SPRS294B - TMS320C6713B
Features
Table of Contents
REVISION HISTORY
GDP and ZDP 272-Ball BGA package (bottom view)
PYP PowerPAD. QFP package (top view)
description
device characteristics
functional block and CPU (DSP core) diagram
CPU (DSP core) description
memory map summary
L2 memory structure expanded
peripheral register descriptions
signal groups description
DEVICE CONFIGURATIONS
device configurations at device reset
peripheral pin selection at device reset
peripheral selection/device configurations via the DEVCFG control register
multiplexed pins
configuration examples
debugging considerations
TERMINAL FUNCTIONS
Terminal Functions
development support
Software Development Tools:
Hardware Development Tools:
device support
device and development-support tool nomenclature
documentation support
CPU CSR register description
cache configuration (CCFG) register description
interrupts and interrupt selector
external interrupt sources
EDMA module and EDMA selector
ESEL0 Register (0x01A0 FF00)
ESEL1 Register (0x01A0 FF04)
ESEL3 Register (0x01A0 FF0C)
PLL and PLL controller
multichannel audio serial port (McASP) peripherals
McASP block diagram
multichannel time division multiplexed (TDM) synchronous transfer mode
burst transfer mode
supported bit stream formats for TDM and burst transfer modes
digital audio interface transmitter (DIT) transfer mode (transmitter only)
McASP flexible clock generators
McASP error handling and management
McASP interrupts and EDMA events
I2C
general-purpose input/output (GPIO)
power-down mode logic
triggering, wake-up, and effects
power-supply sequencing
system-level design considerations
power-supply design considerations
power-supply decoupling
IEEE 1149.1 JTAG compatibility statement
EMIF device speed
EMIF big endian mode correctness
bootmode
reset
absolute maximum ratings over operating case temperature range (unless otherwise noted)†
recommended operating conditions†
electrical characteristics over recommended ranges of supply voltage and operating case temperature† ( unless otherwise noted)
PARAMETER MEASUREMENT INFORMATION
signal transition levels
AC transient rise/fall time specifications
timing parameters and board routing analysis
INPUT AND OUTPUT CLOCKS
timing requirements for CLKIN for PYP-200 and GDP/ZDP-225†‡§ (see Figure 31)
timing requirements for CLKIN for PYP-225 and GDP/ZDP-300 †‡§ (see Figure 31)
timing requirements for CLKIN for PYPA-167, GDPA/ZDPA-200 and PYPA-200†‡§ (see Figure 31)
switching characteristics over recommended operating conditions for CLKOUT2†‡ ( see Figure 32)
switching characteristics over recommended operating conditions for CLKOUT3†§
(see Figure 33)
timing requirements for ECLKIN† (see Figure 34)
switching characteristics over recommended operating conditions for ECLKOUT‡§#
(see Figure 35)
ASYNCHRONOUS MEMORY TIMING
timing requirements for asynchronous memory cycles†‡§ (see Figure 36-Figure 37)
switching characteristics over recommended operating conditions for asynchronous memory cyclesद (see Figure 36-Figure 37)
SYNCHRONOUS-BURST MEMORY TIMING
timing requirements for synchronous-burst SRAM cycles† (see Figure 38)
switching characteristics over recommended operating conditions for synchronous-burst SRAM cycles†‡ ( see Figure 38 and Figure 39)
SYNCHRONOUS DRAM TIMING
timing requirements for synchronous DRAM cycles† (see Figure 40)
switching characteristics over recommended operating conditions for synchronous DRAM cycles†‡ ( see Figure 40- Figure 46)
HOLD\/HOLDA\ TIMING
timing requirements for the HOLD\/HOLDA\ cycles† (see Figure 47)
switching characteristics over recommended operating conditions for the HOLD\/HOLDA\ cycles†‡ ( see Figure 47)
BUSREQ TIMING
switching characteristics over recommended operating conditions for the BUSREQ cycles ( see Figure 48)
RESET TIMING
timing requirements for reset†‡ (see Figure 49)
switching characteristics over recommended operating conditions during reset¶ (see Figure 49)
EXTERNAL INTERRUPT TIMING
timing requirements for external interrupts† (see Figure 50)
MULTICHANNEL AUDIO SERIAL PORT (McASP) TIMING
timing requirements for McASP (see Figure 51 and Figure 52)
switching characteristics over recommended operating conditions for McASP‡ (see Figure 51 and Figure 52)
INTER-INTEGRATED CIRCUITS (I2C) TIMING
timing requirements for I2C timings† ( see Figure 53)
switching characteristics for I2C timings† (see Figure 54)
HOST-PORT INTERFACE TIMING
timing requirements for host-port interface cycles†‡ ( see Figure 55, Figure 56, Figure 57, and Figure 58)
switching characteristics over recommended operating conditions during host-port interface cycles†‡ ( see Figure 55, Figure 56, Figure 57, and Figure 58)
MULTICHANNEL BUFFERED SERIAL PORT TIMING
timing requirements for McBSP†‡ (see Figure 59)
switching characteristics over recommended operating conditions for McBSP†‡ (see Figure 59)
timing requirements for FSR when GSYNC = 1 (see Figure 60)
timing requirements for McBSP as SPI master or slave: CLKSTP = 10b, CLKXP = 0†‡ (see Figure 61)
switching characteristics over recommended operating conditions for McBSP as SPI master or slave: CLKSTP = 10b, CLKXP = 0†‡ ( see Figure 61)
timing requirements for McBSP as SPI master or slave: CLKSTP = 11b, CLKXP = 0†‡ (see Figure 62)
switching characteristics over recommended operating conditions for McBSP as SPI master or slave: CLKSTP = 11b, CLKXP = 0†‡ ( see Figure 62)
timing requirements for McBSP as SPI master or slave: CLKSTP = 10b, CLKXP = 1†‡ (see Figure 63)
switching characteristics over recommended operating conditions for McBSP as SPI master or slave: CLKSTP = 10b, CLKXP = 1†‡ ( see Figure 63)
timing requirements for McBSP as SPI master or slave: CLKSTP = 11b, CLKXP = 1†‡ (see Figure 64)
switching characteristics over recommended operating conditions for McBSP as SPI master or slave: CLKSTP = 11b, CLKXP = 1†‡ ( see Figure 64)
TIMER TIMING
timing requirements for timer inputs† (see Figure 65)
switching characteristics over recommended operating conditions for timer outputs† ( see Figure 65)
GENERAL-PURPOSE INPUT/OUTPUT (GPIO) PORT TIMING
timing requirements for GPIO inputs†‡ (see Figure 66)
switching characteristics over recommended operating conditions for GPIO outputs†§
(see Figure 66)
JTAG TEST-PORT TIMING
timing requirements for JTAG test port (see Figure 67)
switching characteristics over recommended operating conditions for JTAG test port ( see Figure 67)
MECHANICAL DATA
thermal resistance characteristics (S-PBGA package) for GDP
thermal resistance characteristics (S-PBGA package) for ZDP
thermal resistance characteristics (S-PQFP-G208 package) for PYP
packaging information