图像传感器资料.pdf

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Description

Features

Device Structure

Absolute Maximum Ratings

Recommended Operating Conditions

USE RESTRICTION NOTICE

Optical Center

Pixel Arrangement

Block Diagram and Pin Configuration

Pin Desctiption

Electrical Characteristics

DC Characteristics

Current Consumption

AC Characteristics

Master Clock Waveform (INCK)

XVS / XHS Input Characteristics In Slave Mode (DMODE pin = High)

XVS / XHS Input Characteristics In Master Mode (DMODE pin = Low, CMOS Output)

Serial Communication

DLCKP / DLCKM，DLOP / DLOM

I/O Equivalent Circuit Diagram

Spectral Sensitivity Characteristics

Image Sensor Characteristics

Zone Definition

Image Sensor Characteristics Measurement Method

Measurement Conditions

Color Coding of Physical Pixel Array

Definition of standard imaging conditions

Measurement Method

Setting Registers Using Serial Communication

Description of Setting Registers (4-wire)

Description of Setting Registers (I2C)

Communication Protocol

Single Read from Random Location

Single Read from Current Location

Sequential Read Starting from Random Location

Sequential Read Starting from Current Location

Single Write to Random Location

Sequential Write Starting from Random Location

Readout Drive mode

Sync code (Parallel CMOS output / Serial LVDS output)

Sync Code Output Timing

Image Data Output Format (CSI-2 output)

Frame Format

Frame Structure

Embedded Data Line

Image Data Output Format

All-pixel scan mode (Quad VGA)

2×2 binning mode (Quad VGA)

Horizontal / Vertical 1/2 subsampling mode (Quad VGA)

Window Cropping Mode

HD720p mode

Description of Various Function

Standby Mode

Slave Mode and Master Mode

Gain Adjustment Function

Black Level Adjustment Function

Normal Operation and Inverted Operation

Shutter and Integration Time Settings

Example of Integration Time Setting

Normal Exposure Operation (Controlling the Integration Time in 1H Units)

Long Exposure Operation (Control by Expanding the Number of Lines per Frame)

Example of Integration Time Settings

Signal Output

Output Pin Settings

CSI-2 output

MIPI Transmitter

Output Pin Bit Width Selection

Number of Internal A/D Conversion Bits Setting

Output Rate Setting

Output Signal Range

INCK Setting

Software Reset (CMOS parallel / Low voltage LVDS serial only)

Mode Transitions

Power-on and Power-off Sequence

Power-on sequence

Power-off sequence

Sensor Setting Flow

Setting Flow in Sensor Slave Mode

Setting Flow in Sensor Master Mode

Peripheral Circuit

Spor Pixel Specifications

Zone Definition

Notice on White Pixels Specifications

Measurement Method for Spot Pixels

Spor Pixel Pattern Specification

Marking

Notes On Handling

Package Outline

Revision History

Diagonal 6.09 mm (Type 1/3) CMOS Solid-state Image Sensor with Square Pixel for Color Cameras Preliminary Description IMX224LQR The IMX224LQR is a diagonal 6.09 mm (Type 1/3) CMOS active pixel type solid-state image sensor with a square pixel array and 1.27 M effective pixels. This chip operates with analog 3.3 V, digital 1.2 V, and interface 1.8 V triple power supply, and has low power consumption. High sensitivity, low dark current and no smear are achieved through the adoption of R, G and B primary color mosaic filters. This chip features an electronic shutter with variable charge-integration time. (Applications: Surveillance cameras) Features ◆ CMOS active pixel type dots ◆ Built-in timing adjustment circuit, H/V driver and serial communication circuit ◆ Input frequency: 54 MHz / 27 MHz / 74.25 MHz / 37.125 MHz ◆ Number of recommended recording pixels: 1280 (H) × 960 (V) approx. 1.23M pixel ◆ Readout mode Quad VGA All-pixel scan mode Horizontal / Vertical 2 × 2 binning mode Horizontal / Vertical 1 / 2 Subsampling mode Window cropping mode 720p-HD readout mode Vertical / Horizontal direction-normal / inverted readout mode ◆ Readout rate Maximum frame rate in Quad VGA mode: 120 frame / s ◆ Variable-speed shutter function (resolution 1H units) ◆ 10-bit / 12-bit A/D converter ◆ Conversion gain switching (HCG Mode / LCG Mode) ◆ CDS / PGA function 0 dB to 30 dB: Analog Gain 30 dB (step pitch 0.1 dB) 30.1 dB to 72 dB: Analog Gain 30 dB + Digital Gain 0.1 to 42 dB (step pitch 0.1 dB) ◆ Supports I/O switching CMOS logic parallel SDR output Low voltage LVDS (150 m Vp-p) serial (1 ch / 2 ch / 4 ch switching) DDR output CSI-2 serial data output (1 Lane / 2 Lane / 4 Lane, RAW10 / RAW12 output) ◆ Recommended lens F number: 2.8 or more (Close side) ◆ Recommended exit pupil distance: –30 mm to –∞ * “Exmor” is a trademark of Sony Corporation. The “Exmor” is a version of Sony's high performance CMOS image sensor with high-speed processing, low noise and low power dissipation by using column-parallel A/D conversion. 1 Rev.0.1 Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility forany problems arising out of the use of these circuits.

