BES2300-IH_Datasheet_v0.25.pdf

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BES2300-IH Bluetooth 5.0 Ultra Low Power Audio Platform Product Specification Rev 0.25 DISCLAIMER: Bestechnic (Shanghai) Co., Ltd Room 201, Tower B, ChamtimePlaza, Lane 2889 Jinke Road, Pudong New District, Shanghai 201203, China PHONE: (86)21 6886 7870 FAX: (86)21 6886 7870 - 617 Confidential and Proprietary – Bestechnic (Shanghai) Co., Ltd No part of this document may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying and recording, for any purpose, without the express written permission of Bestechnic. Bestechnic retains the right to make changes to this document at any time, without notice. Bestechnic makes no warranty of any kind, expressed or implied, with regard to any information contained in this document, including, but not limited to, the implied warranties of merchantability or fitness for any particular purpose. Further, Bestechnic does not warrant the accuracy or completeness of the information, text, graphics, or other items contained within this document.

BES2300-IH Product Specification Datasheet Status Status description. Datasheet Status Product Status Revision Control Description Draft Development Rev 0.01 - 0.49 Datasheets contain pre-tapeout information from the objective design specification and is only for internal use. Preliminary Qualification Rev 0.50 - 0.99 Datasheets contain information on post-tapeout and pre-volume production products, and a revision of this document or supplementary information may be published at a later date. BESTECHNIC may make changes to these specifications at any time without notice. Released Production Rev1.xx Datasheets contain information on volume production products. BESTECHNIC may make changes to these specifications at any time without notice. Revision History Bars appearing in the margin (as shown here) indicate where technical changes have occurred for this revision. The following table lists the technical content changes for all revisions. Revision Date Description 0.1 0.11 0.12 0.20 0.21 0.22 0.23 0.24 0.25 2/11/2018 5/11/2018 7/11/2018 7/11/2018 21/11/2018 27/11/2018 24/12/2018 28/02/2019 15/03/2019 Initial draft Update Ball Map Update Internal Memory Update POD Modify Support Audio Bit Update spec Update ball map and pin list Update frequency Update ball map and pin list Rev 0.25 Page2 / 26 Confidential and Proprietary – Bestechnic (Shanghai) Co., Ltd

BES2300-IH Product Specification Table of contents Datasheet Status ................................................................................................................................................................... 2 Revision History .................................................................................................................................................................... 2 List of Tables and figures ...................................................................................................................................................... 5 1 General Description ........................................................................................................................................................... 6 1.1 Applications ............................................................................................................................................................ 6 1.2 Features .................................................................................................................................................................. 7 2 Platform Feature ................................................................................................................................................................ 8 2.1 MCU Subsystem ...................................................................................................................................................... 8 2.2 Memory .................................................................................................................................................................. 8 2.3 System Peripherals.................................................................................................................................................. 9 2.4 Power Management ............................................................................................................................................... 9 2.5 Audio Interface ....................................................................................................................................................... 9 3 Bluetooth Modem Description ........................................................................................................................................ 10 3.1 Radio ..................................................................................................................................................................... 10 3.2 Auxiliary feature .................................................................................................................................................... 10 3.3 Bluetooth Stack ..................................................................................................................................................... 10 4 Electrical Characteristics .................................................................................................................................................. 11 4.1 Bluetooth Electrical Characteristics ...................................................................................................................... 11 4.2 Bluetooth Radio Electrical Characteristics ............................................................................................................ 12 4.3 Audio Codec Electrical Characteristics .................................................................................................................. 14 4.4 BUCK Electrical Characteristics ............................................................................................................................. 16 5 Pin Map & Application Schematic .................................................................................................................................... 17 5.1 Pin Description ...................................................................................................................................................... 17 5.2 Application Schematic........................................................................................................................................... 18 Rev 0.25 Page3 / 26 Confidential and Proprietary – Bestechnic (Shanghai) Co., Ltd

BES2300-IH Product Specification 6 Package Dimensions ........................................................................................................................................................ 19 6.1 BGA Dimensions .................................................................................................................................................... 19 7 SMT Caution ..................................................................................................................................................................... 21 7.1 Land Pad and Stencil Design ................................................................................................................................. 21 7.2 Solder Reflow Profile ............................................................................................................................................ 21 7.3 RoHS Compliant .................................................................................................................................................... 22 7.3 ESD Sensitivity ....................................................................................................................................................... 22 7.4 Storage Alert ......................................................................................................................................................... 22 8 Ordering Information ....................................................................................................................................................... 24 9 Tape and Reel Information .............................................................................................................................................. 25 9.1 Tape Orientation ................................................................................................................................................... 25 9.2 Reel Dimensions .................................................................................................................................................... 25 9.3 Tape Dimensions ................................................................................................................................................. 26 9.4 Moisture Sensitivity Level ..................................................................................................................................... 26 Rev 0.25 Page4 / 26 Confidential and Proprietary – Bestechnic (Shanghai) Co., Ltd

