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PCI_Express_Mini 2.0 标准.pdf
PCI Express Mini Card Electromechanical Specification, Revision 2.0
Revision History
Contents
1. Introduction
1.1. Overview
1.2. Specification References
1.3. Targeted Applications
1.4. Features and Benefits
2. Mechanical Specification
2.1. Overview
2.2. Card Specifications
2.2.1. Card Form Factor
2.2.2. Card and Socket Types
2.2.3. Card PCB Details
2.3. System Connector Specifications
2.3.1. System Connector
2.3.2. System Connector Parametric Specifications
2.4. I/O Connector Area
2.5. Recommended Socket Configurations
2.5.1. Single-Use Full-Mini and Half-Mini Sockets
2.5.2. Dual-Use Sockets
2.5.3. Dual Head-to-Head Sockets
2.5.4. Side-by-Side Socket Spacing
2.6. Thermal Guidelines
2.6.1. Thermal Design Definitions
2.6.2. Thermal Guidelines for PCI Express Mini Card Addin Card Designers
2.6.2.1. Implementation Considerations
2.6.3. Thermal Guidelines for Integrating Wireless Wide Area Network Mini Card Add-in Cards
3. Electrical Specifications
3.1. Overview
3.2. System Interface Signals
3.2.1. Power Sources and Grounds
3.2.2. PCI Express Interface
3.2.3. USB Interface
3.2.4. DisplayPort Interface
3.2.4.1. HPD
3.2.4.2. DMC#
3.2.4.3. MLDIR
3.2.5. Auxiliary Signals
3.2.5.1. Reference Clock
3.2.5.2. CLKREQ# Signal
3.2.5.2.1. Power-up Requirements
3.2.5.2.2. Dynamic Clock Control
3.2.5.2.3. Clock Request Support Reporting and Enabling
3.2.5.3. PERST# Signal
3.2.5.4. WAKE# Signal
3.2.5.5. SMBus
3.2.6. Communications Specific Signals
3.2.6.1. Status Indicators
3.2.6.2. W_DISABLE# Signal
3.2.7. User Identity Module (UIM) Interface
3.2.7.1. UIM_PWR
3.2.7.2. UIM_RESET
3.2.7.3. UIM_CLK
3.2.7.4. UIM_SPU
3.2.7.5. UIM_DATA
3.2.7.6. UIM_IC_DP
3.2.7.7. UIM_IC_DM
3.3. Connector Pin-out Definitions
3.3.1. Grounds
3.3.2. Coexistence Pins
3.3.3. Reserved Pins
3.4. Electrical Requirements
3.4.1. Logic Signal Requirements
3.4.2. Digital Interfaces
3.4.2.1. Signal Integrity Requirements and Test Procedures for 2.5 GT/s Support
3.4.2.2. Signal Integrity Requirements and Test Procedures for 5.0 GT/s Support
3.4.3. Power
3.5. Card Enumeration
A. Supplemental Guidelines for PCI Express Mini Card Connector Testing
A.1. Test Boards Assembly
A.1.1. Base Board Assembly
A.1.2. Plug-in Cards Assembly
A.2. Insertion Loss Measurement
A.3. Return Loss Measurement
A.4. Near End Crosstalk Measurement
B. I/O Connector Guidelines
B.1. Wire-line Modems
B.2. IEEE 802.3 Wired Ethernet
B.3. IEEE 802.11 Wireless Ethernet
PCI Express®
Specification
Revision 2.0
Mini Card Electromechanical
April 21, 2012
PCI EXPRESS MINI CARD ELECTROMECHANICAL SPECIFICATION, REV 2.0
Revision
1.0
1.1
1.2
2.0
Revision History
Initial release.
Incorporated approved Errata and ECNs.
Incorporated approved ECNs.
Incorporated approved ECNs and updated
dimensioned drawings to latest ANSI Y14.5
methods.
Date
6/2/2003
3/28/2003
10/26/2007
04/21/2012
PCI-SIG disclaims all warranties and liability for the use of this document and the information
contained herein and assumes no responsibility for any errors that may appear in this document, nor
does the PCI-SIG make a commitment to update the information contained herein.
Contact the PCI-SIG office to obtain the latest revision of the specification.
Membership Services
www.pcisig.com
E-mail: administration@pcisig.com
Phone: 503-619-0569
Fax:
503-644-6708
Technical Support
techsupp@pcisig.com
DISCLAIMER
This PCI Express Mini Card Electromechanical Specification is provided "as is" with no
warranties whatsoever, including any warranty of merchantability, noninfringement, fitness
for any particular purpose, or any warranty otherwise arising out of any proposal,
specification, or sample. PCI-SIG disclaims all liability for infringement of proprietary
rights, relating to use of information in this specification. No license, express or implied, by
estoppel or otherwise, to any intellectual property rights is granted herein.
