Altera FPGA 失效率计算.pdf

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RELIABILITY REPORT 57 1H 2014

Copyright © 2014 Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company, the stylized Altera logo, specific device designations, and all other words and logos that are identified as trademarks and/or service marks are, unless noted otherwise, the trademarks and service marks of Altera Corporation in the U.S. and other countries. All other product or service names are the property of their respective holders. Altera products are protected under numerous U.S. and foreign patents and pending applications, maskwork rights, and copyrights. Altera warrants performance of its semiconductor products to current specifications in accordance with Altera's standard warranty, but reserves the right to make changes to any products and services at any time without notice. Altera assumes no responsibility or liability arising out of the application or use of any information, product, or service described herein except as expressly agreed to in writing by Altera Corporation. Altera customers are advised to obtain the latest version of device specifications before relying on any published information and before placing orders for products or services. 2

TABLE OF CONTENTS Overview .............................................................................................................................4 Altera Quality Policy .........................................................................................................4 Altera Quality Systems ......................................................................................................5 Figure 1: Typical Product Flow Chart ...................................................................................................... 6 Reliability Methodology ....................................................................................................7 Table I: Product Family Description ......................................................................................................... 7 Table II: Reliability Qualification Requirements....................................................................................... 9 Table III: Reliability Monitor Program.................................................................................................... 10 Lifetest: Methodology and Failure Rate Prediction .....................................................11 Lifetest Methodology............................................................................................................................... 11 Failure Rate Prediction ............................................................................................................................ 12 Table IV: Common Failure Mechanisms and Acceleration Factors ....................................................... 13 Lifetest Results .................................................................................................................14 Table V: Lifetest summary ..................................................................................................................... 14 FLEX 0.42 Products .............................................................................................................................. 15 FLEX 0.3/0.35 Products ........................................................................................................................ 16 FLEX, ACEX, and APEX 0.22 Products .............................................................................................. 17 APEX, Excalibur, and Mercury 0.18 Products ...................................................................................... 18 APEX and Mercury 0.15 Products ........................................................................................................ 19 Stratix, Stratix GX, Cyclone and HardCopy 0.13 Products................................................................... 20 Stratix II, Stratix II GX, Cyclone II, Arria GX and HardCopy II – 90 nm Products ............................... 21 Stratix III, Cyclone III and Cyclone IV – 65/60 nm Products ................................................................. 22 Stratix IV, Arria II GX & GZ and HardCopy III & IV – 40 nm Products ............................................... 22 Arria V and Cyclone V – 28nm Low Power Products ............................................................................. 23 Stratix V – 28nm High Performance Products ........................................................................................ 25 MAX 7000S and MAX 9000 – Third Generation ................................................................................... 26 MAX 7000A and MAX 3000A – Fourth Generation .............................................................................. 27 MAX 7000B – Fifth Generation .............................................................................................................. 28 MAX II, MAX V – 0.18 μm FLASH Products ....................................................................................... 29 Configuration Devices – EPROM ........................................................................................................... 30 Configuration Devices – Flash Memory .................................................................................................. 31 PowerSoC 5300 and 6300 Family ........................................................................................................... 32 PowerSoC EN2300 Family and EC2360 ................................................................................................. 33 PowerSoC EV1300 Family ...................................................................................................................... 34 High Temperature Storage .............................................................................................35 Reflow Simulation and Moisture Preconditioning .......................................................37 Accelerated Moisture Resistance ....................................................................................38 Autoclave ................................................................................................................................................. 38 Unbiased HAST ....................................................................................................................................... 38 Temperature Humidity Bias ...........................................................................................42 Highly Accelerated Stress Testing ........................................................................................................... 44 Temperature Cycling .......................................................................................................47 PowerSoC Device Package Stress ...................................................................................50 Temperature Humidity Test ...........................................................................................52 Solder Joint Reliability ....................................................................................................54 Serial Configuration Devices ..........................................................................................58 Quad-Serial Configuration Devices ...............................................................................58 0.15 μm process – Monitoring Results .................................................................................................... 58 0.11 μm process – Monitoring Results .................................................................................................... 59 65 nm process – Monitoring Results ....................................................................................................... 59 3

Overview Altera® Corporation is the pioneer of programmable logic solutions, enabling system and semiconductor companies to rapidly and cost effectively innovate, differentiate, and win in their markets. Altera offers FPGAs, SoCs with embedded processor systems, and CPLDs in combination with software tools, intellectual property, embedded processors and customer support to provide high- value programmable solutions. This report shows reliability results on each product family from Altera's product catalog. All results successfully meet Altera quality and reliability standards. Altera ensures that standards are constantly met through continuous monitoring. Altera Quality Commitment DRIVE Quality in everything we do to ensure the Customer’s total quality experience! D Deliver defect-free products and services on time R Requirements are met at all times for internal and external customers I Improve continuously V Verify effectiveness E Every Altera employee is responsible! Altera’s corporate mission is to be the preferred fabless supplier of FPGAs, SoCs with embedded processor systems, CPLDs, ASICs and PowerSoCs in combination with software tools, intellectual property, embedded processors and customer support, in order to provide high-value programmable solutions. Altera will use this advantage to gain market share penetration into the larger Logic IC market. To achieve and maintain this preferred supplier status, we must provide cost–effective, state–of–the–art solutions to our customers, in a timely manner, while consistently meeting their quality, reliability, and service requirements. We ensure that all products and services receive optimum attention to detail, from conception to delivery. We are committed to sustaining a corporate culture that strives for risk management, defect-free performance, verification of effectiveness and continuous improvement, and which extends to all our activities as well as to our supply chain partners. Achieving Quality is the responsibility of all Altera employees, managers, directors, and officers. To achieve our corporate goals, we must: conform to all applicable procedures and specifications,  produce quality work,   monitor the performance of our business processes against current quality goals,  derive and implement quality improvements from this performance analysis. 4

