharge (SCD) – Overvoltage (OV) – Undervoltage (UV) – Secondary protector fault detection • Additional Features – Integrated cell balancing FETs – Charge, discharge low-side NCH FET drivers – Alert interrupt to host microcontroller – 2.5-V or 3.3-V output voltage regulator – No EEPROM programming necessary – High supply voltage abs max (up to 108 V) – Simple I2C™ compatible interface (CRC option) – Random cell connection tolerant TIDUC43 - August 2016 Industrial Battery Management Module for 20S applications Reference Design 5 Copyright © 2016, Texas Instruments Incorporated
www.ti.com 4 System Design Theory 4.1 FETs Control Synthesizing Circuit In this design, 2 bq76930 devices are used for monitoring the 20 cells connected in series, one device for monitoring lower 10 cells in series, and another for the upper 10 cells in series, The bottom device references to BAT- which is the negative end of 1st cell (the lowest cell at the bottom of the cell stack) as its ground, and the upper device references the point of positive end of the 10th cell or negative end of the 11th cell as its ground, so this two devices work at different reference potentials. The output FET control signals of DSG and CHG of upper device needs have the level shifted so that these two signals can be ORed as inverted logic to control the charge and discharge FETs, The FETs of Q26~Q32 in below schematic implemented the shifted OR function for FETs control signals Figure 3: FETs Control Signal Schematic There two paths of the control signals in above circuit, one for discharge FETs control and another for Charge FETs control. They are designed with the same idea. The path for discharge FETs control signal would be used for interpretation in the following section. TIDUC43 - August 2016 Industrial Battery Management Module for 20S applications Reference Design 6 Copyright © 2016, Texas Instruments Incorporated
www.ti.com Given that the voltage at BAT+ in Figure 3 is 80V, and both DSG outputs of upper and bottom devices assert upon initializing with no fault detected. With the DSG output of upper device labeled as DSG_U asserts, the voltage of DSG_U to the ground reference GND_U for upper device would be ~12v, since the ground reference of upper device is in the middle of battery stack, the voltage between GND_U and GND_B is ~40V, as the GND_B is the ground reference of the bottom device. Then the voltage of DSG_U to the GND_B is ~52V, with the typical Vgs(th) of Q27 being about 1.7V, the voltage at the source of Q27 is about 52V – 1.7V = 50.3V. With this voltage at the source of FET Q28, this FET is on, and the voltage at Q32 drain is also 50.3V. With DSG_B asserts at ~12V to GND_B, the voltage at source of Q32 is also clamped at ~10.3v, subtracting the forward voltage of D41 and Vgs of Q33 summed at 2.6V, the voltage at the gates of Q38, Q40, Q42 is about 7.7v, thus the DSG FETs are all turned on. If the DSG output of bottom device deasserts, then the DSG_B would be ~0V, the source of Q32 would be 0V, this turns off all discharge FETs. If the DSG output of upper device deasserts, then FETs Q27 and Q28 are turned off, the voltage at the drain of Q28 drops to 0, this also turns off all discharge FETs. One thing should be noted is that when the voltage at Q32 source starts to drop either caused by deassertion of upper or bottom devices’ DSG outputs, it drops slowly if there is no additional pulldown circuit. Q34, Q37, D41, D43 constitute an expedite shutdown circuit so that the voltage at the gates of the discharges FETs drops quickly. 4.2 Charger Detection Circuit Like most of the battery packs, the charger connection to the charge input end between PACK+ and PACK- in this design should be sensed by the system either when the charge FETs are open or closed. The purposes of this are for fault detection, fault recovery, system activation from Shutdown mode and coulomb counting if SOC information is required. In the case when charge FETs are closed, the charge current can be sensed by bq76930 and the MCU, if the charge current is too low to be sensed, charger detection is typically not required in most application scenarios. As for a 20s battery, charging is almost always terminated either by full charge detection or OV conditions, for both of the scenario, the charge FETs cut off the charge current before the charge current tapers to 0. When the charge FETs are open, there should be a voltage gap between charger output and battery stack side since the charge FETs are always cut off before the current tapers to 0. The Charger Detection Circuit senses this voltage as the measure to detect the charger presence. Figure 4 is the schematic of this circuit. TIDUC43 - August 2016 Industrial Battery Management Module for 20S applications Reference Design 7 Copyright © 2016, Texas Instruments Incorporated
www.ti.com Figure 4: Charger Detection Circuit For a 20-series Lithium ion cell battery, the charger voltage is typically designed with a constant output voltage at 84V, however, given the relaxed battery stack voltage is 80V, and the charge FETs are open due to full charge detection or OV fault or bq76930 device being shutdown, when the charger presented to PACK+ and PACK-, the voltage between PACK- and BAT- is about -4V, the typical Vgs(th) is about 1.7V, the voltage across R67 would be 2.3V, and the voltage across R54 would be clamped by D19, then Q16 is turned on, the voltage at Q14 source would be clamped at about 18.3V if the VC5X_B is 20V. R59 limit the current flow through the diodes D29, D37, D30 and D34 which develop a voltage at about 2.7V~2.8V at the point with the net label of CHG_DET. This voltage would also generate a rising edge at TS1_B which is directed to TS1 pin of bottom bq76930, with the rising edge occurs at TS1 pin, the bottom device is waked up if it is previously in shutdown state. MCU can also sense this event by monitoring the voltage CHG_DET. D23 and C29 is used to isolate the temperature measurement circuitry at TS1 pin, with this two device being in place, the pulse occurs at TS1 pin for temperature measurement won’t be distorted in most of the time except for the moment when a charger connects to the PACK+ and PACK- or the button S1 is pressed down. The signal CHG_ACTIVATE is used to propagate itself to the upper device via the circuit in Figure 5. Figure 5: Activate Circuit for Bottom and Top Device TIDUC43 - August 2016 Industrial Battery Management Module for 20S applications Reference Design 8 Copyright © 2016, Texas Instruments Incorporated
分享到:
收藏