Device Structure IMX224LQR ◆ CMOS image sensor ◆ Image size Type 1/3 ◆ Total number of pixels 1312 (H) × 993 (V) approx. 1.30 M pixels ◆ Number of effective pixels 1305 (H) × 977 (V) approx. 1.27 M pixels ◆ Number of active pixels 1297 (H) × 977 (V) approx. 1.27 M pixels ◆ Number of recommended recording pixels 1280 (H) × 960 (V) approx. 1.23 M pixels ◆ Unit cell size 3.75 µm (H) × 3.75 µm (V) ◆ Optical black Horizontal (H) direction: Front 4 pixels, rear 0 pixels Vertical (V) direction : Front 16 pixels, rear 0 pixels ◆ Dummy Horizontal (H) direction: Front 0 pixels, rear 3 pixels Vertical (V) direction : Front 0 pixels, rear 0 pixels ◆ Substrate material Silicon 2

Absolute Maximum Ratings IMX224LQR Item Symbol Min. Max. Unit Remarks Supply voltage (analog 3.3 V) Supply voltage (interface 1.8 V) Supply voltage (digital 1.2 V) Input voltage Output voltage Operating temperature Storage temperature AVDD OVDD DVDD VI VO Topr Tstg -0.3 -0.3 -0.3 -0.3 -0.3 TBD TBD 4.0 3.3 2.0 OVDD + 0.3 OVDD + 0.3 TBD TBD V V V V V ˚C ˚C Recommended Operating Conditions Not exceed 3.3 V Not exceed 3.3 V Unit V V V Item Symbol Supply voltage (analog 3.3 V) Supply voltage (Interface 1.8 V) Supply voltage (digital 1.2 V) AVDD OVDD DVDD Min. 3.15 1.70 1.10 Typ. 3.30 1.80 1.20 Max. 3.45 1.90 1.30 3

USE RESTRICTION NOTICE IMX224LQR 4 This USE RESTRICTION NOTICE ("Notice") is for customers who are considering or currently using the image sensor products ("Products") set forth in this specifications book. Sony Corporation ("Sony") may, at any time, modify this Notice which will be available to you in the latest specifications book for the Products. You should abide by the latest version of this Notice. If a Sony subsidiary or distributor has its own use restriction notice on the Products, such a use restriction notice will additionally apply between you and the subsidiary or distributor. You should consult a sales representative of the subsidiary or distributor of Sony on such a use restriction notice when you consider using the Products. Use Restrictions  The Products are intended for incorporation into such general electronic equipment as office products, communication products, measurement products, and home electronics products in accordance with the terms and conditions set forth in this specifications book and otherwise notified by Sony from time to time.  You should not use the Products for critical applications which may pose a life- or injury-threatening risk or are highly likely to cause significant property damage in the event of failure of the Products. You should consult your sales representative beforehand when you consider using the Products for such critical applications. In addition, you should not use the Products in weapon or military equipment.  Sony disclaims and does not assume any liability and damages arising out of misuse, improper use, modification, use of the Products for the above-mentioned critical applications, weapon and military equipment, or any deviation from the requirements set forth in this specifications book. Design for Safety  Sony is making continuous efforts to further improve the quality and reliability of the Products; however, failure of a certain percentage of the Products is inevitable. Therefore, you should take sufficient care to ensure the safe design of your products such as component redundancy, anti-conflagration features, and features to prevent mis-operation in order to avoid accidents resulting in injury or death, fire or other social damage as a result of such failure. Export Control  If the Products are controlled items under the export control laws or regulations of various countries, approval may be required for the export of the Products under the said laws or regulations. You should be responsible for compliance with the said laws or regulations. No License Implied  The technical information shown in this specifications book is for your reference purposes only. The availability of this specifications book shall not be construed as giving any indication that Sony and its licensors will license any intellectual property rights in such information by any implication or otherwise. Sony will not assume responsibility for any problems in connection with your use of such information or for any infringement of third-party rights due to the same. It is therefore your sole legal and financial responsibility to resolve any such problems and infringement. Governing Law  This Notice shall be governed by and construed in accordance with the laws of Japan, without reference to principles of conflict of laws or choice of laws. All controversies and disputes arising out of or relating to this Notice shall be submitted to the exclusive jurisdiction of the Tokyo District Court in Japan as the court of first instance. Other Applicable Terms and Conditions  The terms and conditions in the Sony additional specifications, which will be made available to you when you order the Products, shall also be applicable to your use of the Products as well as to this specifications book. You should review those terms and conditions when you consider purchasing and/or using the Products.

