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IMX335LQN-C_TechnicalDatasheet_Rev0.2.pdf
Description
Features
Device Structure
Absolute Maximum Ratings
Application Conditions
USE RESTRICTION NOTICE
Optical Center
Pixel Arrangement
Block Diagram and Pin Configuration
Pin Description
Electrical Characteristics
DC Characteristics
Current Consumption
AC Characteristics
Master Clock Waveform (INCK)
XVS / XHS Input Characteristics In Slave Mode (XMASTER pin = High)
XVS / XHS Input Characteristics In Master Mode (XMASTER pin = Low)
Serial Communication
I/O Equivalent Circuit Diagram
Spectral Sensitivity Characteristics
Image Sensor Characteristics
Zone Definition
Image Sensor Characteristics Measurement Method
Measurement Conditions
Color Coding of Physical Pixel Array
Definition of standard imaging conditions
Measurement Method
Setting Registers Using Serial Communication
Description of Setting Registers (I2C)
Register Communication Timing (I2C)
Communication Protocol
Register Write and Read (I2C)
Single Read from Random Location
Single Read from Current Location
Sequential Read Starting from Random Location
Sequential Read Starting from Current Location
Single Write to Random Location
Sequential Write Starting from Random Location
Register Map
Readout Drive mode
Image Data Output Format (CSI-2 output)
Frame Format
Frame Structure
Embedded Data Line
Image Data Output Format
All-pixel scan mode
Horizontal/Vertical 2/2-line binning scan mode
Window Cropping Mode
Description of Various Function
Standby Mode
Slave Mode and Master Mode
Gain Adjustment Function
Black Level Adjustment Function
Normal Operation and Inverted Operation
Shutter and Integration Time Settings
Example of Integration Time Setting
Normal Exposure Operation (Controlling the Integration Time in 1H Units)
Long Exposure Operation (Control by Expanding the Number of Lines per Frame)
Example of Integration Time Settings
Signal Output
CSI-2 output
MIPI Transmitter
Number of Internal A/D Conversion Bits Setting
Output Signal Range
INCK Setting
Register Hold Setting
Mode Transitions
Power-on and Power-off Sequence
Power-on sequence
Slew Rate Limitation of Power-on Sequence
Power-off sequence
Sensor Setting Flow
Setting Flow in Sensor Slave Mode
Setting Flow in Sensor Master Mode
Peripheral Circuit
Spot Pixel Specifications
Zone Definition
Notice on White Pixels Specifications
Measurement Method for Spot Pixels
Spot Pixel Pattern Specification
Marking
Notes On Handling
Package Outline
List of Trademark Logos and Definition Statements
Revision History
Diagonal 6.52 mm (Type 1/2.8) CMOS Solid-state Image Sensor with Square Pixel for
Color Cameras
Tentative
IMX335LQN-C
Description
The IMX335LQN-C is a diagonal 6.52 mm (Type 1/2.8) CMOS active pixel type solid-state image sensor with a
square pixel array and 5.14 M effective pixels. This chip operates with analog 2.9 V, digital 1.2 V, and interface 1.8 V
triple power supply, and has low power consumption. High sensitivity, low dark current and no smear are achieved
through the adoption of R, G and B primary color mosaic filters. This chip features an electronic shutter with variable
charge-integration time.
(Applications: Surveillance cameras, FA cameras, Industrial cameras)
Features
◆ CMOS active pixel type dots
◆ Built-in timing adjustment circuit, H/V driver and serial communication circuit
◆ Input frequency: 6 to 27 MHz / 37.125 MHz / 74.25 MHz
◆ Number of recommended recording pixels: 2592 (H) × 1944 (V) approx. 5.04M pixel
◆ Readout mode
All-pixel scan mode
Horizontal/Vertical 2/2-line binning mode
Window cropping mode
Vertical / Horizontal direction-normal / inverted readout mode
◆ Readout rate
Maximum frame rate in All-pixel scan mode 2592(H)×1944(V) AD10bit: 60 frame / s
◆ Wide dynamic range (WDR) function
Multiple exposure WDR
Digital overlap WDR
◆ Variable-speed shutter function (resolution 1H units)
◆ 10-bit / 12-bit A/D converter
◆ CDS / PGA function
0 dB to TBDdB (step pitch 0.3 dB)
Supports I/O
CSI-2 serial data output ( 2 Lane / 4 Lane, RAW10 / RAW12 output)
◆ Recommended exit pupil distance: –30 mm to –∞
Sony Semiconductor Solutions Corporation reserves the right to change products and specifications without prior notice.