PCI, PCI Express, PCIe, and PCI-SIG are trademarks or registered trademarks of PCI-SIG.
All other product names are trademarks, registered trademarks, or service marks of their respective
owners.
2
Copyright © 2003, 2005, 2007, 2012 PCI-SIG
PCI EXPRESS MINI CARD ELECTROMECHANICAL SPECIFICATION, REV 2.0
2.3.
2.4.
2.5.
2.6.
2.6.2.1.
Contents
1.
2.1.
2.2.
1.1.
1.2.
1.3.
1.4.
INTRODUCTION ...................................................................................................................7
OVERVIEW ................................................................................................................... 7
SPECIFICATION REFERENCES........................................................................................ 9
TARGETED APPLICATIONS ........................................................................................... 9
FEATURES AND BENEFITS .......................................................................................... 10
2. MECHANICAL SPECIFICATION ......................................................................................11
OVERVIEW ................................................................................................................. 11
CARD SPECIFICATIONS............................................................................................... 11
2.2.1. Card Form Factor..................................................................................................... 12
2.2.2. Card and Socket Types.............................................................................................. 14
2.2.3. Card PCB Details ..................................................................................................... 14
SYSTEM CONNECTOR SPECIFICATIONS....................................................................... 23
2.3.1. System Connector...................................................................................................... 23
2.3.2. System Connector Parametric Specifications........................................................... 24
I/O CONNECTOR AREA............................................................................................... 25
RECOMMENDED SOCKET CONFIGURATIONS............................................................... 26
2.5.1. Single-Use Full-Mini and Half-Mini Sockets ........................................................... 26
2.5.2. Dual-Use Sockets...................................................................................................... 29
2.5.3. Dual Head-to-Head Sockets ..................................................................................... 32
2.5.4. Side-by-Side Socket Spacing..................................................................................... 35
THERMAL GUIDELINES............................................................................................... 35
2.6.1. Thermal Design Definitions...................................................................................... 35
2.6.2. Thermal Guidelines for PCI Express Mini Card Add-in Card Designers................ 36
Implementation Considerations ........................................................................ 37
2.6.3. Thermal Guidelines for Integrating Wireless Wide Area Network Mini Card Add-in
Cards......................................................................................................................... 38
3. ELECTRICAL SPECIFICATIONS ......................................................................................41
OVERVIEW ................................................................................................................. 41
SYSTEM INTERFACE SIGNALS..................................................................................... 41
3.2.1. Power Sources and Grounds .................................................................................... 43
3.2.2. PCI Express Interface............................................................................................... 43
3.2.3. USB Interface............................................................................................................ 44
3.2.4. DisplayPort Interface................................................................................................ 45
3.2.4.1. HPD................................................................................................................... 45
3.2.4.2. DMC# ............................................................................................................... 45
3.2.4.3. MLDIR.............................................................................................................. 45
3.2.5. Auxiliary Signals....................................................................................................... 46
3.2.5.1. Reference Clock................................................................................................ 46
3.2.5.2. CLKREQ# Signal ............................................................................................. 46
3.2.5.3. PERST# Signal ................................................................................................. 49
3.2.5.4. WAKE# Signal ................................................................................................. 50
3.2.5.5. SMBus............................................................................................................... 50
3.1.
3.2.
3
PCI EXPRESS MINI CARD ELECTROMECHANICAL SPECIFICATION, REVISION 2.0
3.2.6. Communications Specific Signals............................................................................. 50
3.2.6.1. Status Indicators................................................................................................ 50
3.2.6.2. W_DISABLE# Signal....................................................................................... 51
3.2.7. User Identity Module (UIM) Interface...................................................................... 52
3.2.7.1. UIM_PWR ........................................................................................................ 52
3.2.7.2. UIM_RESET..................................................................................................... 53
3.2.7.3. UIM_CLK......................................................................................................... 53
3.2.7.4. UIM_SPU ......................................................................................................... 53
3.2.7.5. UIM_DATA...................................................................................................... 53
3.2.7.6. UIM_IC_DP...................................................................................................... 53
3.2.7.7. UIM_IC_DM .................................................................................................... 54
CONNECTOR PIN-OUT DEFINITIONS ........................................................................... 54
3.3.1. Grounds..................................................................................................................... 55
3.3.2. Coexistence Pins ....................................................................................................... 55
3.3.3. Reserved Pins............................................................................................................ 55
ELECTRICAL REQUIREMENTS..................................................................................... 56
3.4.1. Logic Signal Requirements ....................................................................................... 56
3.4.2. Digital Interfaces ...................................................................................................... 56
3.4.2.1. Signal Integrity Requirements and Test Procedures for 2.5 GT/s Support....... 56
3.4.2.2. Signal Integrity Requirements and Test Procedures for 5.0 GT/s Support....... 59
3.4.3. Power ........................................................................................................................ 61
CARD ENUMERATION................................................................................................. 62
A. SUPPLEMENTAL GUIDELINES FOR PCI EXPRESS MINI CARD CONNECTOR
TESTING...............................................................................................................................63
TEST BOARDS ASSEMBLY .......................................................................................... 63
A.1.1. Base Board Assembly................................................................................................ 64
A.1.2. Plug-in Cards Assembly............................................................................................ 65
INSERTION LOSS MEASUREMENT............................................................................... 66
RETURN LOSS MEASUREMENT................................................................................... 66
NEAR END CROSSTALK MEASUREMENT .................................................................... 66
I/O CONNECTOR GUIDELINES ........................................................................................69
WIRE-LINE MODEMS.................................................................................................. 69
IEEE 802.3 WIRED ETHERNET................................................................................... 69
IEEE 802.11 WIRELESS ETHERNET ........................................................................... 69
A.2.