Contents IMX224LQR Description ......................................................................................................................................................................1 Features ..........................................................................................................................................................................1 Device Structure ..............................................................................................................................................................2 Absolute Maximum Ratings ..............................................................................................................................................3 Recommended Operating Conditions ...............................................................................................................................3 USE RESTRICTION NOTICE ..........................................................................................................................................4 Optical Center .................................................................................................................................................................7 Pixel Arrangement ...........................................................................................................................................................8 Block Diagram and Pin Configuration ...............................................................................................................................9 Pin Desctiption .............................................................................................................................................................. 11 Electrical Characteristics ................................................................................................................................................ 14 DC Characteristics ..................................................................................................................................................... 14 Current Consumption ................................................................................................................................................. 15 AC Characteristics...................................................................................................................................................... 16 Master Clock Waveform (INCK) ............................................................................................................................... 16 XVS / XHS Input Characteristics In Slave Mode (DMODE pin = High) ....................................................................... 17 XVS / XHS Input Characteristics In Master Mode (DMODE pin = Low, CMOS Output)............................................... 17 Serial Communication ............................................................................................................................................. 18 DLCKP / DLCKM，DLOP / DLOM ........................................................................................................................... 20 I/O Equivalent Circuit Diagram ....................................................................................................................................... 22 Spectral Sensitivity Characteristics ................................................................................................................................. 23 Image Sensor Characteristics ........................................................................................................................................ 24 Zone Definition ........................................................................................................................................................... 24 Image Sensor Characteristics Measurement Method ...................................................................................................... 25 Measurement Conditions ............................................................................................................................................ 25 Color Coding of Physical Pixel Array ........................................................................................................................... 25 Definition of standard imaging conditions .................................................................................................................... 25 Measurement Method................................................................................................................................................. 26 Setting Registers Using Serial Communication ............................................................................................................... 27 Description of Setting Registers (4-wire) ..................................................................................................................... 27 Register Communication Timing (4-wire) ..................................................................................................................... 27 Register Write and Read (4-wire) ................................................................................................................................ 28 Description of Setting Registers (I2C) .......................................................................................................................... 29 Register Communication Timing (I2C).......................................................................................................................... 29 Communication Protocol ............................................................................................................................................. 30 Register Write and Read (I2C)..................................................................................................................................... 31 Single Read from Random Location ........................................................................................................................ 31 Single Read from Current Location .......................................................................................................................... 31 Sequential Read Starting from Random Location ..................................................................................................... 32 Sequential Read Starting from Current Location ....................................................................................................... 32 Single Write to Random Location ............................................................................................................................. 33 Sequential Write Starting from Random Location ..................................................................................................... 33 Register Map ................................................................................................................................................................. 34 Readout Drive mode ...................................................................................................................................................... 47 Sync code (Parallel CMOS output / Serial LVDS output) .............................................................................................. 49 Sync Code Output Timing ........................................................................................................................................... 49 Image Data Output Format (CSI-2 output) ................................................................................................................... 50 Frame Format ......................................................................................................................................................... 50 Frame Structure ...................................................................................................................................................... 50 Embedded Data Line .............................................................................................................................................. 51 Image Data Output Format ......................................................................................................................................... 54 All-pixel scan mode (Quad VGA) ............................................................................................................................. 54 2×2 binning mode (Quad VGA)................................................................................................................................ 60 Horizontal / Vertical 1/2 subsampling mode (Quad VGA) .......................................................................................... 63 Window Cropping Mode .......................................................................................................................................... 66 HD720p mode ........................................................................................................................................................ 74 Description of Various Function ...................................................................................................................................... 80 Standby Mode ............................................................................................................................................................ 80 5