This information does not convey any license by any implication or otherwise under any patents or other right.
Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony Semiconductor Solutions
Corporation cannot assume responsibility for any problems arising out of the use of these circuits.
1
Rev0.2
Device Structure
IMX335LQN-C
◆ CMOS image sensor
◆ Image size
Type 1/2.8
◆ Total number of pixels
2704 (H) × 2104 (V) approx. 5.69 M pixels
◆ Number of effective pixels
2616 (H) × 1964 (V) approx. 5.14 M pixels
◆ Number of active pixels
2608 (H) × 1960 (V) approx. 5.11 M pixels
◆ Number of recommended recording pixels
2592 (H) × 1944 (V) approx. 5.04 M pixels
◆ Unit cell size
2.0 µm (H) × 2.0 µm (V)
◆ Optical black
Horizontal (H) direction: Front 0 pixels, rear 0 pixels
Vertical (V) direction: Front 13 pixels, rear 0 pixels
◆ Dummy
Horizontal (H) direction: Front 0 pixels, rear 0 pixels
Vertical (V) direction: Front 0 pixels, rear 0 pixels
◆ Substrate material
Silicon
2
Absolute Maximum Ratings
IMX335LQN-C
Item
Supply voltage (analog 1 : 2.9 V)
Supply voltage (analog 2 : 2.9 V)
Supply voltage (interface 1.8 V)
Supply voltage (digital1 : 1.2 V)
Supply voltage (digital 2 : 1.2 V)
Input voltage
Output voltage
Symbol
AVDD1
AVDD2
OVDD
DVDD1
DVDD2
VI
VO
Min.
-0.3
-0.3
-0.3
-0.3
-0.3
-0.3
-0.3
Max.
3.3
3.3
3.3
2.0
2.0
OVDD + 0.3
OVDD + 0.3
Unit
V
V
V
V
V
V
V
Remarks
Not exceed 3.3 V
Not exceed 3.3 V
Application Conditions
Item
Symbol
Supply voltage (analog 1 : 2.9 V)
Supply voltage (analog 2 : 2.9 V)
Supply voltage (interface 1.8 V)
Supply voltage (digital1 : 1.2 V)
Supply voltage (digital 2 : 1.2 V)
Performance guarantee temperature
Operating guarantee temperature
Storage guarantee temperature
AVDD1
AVDD2
OVDD
DVDD1
DVDD2
Tspec
Topr
Tstg
Min.
2.80
2.80
1.70
1.10
1.10
-10
-30
-40
Typ.
2.90
2.90
1.80
1.20
1.20
─
─
─
Max.
3.00
3.00
1.90
1.30
1.30
60
TBD
85
Unit
V
V
V
V
V
˚C
˚C
˚C
3
USE RESTRICTION NOTICE
IMX335LQN-C
This USE RESTRICTION NOTICE ("Notice") is for customers who are considering or currently using the
image sensor products ("Products") set forth in this specifications book. Sony Semiconductor Solutions
Corporation ("SSS") may, at any time, modify this Notice which will be available to you in the latest
specifications book for the Products. You should abide by the latest version of this Notice. If a SSS
subsidiary or distributor has its own use restriction notice on the Products, such a use restriction notice will
additionally apply between you and the subsidiary or distributor. You should consult a sales representative of
the subsidiary or distributor of SSS on such a use restriction notice when you consider using the Products.
Use Restrictions
The Products are intended for incorporation into such general electronic equipment as office products,
communication products, measurement products, and home electronics products in accordance with
the terms and conditions set forth in this specifications book and otherwise notified by SSS from time
to time.
You should not use the Products for critical applications which may pose a life- or injury-threatening
risk or are highly likely to cause significant property damage in the event of failure of the Products. You
should consult your sales representative beforehand when you consider using the Products for such
critical applications. In addition, you should not use the Products in weapon or military equipment.
