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Introduction to Semiconductor Manufacturing Technology.pdf

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    Table of Contents
    Preface to the First Edition
    Preface to the Second Edition
    List of Acronyms
    Chapter 1: Introduction
    Chapter 2: Introduction to Integrated Circuit Fabrication
    Chapter 3: Semiconductor Basics
    Chapter 4: Wafer Manufacturing, Epitaxy,and Substrate Engineering
    Chapter 5: Thermal Processes
    Chapter 6: Photolithography
    Chapter 7: Plasma Basics
    Chapter 8: Ion Implantation
    Chapter 9: Etch
    Chapter 10: Chemical Vapor Deposition and Dielectric Thin Films
    Chapter 11: Metallization
    Chapter 12: Chemical Mechanical Polishing
    Chapter 13: Process Integration
    Chapter 14: Integrated Circuit Processing Technologies
    Chapter 15: Future Trends and Summary
    Index
    Bellingham, Washington USA
    LibraryofCongressCataloging-in-PublicationDataXiao,Hong.Introductiontosemiconductortechnology/HongXiao.–2nded.p.cm.Includesbibliographicalreferencesandindex.ISBN978-0-8194-9092-61.Semiconductors–Designandconstruction.2.Semiconductorindustry.I.Title.TK7871.85.X532012621.381502–dc232012013231PublishedbySPIEP.O.Box10Bellingham,Washington98227-0010USAPhone:+1360.676.3290Fax:+1360.647.1445Email:Books@spie.orgWeb:http://spie.orgCopyrightc2012SocietyofPhoto-OpticalInstrumentationEngineers(SPIE)Allrightsreserved.Nopartofthispublicationmaybereproducedordistributedinanyformorbyanymeanswithoutwrittenpermissionofthepublisher.Thecontentofthisbookreflectstheworkandthoughtoftheauthor(s).Everyefforthasbeenmadetopublishreliableandaccurateinformationherein,butthepublisherisnotresponsibleforthevalidityoftheinformationorforanyoutcomesresultingfromreliancethereon.PrintedintheUnitedStatesofAmerica.Firstprinting
    Thistextbookisdedicatedtomywife,LiuHuang,andmysons,JarryXiaoandColinXiao.
    ContentsPrefacetotheFirstEdition..............................................................................xxiPrefacetotheSecondEdition.......................................................................xxiiiListofAcroynms..............................................................................................xxvChapter1Introduction..................................................................................11.1BriefHistoryofIntegratedCircuits...........................................................21.1.1Firsttransistor...................................................................................21.1.2Firstintegratedcircuit....................................................................31.1.3Moore’slaw.......................................................................................51.1.4Featureandwafersize....................................................................51.1.5Definitionoftheintegratedcircuittechnologynode...........101.1.6Moore’slaworthelawofmore..................................................111.2BriefOverviewofIntegratedCircuits.......................................................121.2.1Manufacturingmaterials...............................................................121.2.2Processingequipment.....................................................................121.2.3Metrologytools................................................................................131.2.4Wafermanufacturing......................................................................131.2.5Circuitdesign....................................................................................141.2.6Maskformation................................................................................161.2.7Waferprocessing..............................................................................191.3Summary.............................................................................................................191.4Bibliography......................................................................................................201.5ReviewQuestions.............................................................................................21Chapter2IntroductiontoIntegratedCircuitFabrication..........................232.1Introduction........................................................................................................232.2Yield.....................................................................................................................252.2.1Definitionofyield...........................................................................252.2.2Yieldandprofitmargin..................................................................262.2.3Defectsandyield.............................................................................272.3CleanroomBasics............................................................................................282.3.1Definitionofacleanroom.............................................................29vii
    viiiContents2.3.2Contaminationcontrolandyield................................................302.3.3Basiccleanroomstructure.............................................................322.3.4Basiccleanroomgowningprocedures......................................332.3.5Basiccleanroomprotocols...........................................................352.4BasicStructureofanIntegratedCircuitFabricationFacility............362.4.1Waferprocessingarea....................................................................372.4.1.1Wetbay...............................................................................372.4.1.2Diffusionbay....................................................................382.4.1.3Photobay...........................................................................402.4.1.4Etchbay.............................................................................402.4.1.5Implantbay.......................................................................422.4.1.6Thin-filmbay....................................................................422.4.1.7Chemicalmechanicalpolishingbay.........................442.4.2Equipmentarea.................................................................................452.4.3Facilityarea.......................................................................................452.5TestingandPackaging....................................................................................462.5.1Dietesting..........................................................................................472.5.2Chippackaging.................................................................................472.5.3Finaltest..............................................................................................522.5.43Dpackaging....................................................................................532.6FutureTrends.....................................................................................................532.7Summary.............................................................................................................552.8Bibliography......................................................................................................562.9ReviewQuestions.............................................................................................56Chapter3SemiconductorBasics................................................................593.1WhatIsaSemiconductor?............................................................................593.1.1Bandgap..............................................................................................593.1.2Crystalstructure...............................................................................613.1.3Dopingsemiconductor...................................................................613.1.4Dopantconcentrationandconductivity....................................633.1.5Summaryofsemiconductors.......................................................643.2BasicDevices....................................................................................................643.2.1Resistor................................................................................................643.2.2Capacitor.............................................................................................663.2.3Diode....................................................................................................693.2.4Bipolartransistor..............................................................................703.2.5Metal-oxide-semiconductorfieldeffecttransistor................723.3IntegratedCircuitChips.................................................................................743.3.1Memory...............................................................................................753.3.1.1Dynamicrandomaccessmemory.............................753.3.1.2Staticrandomaccessmemory....................................753.3.1.3Erasableprogrammableread-onlymemory,electricerasableprogrammableread-onlymem-ory,andflash.....................................................................76
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