IMX224LQR Slave Mode and Master Mode .................................................................................................................................... 81 Gain Adjustment Function ........................................................................................................................................... 83 Black Level Adjustment Function ................................................................................................................................ 84 Normal Operation and Inverted Operation ................................................................................................................... 85 Shutter and Integration Time Settings ......................................................................................................................... 86 Example of Integration Time Setting ........................................................................................................................ 86 Normal Exposure Operation (Controlling the Integration Time in 1H Units) ................................................................... 87 Long Exposure Operation (Control by Expanding the Number of Lines per Frame) ....................................................... 88 Example of Integration Time Settings .......................................................................................................................... 88 Signal Output ............................................................................................................................................................. 89 Output Pin Settings ................................................................................................................................................. 89 CSI-2 output............................................................................................................................................................... 92 MIPI Transmitter......................................................................................................................................................... 94 Output Pin Bit Width Selection ................................................................................................................................. 95 Number of Internal A/D Conversion Bits Setting ....................................................................................................... 96 Output Rate Setting................................................................................................................................................. 97 Output Signal Range ............................................................................................................................................... 97 INCK Setting .............................................................................................................................................................. 97 Register Hold Setting.................................................................................................................................................. 98 Software Reset (CMOS parallel / Low voltage LVDS serial only) .................................................................................. 99 Mode Transitions ...................................................................................................................................................... 100 Power-on and Power-off Sequence .............................................................................................................................. 101 Power-on sequence ................................................................................................................................................. 101 Power-off sequence ................................................................................................................................................. 102 Sensor Setting Flow ................................................................................................................................................. 103 Setting Flow in Sensor Slave Mode ....................................................................................................................... 103 Setting Flow in Sensor Master Mode...................................................................................................................... 104 Peripheral Circuit ......................................................................................................................................................... 105 Spor Pixel Specifications .............................................................................................................................................. 106 Zone Definition ......................................................................................................................................................... 106 Notice on White Pixels Specifications ........................................................................................................................... 107 Measurement Method for Spot Pixels ........................................................................................................................... 108 Spor Pixel Pattern Specification ................................................................................................................................... 109 Marking ....................................................................................................................................................................... 110 Notes On Handling ...................................................................................................................................................... 111 Package Outline .......................................................................................................................................................... 113 Revision History........................................................................................................................................................... 114 6

Optical Center IMX224LQR Optical Center 7 Sensorscanning Vdirection (normal)Sensorscanning Hdirection (normal)Packageoutline Vdirection4.717 ± TBD mm5.773 ± TBD mmTop ViewPackage centerOptical centerA1-PinN1-PinA12-PinN12-PinPackageoutline HdirectionPackage reference (H, V)11.28 ± TBD mm10.00 ± TBD mm

IMX224LQR Pixel Arrangement * Reference pin number is consecutive numbering of package pin array. See the Pin Configuration for the number of each pin. Pixel Arrangement (Top View) 8 N1 pinA1 pinN12 pinA12 pinTop ViewReference pinOB side ignored area8214Dummy3Horizontal scan direction (Normal)Vertical scan direction (Normal)Vertical(V) direction effective OBTotal number of pixels:1312(H)×993(V) = 1.30 MNumber of effective pixels:1305(H)×977(V) = 1.27 MNumber of active pixels:1297(H)×977(V) = 1.27 MNumber of recommended recording pixels:1280(H)×960(V)= 1.23 MEffective margin for color processingEffective pixel sideignored area44Effective pixel sideignored areaGGBRGGBR8Effective margin for color processing912809Effective margin for color processingEffective margin for color processingRecording Pixel area4OB side ignored areaGGBRGGBR960

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