SSS disclaims and does not assume any liability and damages arising out of misuse, improper use,
modification, use of the Products for the above-mentioned critical applications, weapon and military
equipment, or any deviation from the requirements set forth in this specifications book.
Design for Safety
SSS is making continuous efforts to further improve the quality and reliability of the Products; however,
failure of a certain percentage of the Products is inevitable. Therefore, you should take sufficient care
to ensure the safe design of your products such as component redundancy, anti-conflagration features,
and features to prevent mis-operation in order to avoid accidents resulting in injury or death, fire or
other social damage as a result of such failure.
Export Control
If the Products are controlled items under the export control laws or regulations of various countries,
approval may be required for the export of the Products under the said laws or regulations.
You should be responsible for compliance with the said laws or regulations.
No License Implied
The technical information shown in this specifications book is for your reference purposes only. The
availability of this specifications book shall not be construed as giving any indication that SSS and its
licensors will license any intellectual property rights in such information by any implication or otherwise.
SSS will not assume responsibility for any problems in connection with your use of such information or
for any infringement of third-party rights due to the same. It is therefore your sole legal and financial
responsibility to resolve any such problems and infringement.
Governing Law
This Notice shall be governed by and construed in accordance with the laws of Japan, without reference
to principles of conflict of laws or choice of laws. All controversies and disputes arising out of or relating
to this Notice shall be submitted to the exclusive jurisdiction of the Tokyo District Court in Japan as the
court of first instance.
Other Applicable Terms and Conditions
The terms and conditions in the SSS additional specifications, which will be made available to you when
you order the Products, shall also be applicable to your use of the Products as well as to this
specifications book. You should review those terms and conditions when you consider purchasing
and/or using the Products.
General-0.0.9
4
IMX335LQN-C
Contents
Description ............................................................................................................................................................................. 1
Features ................................................................................................................................................................................. 1
Device Structure ..................................................................................................................................................................... 2
Absolute Maximum Ratings .................................................................................................................................................... 3
Application Conditions ............................................................................................................................................................ 3
USE RESTRICTION NOTICE ................................................................................................................................................ 4
Optical Center ........................................................................................................................................................................ 7
Pixel Arrangement .................................................................................................................................................................. 8
Block Diagram and Pin Configuration ..................................................................................................................................... 9
Pin Description ...................................................................................................................................................................... 11
Electrical Characteristics ...................................................................................................................................................... 14
DC Characteristics ............................................................................................................................................................ 14
Current Consumption ........................................................................................................................................................ 15
AC Characteristics ............................................................................................................................................................ 16
Master Clock Waveform (INCK) .................................................................................................................................... 16
XVS / XHS Input Characteristics In Slave Mode (XMASTER pin = High) ..................................................................... 17
XVS / XHS Input Characteristics In Master Mode (XMASTER pin = Low) .................................................................... 17
Serial Communication ................................................................................................................................................... 18
I/O Equivalent Circuit Diagram ............................................................................................................................................. 19
Spectral Sensitivity Characteristics ...................................................................................................................................... 20
Image Sensor Characteristics .............................................................................................................................................. 21
Zone Definition .................................................................................................................................................................. 21
Image Sensor Characteristics Measurement Method........................................................................................................... 22
Measurement Conditions .................................................................................................................................................. 22
Color Coding of Physical Pixel Array ................................................................................................................................ 22
Definition of standard imaging conditions ......................................................................................................................... 22
Measurement Method ....................................................................................................................................................... 23
Setting Registers Using Serial Communication .................................................................................................................... 24
Description of Setting Registers (I2C) ............................................................................................................................... 24
Register Communication Timing (I2C) ............................................................................................................................... 25
Communication Protocol ................................................................................................................................................... 26
Register Write and Read (I2C) .......................................................................................................................................... 27
Single Read from Random Location ............................................................................................................................. 27
Single Read from Current Location ............................................................................................................................... 27
Sequential Read Starting from Random Location ......................................................................................................... 28
Sequential Read Starting from Current Location ........................................................................................................... 28
Single Write to Random Location .................................................................................................................................. 29
Sequential Write Starting from Random Location ......................................................................................................... 29
Register Map ........................................................................................................................................................................ 30