Altera Quality Systems Altera has a closed-loop quality and reliability system that conforms to the requirements of ISO 9001:2008, MIL-I-45208 and JEDEC® standards. Altera and all of its major suppliers are ISO 9000 certified. Altera’s Reliability qualification and monitoring programs are also governed by internal specifications, which define procedures, pass/fail requirements, and corrective actions. Altera has been ISO9001 certified since October, 1994. Altera is able to provide the automotive supply chain with the highest levels of quality and reliability because all of Altera’s foundry, assembly and test partners are certified and registered to the ISO/TS 16949 automotive industry quality standard. Altera conducts automotive product qualification which complies with requirements listed in the AEC- Q100 document. Altera performs comprehensive testing and manufacturing controls on all its products. Figure 1 shows a typical product manufacturing flow. 5

Figure 1: Typical Product Flow Chart Wafer Fabrication All Critical Process Steps under SPC Control Wafer Inspection Visual and E-test, Sample 100% of all lots Wafer Sort 1 DC Parametrics, Functionality Programmability, Non- Volatile Margin or SRAM Configuration Data Retention Bake 245°C, 48 hours for all EPROM, EEPROM, and FLASH products Wafer Sort 2 Margin Test EPROM, EEPROM, and FLASH (except MAX II & V) products Assembly 2nd, 3rd, and 4th Optical Sample Inspections, Inline Mark Final Test AC and DC Parametrics, Functionality, Programmability or SRAM Configuration QA Electrical Mark As Required Visual Inspection Including machine inspection of all packages > 44 leads. QA Inspection Inner Box and Transfer to Finished Goods Bake and Bag per Specification Plant Clearance, Outer Box, and Ship 6

Reliability Methodology Reliability qualifications and monitoring are performed specifically for each product family. All members of a product family utilize the same circuit architecture, fabrication process, and share the same package types. See the list and description of Altera Product Families in Table I. Table I: Product Family Description PRODUCT FAMILY TECHNOLOGY WAFER PROCESS Stratix® V, Arria® V, Cyclone® V FPGA 0.028um Stratix IV, Arria II GX, HardCopy® III, HardCopy IV FPGA 0.040um FPGA 0.065/0.060um Stratix III, Cyclone III, Cyclone IV FPGA 0.090um Stratix II, Stratix II GX, Cyclone II, Arria GX, HardCopy II FPGA 0.13um Stratix, Stratix GX, Cyclone, HardCopy FPGA 0.15um APEX™ 20KC, APEX II, Mercury FPGA 0.18um APEX 20KE, Mercury™, Excalibur™ FLEX® 10KE, FLEX 10KS, ACEX, APEX 20K FPGA 0.22um FPGA 0.3/0.35um FLEX 10KA, FLEX 6000A FPGA 0.42um FLEX 8000, FLEX 10K, FLEX 6000 MAX® II, MAX V CPLD/FLASH 0.18um CPLD/EEPROM 0.22um MAX 7000B CPLD/EEPROM 0.3/0.35um MAX 7000A, MAX 3000A CPLD/EEPROM 0.5um MAX 7000, MAX 9000 0.5um EPROM EPC1 0.11/0.15/0.065um EPCS1, EPCS4, EPCS16, EPCS64, EPCS128 FLASH EPCQ16, EPCQ32, EPCQ64, EPCQ128, EPCQ256, EPCQ512 FLASH 0.065um 0.35/0.4um FLASH EPC2, EPC4, EPC8, EPC18 PowerSoC EP5300, EN5300, EN6300 (5V and 6V devices ) 0.25um EN2300*, EC2630** (12 V device) PowerSoC 0.18/0.25um/0.35um EV1320, EV1340, EV1380 (1.8V device) PowerSoC 0.18/0.25um *Package contains 2 dies with different processes 0.18 and 0.25um ** Product built on 0.35um wafer technology. A product family will contain several products, all based upon the same logic elements, embedded storage elements, and programmable interconnect technology. For reliability purposes such as data reporting and failure rate prediction, a product family will be reported as much as possible on a fabrication process technology. Product families are qualified based upon the requirements specified in Table II. Product family qualification will include products with a range of densities, package types, and package lead counts. 7

If a new product is added to the product family with a significant increase (more than 50%) in logic elements, a product qualification will be performed. Reliability monitors are performed on a regular basis in order to assure that Altera’s normal production testing and process control methodologies produce reliable products. The reliability monitor program is also based upon a product family methodology. Altera has a product reliability goal for long term failure rate. The long term failure rate is listed as <200 FIT’s at 55°C use condition. Inherent in this requirement are two key components:  Product needs to meet lifetime goal of 100,000 hrs of useful life  The wear-out mechanisms are outside of the useful life of the product. Different products and package types are procured from normal production on a Last in First out (LIFO) schedule to monitor product reliability. Results in this report cover data gathered at least in the last 36 months. For life-test, the report covers a much larger period to assess FIT numbers more accurately. Reliability monitor sampling is defined in Table III. Reliability monitor schedules depend on the maturity of the product: A) Minimum of 1 lot per quarter for new product in production since less than 5 years B) Minimum of 1 lot per year for mature products in production for more than 5 years. All new results shown in this reliability report compared to previous version appear upfront in each table of results and are highlighted in a different color and font. 8

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