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HI3516DV300DMEBPRO_VER_A_SCH原理图.pdf
HI3516DV300DMEBPRO Sheet 1
HI3516DV300DMEBPRO Sheet 2
HI3516DV300DMEBPRO Sheet 3
HI3516DV300DMEBPRO Sheet 4
HI3516DV300DMEBPRO Sheet 5
HI3516DV300DMEBPRO Sheet 6
HI3516DV300DMEBPRO Sheet 7
HI3516DV300DMEBPRO Sheet 8
HI3516DV300DMEBPRO Sheet 9
HI3516DV300DMEBPRO Sheet 10
HI3516DV300DMEBPRO Sheet 11
HI3516DV300DMEBPRO Sheet 12
HI3516DV300DMEBPRO Sheet 13
HI3516DV300DMEBPRO Sheet 14
HI3516DV300DMEBPRO Sheet 15
HI3516DV300DMEBPRO Sheet 16
HI3516DV300DMEBPRO Sheet 17
HI3516DV300DMEBPRO Sheet 18
HI3516DV300DMEBPRO Sheet 19
HI3516DV300DMEBPRO Sheet 20
HI3516DV300DMEBPRO Sheet 21
HI3516DV300DMEBPRO Sheet 22
1
2
3
4
5
6
HI3516DV300DMEBPRO VER.A
A
B
C
The type and specification of the components refer to the BOM
DESIGNED
GUIDINGQIAN 299933
REVIEWED
LISI XXXXX
HI3516DV300DMEBPRO
00001234
NA
ECA NO
DATE
D
A
B
C
D
1
2
3
4
VER
PART_NUMBER
A
03030001
5
1
22
SHEET
HUAWEI TECH CO.,LTD.
OF
6
1
2
3
4
5
6
Catalogue
A
B
C
D
HI3516DV300 PWR
Cover Page
Catalogue
Change List
Block Diagram
Power Tree
1
2
3
4
5
6-7 Power
8
9-10 HI3516DV300 DDR3
11
12
13
14
15
16
17
18
19
20
21
22
HI3516DV300 SYS
HI3516DV300 Interface
HI3516DV300 Per.
SFC Flash
HDMI
Sensor&LCD Connector
Audio Out
SD Card&Audio In
USB&JTAG
UART&WIFI CON
Gyro+Accler+Geoma
Harderware Configuration
A
B
C
1
2
3
4
VER
PART_NUMBER
A
03030001
5
2
SHEET
HUAWEI TECH CO.,LTD.
OF
22
6
The type and specification of the components refer to the BOM
DESIGNED
GUIDINGQIAN 299933
REVIEWED
LISI XXXXX
HI3516DV300DMEBPRO
00001234
NA
ECA NO
DATE
D
1
2
3
4
5
6
Change list
Ver.
VER.A
Who
Date
Description
GUIDINGQIAN 2018-08-18
For DDR design reference only
A
B
C
The type and specification of the components refer to the BOM
DESIGNED
GUIDINGQIAN 299933
REVIEWED
LISI XXXXX
HI3516DV300DMEBPRO
00001234
NA
ECA NO
DATE
D
A
B
C
D
1
2
3
4
VER
PART_NUMBER
A
03030001
5
3
22
SHEET
HUAWEI TECH CO.,LTD.
OF
6
1
2
3
4
5
6
Block Diagram
DDR3*2
MIPI TX
DDR_CA
MIPI TX/LCD/BT1220
LCD/BT1220
DDR_DQ
SFC
SDIO_0
HI3516DV300
USB
HDMI
MIPI RX/VI/GPIO
SDIO_1
JTAG/SPI1
SWITCH
OSC
RTC
PWM
I2C/SPI
UART0/1
Audio
Codec
WIFI
JTAG
SPI1
24MHz
RTC
DC/DC
Control
UART CON
SPI Flash
SD CARD
USB
A
B
C
HDMI
60 PIN
CON
Audio IN/OUT
The type and specification of the components refer to the BOM
DESIGNED
GUIDINGQIAN 299933
REVIEWED
LISI XXXXX
HI3516DV300DMEBPRO
00001234
NA
ECA NO
DATE
D
A
B
C
D
1
2
3
4
VER
PART_NUMBER
A
03030001
5
4
22
SHEET
HUAWEI TECH CO.,LTD.
OF
6
1
2
3
4
5
6
Power Tree
The currents are only for reference.