Readout Drive mode ............................................................................................................................................................ 45
Image Data Output Format (CSI-2 output) ........................................................................................................................ 46
Frame Format ............................................................................................................................................................... 46
Frame Structure ............................................................................................................................................................ 46
Embedded Data Line .................................................................................................................................................... 47
Image Data Output Format ............................................................................................................................................... 49
All-pixel scan mode ....................................................................................................................................................... 49
Horizontal/Vertical 2/2-line binning scan mode .............................................................................................................. 52
Window Cropping Mode ................................................................................................................................................ 55
Description of Various Function ............................................................................................................................................ 59
Standby Mode................................................................................................................................................................... 59
Slave Mode and Master Mode .......................................................................................................................................... 60
Gain Adjustment Function ................................................................................................................................................. 62
Black Level Adjustment Function ...................................................................................................................................... 63
Normal Operation and Inverted Operation ........................................................................................................................ 64
Shutter and Integration Time Settings ............................................................................................................................... 65
Example of Integration Time Setting ............................................................................................................................. 65
Normal Exposure Operation (Controlling the Integration Time in 1H Units) ...................................................................... 66
Long Exposure Operation (Control by Expanding the Number of Lines per Frame) ......................................................... 67
5
IMX335LQN-C
Example of Integration Time Settings ............................................................................................................................... 68
Signal Output .................................................................................................................................................................... 69
CSI-2 output...................................................................................................................................................................... 69
MIPI Transmitter ............................................................................................................................................................... 71
Number of Internal A/D Conversion Bits Setting ............................................................................................................ 72
Output Signal Range ..................................................................................................................................................... 72
INCK Setting ..................................................................................................................................................................... 73
Register Hold Setting ........................................................................................................................................................ 74
Mode Transitions .............................................................................................................................................................. 74
Power-on and Power-off Sequence ...................................................................................................................................... 75
Power-on sequence .......................................................................................................................................................... 75
Slew Rate Limitation of Power-on Sequence .................................................................................................................... 76
Power-off sequence .......................................................................................................................................................... 77
Sensor Setting Flow .......................................................................................................................................................... 78
Setting Flow in Sensor Slave Mode .............................................................................................................................. 78
Setting Flow in Sensor Master Mode ............................................................................................................................ 79
Peripheral Circuit .................................................................................................................................................................. 80
Spot Pixel Specifications ...................................................................................................................................................... 81
Zone Definition .................................................................................................................................................................. 81
Notice on White Pixels Specifications .................................................................................................................................. 82
Measurement Method for Spot Pixels .................................................................................................................................. 83
Spot Pixel Pattern Specification ........................................................................................................................................... 84
Marking ................................................................................................................................................................................ 85
Notes On Handling ............................................................................................................................................................... 86
Package Outline ................................................................................................................................................................... 88
List of Trademark Logos and Definition Statements ............................................................................................................. 89
Revision History ................................................................................................................................................................... 90
6
Optical Center
IMX335LQN-C
Package
outline H
direction
Package
outline V
direction
m
m
D
B
T
±
7
0
3
.
3
Sensor
scanning V
direction (normal)
Sensor
scanning H
direction (normal)
Top View
Package center
Optical center
Package reference (H, V)
7.223 ± 0.025 mm
A1-Pin
3.469 ± TBD mm
A10-Pin
m
m
5
2
0
.
0
±
2
5
0
.
7
K1-Pin
K10-Pin
Optical Center
7
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12
1944
8
4
13
7
Recording Pixel area
2592
Effective margin for color processing
Effective pixel ignored area
Vertical(V) direction effective OB
OB side ignored area
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B
G
K10 pin
Pixel Arrangement
IMX335LQN-C
A1 pin
G
R
B
G
Top View
8
Effective margin for color processing
Reference pin
A10 pin
G
R
B
G
Total number of pixels:
Number of effective pixels: 2616(H) × 1964(V) = 5.14 M
Number of active pixels: 2608(H) × 1960(V) = 5.11 M
Number of recommended recording pixels:
2704(H) × 2104(V) = 5.69 M
2592(H) × 1944(V) = 5.04 M
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p
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K1 pin
Horizontal scan direction (Normal)
* Reference pin number is consecutive numbering of package pin array.
See the Pin Configuration for the number of each pin.
Pixel Arrangement (Top View)
8
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