A.3.
A.4.
B.1.
B.2.
B.3.
B.
3.3.
3.4.
3.5.
A.1.
4
PCI EXPRESS MINI CARD ELECTROMECHANICAL SPECIFICATION, REVISION 2.0
Figures
FIGURE 1-1: PCI EXPRESS MINI CARD ADD-IN CARD INSTALLED IN A MOBILE PLATFORM ........... 8
FIGURE 1-2: LOGICAL REPRESENTATION OF THE PCI EXPRESS MINI CARD SPECIFICATION ........... 8
FIGURE 2-1: FULL-MINI CARD FORM FACTOR (MODEM EXAMPLE APPLICATION SHOWN) .......... 12
FIGURE 2-2: HALF-MINI CARD FORM FACTOR (WIRELESS EXAMPLE APPLICATION SHOWN)....... 13
FIGURE 2-3: DISPLAY-MINI CARD FORM FACTOR (WIRELESS EXAMPLE APPLICATION SHOWN) . 13
FIGURE 2-4: FULL-MINI CARD TOP AND BOTTOM ........................................................................ 15
FIGURE 2-5: HALF-MINI CARD TOP AND BOTTOM........................................................................ 16
FIGURE 2-6: DISPLAY-MINI CARD TOP AND BOTTOM................................................................... 17
FIGURE 2-7: CARD TOP AND BOTTOM DETAILS A AND B ............................................................. 18
FIGURE 2-8: CARD EDGE............................................................................................................... 19
FIGURE 2-9: CARD COMPONENT KEEP OUT AREAS FOR FULL-MINI CARDS ................................. 20
FIGURE 2-10: CARD COMPONENT KEEP OUT AREAS FOR HALF-MINI CARDS............................... 21
FIGURE 2-11: CARD COMPONENT KEEP OUT AREAS FOR DISPLAY-MINI CARDS.......................... 22
FIGURE 2-12: PCI EXPRESS FULL-MINI AND HALF-MINI CARD SYSTEM CONNECTOR ................. 23
FIGURE 2-13: PCI EXPRESS DISPLAY-MINI CARD SYSTEM CONNECTOR ...................................... 23
FIGURE 2-14: I/O CONNECTOR LOCATION AREAS ........................................................................ 26
FIGURE 2-15: RECOMMENDED SYSTEM BOARD LAYOUT FOR FULL-MINI-ONLY SOCKET ............ 27
FIGURE 2-16: RECOMMENDED SYSTEM BOARD LAYOUT FOR HALF-MINI-ONLY SOCKET............ 28
FIGURE 2-17: RECOMMENDED SYSTEM BOARD LAYOUT (DETAIL D)........................................... 28
FIGURE 2-18: DUAL-USE SOCKET................................................................................................. 30
FIGURE 2-19: RECOMMENDED SYSTEM BOARD LAYOUT FOR DUAL-USE FULL/HALF-MINI CARD
SOCKET.................................................................................................................................. 31
FIGURE 2-20: RECOMMENDED SYSTEM BOARD LAYOUT FOR DUAL-USE DISPLAY/HALF-MINI
CARD SOCKET........................................................................................................................ 32
FIGURE 2-21: DUAL HEAD-TO-HEAD SOCKET .............................................................................. 33
FIGURE 2-22: RECOMMENDED SYSTEM BOARD LAYOUT FOR DUAL HEAD-TO-HEAD SOCKETS... 34
FIGURE 2-23: RECOMMENDED SYSTEM BOARD LAYOUT (FULL AND HALF-MINI CARD SIDE-BY-
SIDE SPACING)....................................................................................................................... 35
FIGURE 2-24: POWER DENSITY UNIFORM LOADING AT 80 PERCENT COVERAGE.......................... 37
FIGURE 3-1: POWER-UP CLKREQ# TIMING................................................................................. 48
FIGURE 3-2: CLKREQ# CLOCK CONTROL TIMINGS..................................................................... 49
Tables
TABLE 2-1: MINI CARD FORM FACTORS........................................................................................ 11
TABLE 2-2: CARD AND SOCKET TYPES CROSS-COMPATIBILITY.................................................... 14
TABLE 2-3: SYSTEM CONNECTOR PHYSICAL REQUIREMENTS....................................................... 24
TABLE 2-4: SYSTEM CONNECTOR MECHANICAL PERFORMANCE REQUIREMENTS ........................ 24