BES2300-IH Product Specification List of Tables and figures Table 4-1 DC Electrical Specification ........................................................................................................................... 11 Table 4-2 DC Electrical Specification ........................................................................................................................... 11 Table 4-3 Power Consumption.................................................................................................................................... 11 Table 4-4 Receiver Characteristics - Basic Data Rate .................................................................................................. 12 Table 4-5 Transmitter Characteristics - Basic Data Rate ............................................................................................. 12 Table 4-6 Receiver Characteristics - Enhanced Data Rate .......................................................................................... 13 Table 4-7 Transmitter Characteristics - Enhanced Data Rate ..................................................................................... 14 Table 4-8 Digital to Analogue Converter under 1.95V ................................................................................................ 14 Table 5-1 BES2300-IH 48-Pins Description .................................................................................................................. 17 Table 7-1 Package Peak Reflow Temperature - Sn/Pb ................................................................................................ 21 Table 7-2 Package peak reflow temperature - Pb-Free .............................................................................................. 21 Figure 1-1 BES2300-IH Top View ................................................................................................................................... 6 Figure 2-1 Platform Architecture .................................................................................................................................. 8 Figure 5-1 BES2300-IH 48-pin ..................................................................................................................................... 17 Figure 6-1 BES2300-IH 48-pin location ....................................................................................................................... 20 Figure 7-1 Solder Reflow Profile ................................................................................................................................. 21 Figure 9-1 Tape Orientation ........................................................................................................................................ 25 Figure 9-2 Reel Dimensions ........................................................................................................................................ 25 Figure 9-3 Tape Dimensions........................................................................................................................................ 26 Rev 0.25 Page5 / 26 Confidential and Proprietary – Bestechnic (Shanghai) Co., Ltd

BES2300-IH Product Specification 1 General Description BES2300-IH is a highly integrated SOC with Bluetooth 5.0 dual mode and high performance Cortex-M4F for audio and voice application. BES2300-H minimizes the external components and BOM cost by highly integrating RF transceiver, high performance audio codec and cap-less headphone driver. It also integrates serial Flash and powerful Cortex-M4F MCU to support various software features and product customization. It is manufactured with advanced low power CMOS process and assembled with a 2.7*4.4mm 48-pin BGA package. Figure 1-1 BES2300-IH Top View 1.1 Applications  High-end BT speaker  Smart BT/WIFI music box  BT docking stations and Soundbars  BT boom box  Other portable audio device  IOT platform Rev 0.25 Page6 / 26 Confidential and Proprietary – Bestechnic (Shanghai) Co., Ltd MCUFLASHROM/RAMConnectivity/StoragePeripheralDC/DCLDOCRYSTALBTMAC/PHY BT_RFCODEC DIGDAC_L ADCDAC_R

BES2300-IH Product Specification 1.2 Features  CMOS fully-integrated RF, PMU, BB, Audio and  Immersive audio with 3D or virtual surround Cortex-M4F CPU sound  Bluetooth 5.0 dual mode  Support Active Crossover  5-band fully configurable EQ  USB2.0 HS device  A2DP v1.3/AVRCP v1.5/HFP v1.6  Up to 156MHz ARM Cortex-M4F processor   Support USB Audio Playback 24 bit audio processing       1MB Serial Flash on-chip for custom program  HiFi Stereo Audio DAC: Cortex M4F with On-chip Boot-ROM and RAM Security Boot to Protect Custom IP 3.1V-4.5V Input for VBAT  120dB SNR  110dB DNR  Sample Rates From 8 kHz to 384 kHz Internal LPO support for low power mode.  HiFi Stereo Audio ADC: Support DCXO with internal oscillator circuit  100dB SNR  Multi-band EQ and Bass enhancement  Supports Rates From 8 kHz to 384 kHz  Echo Cancellation  3D Recording Rev 0.25 Page7 / 26 Confidential and Proprietary – Bestechnic (Shanghai) Co., Ltd

BES2300-IH Product Specification 2 Platform Feature BES2300-IH is designed for high-resolution wireless audio MCU system as shown in Figure 2-1. Figure 2-1 Platform Architecture 2.1 MCU Subsystem BES2300-IH is embedded with the ARM Cortex-M4F processor, which provides best trade-off between system performance and power consumption. For Large amount of data transfer, high performance Direct Memory Access (DMA) is implemented, which greatly enhances the data movement speed while reducing MCU processing load.       Cortex-M4F high performance processor with float and HW DSP instruction Unified cache High performance multi-layer AMBA bus Operating frequency up to 156MHz On-chip boot ROM for factory Flash programming Secure boot support  Watchdog Timer for system crash recovery   General Purpose Timers DMA for audio/voice data transfer 2.2 Memory Rev 0.25 Page8 / 26 Confidential and Proprietary – Bestechnic (Shanghai) Co., Ltd Cortex-M4FBT5.0MACPHYAHB2APBDMA1SRAMFLASHBOOT ROMI2CGPIOGPADCTIMERSPI1UARTCMUWDTCODECPCMPWMAPBAHB

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