TABLE 2-5: SYSTEM CONNECTOR ELECTRICAL PERFORMANCE REQUIREMENTS .......................... 25
TABLE 2-6: SYSTEM CONNECTOR ENVIRONMENTAL PERFORMANCE REQUIREMENTS .................. 25
TABLE 2-7: MAXIMUM TDP.......................................................................................................... 38
TABLE 3-1: PCI EXPRESS MINI CARD SYSTEM INTERFACE SIGNALS ............................................ 41
TABLE 3-2: PCI EXPRESS DISPLAY-MINI CARD SYSTEM INTERFACE SIGNALS............................. 43
TABLE 3-3: MLDIR PIN TERMINATION ........................................................................................ 45
5
PCI EXPRESS MINI CARD ELECTROMECHANICAL SPECIFICATION, REVISION 2.0
TABLE 3-4: POWER-UP CLKREQ# TIMINGS ................................................................................ 48
TABLE 3-5: CLKREQ# CLOCK CONTROL TIMINGS ...................................................................... 49
TABLE 3-6: SIMPLE INDICATOR PROTOCOL FOR LED STATES ...................................................... 51
TABLE 3-7: RADIO OPERATIONAL STATES.................................................................................... 52
TABLE 3-8: SYSTEM CONNECTOR PIN-OUT................................................................................... 54
TABLE 3-9: DC SPECIFICATION FOR 3.3V LOGIC SIGNALING........................................................ 56
TABLE 3-10: SIGNAL INTEGRITY REQUIREMENTS AND TEST PROCEDURES FOR 2.5 GT/S ............. 57
TABLE 3-11: SIGNAL INTEGRITY REQUIREMENTS AND TEST PROCEDURES FOR 5 GT/S ................ 59
TABLE 3-12: POWER RATINGS ...................................................................................................... 61
6
PCI EXPRESS MINI CARD ELECTROMECHANICAL SPECIFICATION, REVISION 2.0
1
Introduction
1.
1.1. Overview
This specification defines an implementation for small form factor PCI Express cards. The
specification uses a qualified subset of the same signal protocol, electrical definitions, and
configuration definitions as the PCI Express Base Specification, Revision 2.0. Where this specification
does not explicitly define PCI Express characteristics, the PCI Express Base Specification governs.
The primary differences between a PCI Express add-in card (as defined by the PCI Express Card
Electromechanical Specification) and a PCI Express Mini Card add-in card is a unique card form factor
optimized for mobile computing platforms and a card-system interconnection optimized for
communication applications. Specifically, PCI Express Mini Card add-in cards are smaller and have
smaller connectors than standard PCI Express add-in cards.
Figure 1-1 shows a conceptual drawing of this form factor as it may be installed in a mobile
platform. Figure 1-1 does not reflect the actual dimensions and physical characteristics as those
details are specified elsewhere in this specification. However, it is representative of the general
concept of this specification to use a single system connector to support all necessary system
interfaces by means of a common edge connector. Communications media interfaces may be
provided via separate I/O connectors and RF connectors each with independent cables as illustrated
in Figure 1-1.
5
10
15
7
PCI EXPRESS MINI CARD ELECTROMECHANICAL SPECIFICATION, REVISION 2.0
Figure 1-1: PCI Express Mini Card Add-in Card Installed in a Mobile Platform
PCI Express Mini Card supports two primary system bus interfaces: PCI Express and USB as
shown in Figure 1-2.
A-0381
PCI Express Mini Card
PCI
Express
USB 2.0
DisplayPort
SIM I/F
LEDs
Communications
Centric
Function
Function
Specific
Connector
System
Interface
Function
Media
Interface
Modem
Ethernet
Wireless
Antennas
A-0339B
Figure 1-2: Logical Representation of the PCI Express Mini Card Specification
8
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