For details about the actual currents,see the related documents released by HiSilicon.
12V
760mA
DC/CD
SY8120I
@85%
3.3V
1435mA
25mA
200mA
200mA
100mA
350mA
350mA
150mA
200mA
SPI FLASH
LCD
3V3_SOC
1V8_SOC
RT9078
LDO
1.8V
100mA
SY8089A1
SY8088I
0.9V
1080mA
1.35/1.5V
DVDD_0V9
DVDD_DDRIO
Sensor CON
Other Device
DC/CD
SY8120I
@85%
5V
640mA
600mA
MOS SWITCH
5V
600mA
USB/AUDIO/HDMI
40mA
RT9078
LDO
1.8V/3.3V
40mA
DVDD3318_PC
A
B
C
The type and specification of the components refer to the BOM
DESIGNED
GUIDINGQIAN 299933
REVIEWED
LISI XXXXX
HI3516DV300DMEBPRO
00001234
NA
ECA NO
DATE
D
A
B
C
D
1
2
3
4
VER
PART_NUMBER
A
03030001
5
5
22
SHEET
HUAWEI TECH CO.,LTD.
OF
6
A
B
C
D
1
Power
12V POWER IN
J13
12V_IN
2A2
A3
3
A1
1
DC2026_00
12V-->3V3
12V0
2
3
4
5
6
F1
SSQ2
2A
1
G
3
T
A
C
3
1
A
M
S
1
1
2
D
2
5
2
C
V
0
5
F
N
0
0
1
3
1
C
V
5
2
F
U
0
1
12V0
+
V
5
2
0
2
3
1
C
2
F
U
0
2
2
2
R42
0
C30
100NF
3V3
3V3_SOC
12V-->5V
12V0
R50
0
C31
100NF
U4
5 VIN
1
S
B
LX
SY8120I
FB
R212
100K
4
EN
GND
6
3
2
0.6V
0
5
1
C
*
F
N
0
0
1
3
8
1
C
F
U
2
2
V
5
2
9
4
1
C
F
N
0
0
1
3A 0.074ohm
3.9UH
L3
1
7
C
F
P
0
2
2
K
4
2
1%
0
2
2
R
K
3
.
3
1%
6
5
1
R
5V_DC
1
4
1
6 R
2
C
K
0
1
PWR_STARTUP1
F
U
2
2
9
0
2
R
K
6
.
5
U5
5 VIN
1
S
B
LX
SY8120I
FB
PWR_SEQ0
R211
R48
100K/NC*
0
4
EN
GND
0.6V
6
3
2
1
8
1
C
V
5
2
F
U
2
2
2
4
1
C
F
N
0
0
1
3A 0.074ohm
L1
3.9UH
Vout=0.6*(1+150/33.2)=3.3V
R166
0
1
6
C
*
C
N
/
F
N
0
0
1
4
3
3
C
F
U
2
2
8
3
C
*
C
N
/
F
U
2
2
2
4
C
F
P
0
2
2
1%
5
8
1
R
K
0
5
1
8
5
1
R
1%
K
2
.
3
3
5V SWITCH
5V_DC
Imax=300mA
U8
1
VIN
5
VOUT
RT9078
3
EN
SNS/NC
4
2
GND
4
8
1
C
V
5
2
F
U
0
1
4
3
C
F
N
0
0
1
R140
100K
5
3
C
*
C
N
/
F
U
2
.
2
DVDD18_PC
R51
0
9
5
R
K
2
1
6
9
R
K
3
5
.
9
0
9
1
C
F
U
0
1
4
1
C
*
C
N
/
F
N
0
0
1
Vout=0.8*(1+12k/9.53k)=1.8V
DVDD
DDRIO_1.5V/1.35V
J1
1
5
M1
1
2
3
4
1
2
3
4
6M2
53398_0471
1
2
3
4
A
B
C
Vout=0.6*(1+24/3.3)=5V
5V_DC
7
5
1
R
K
2
7
8
1
C
F
U
0
1
25V
8
7
C
F
N
0
0
1
5V
9
3
1
R
K
0
1
25V
6
C
F
U
0
1
D
S
G
-
S
O
M
P
Q5
S
2
0.005
D
3
IRLML6401TR
1
G
9
R
0
0
1
C
3
R169
240
1B
NPN-BEC
Q2
MMBT4401LT1G2
E
3V3
3
3
1
R
*
C
N
/
K
1
8
3
1
R
K
0
1
PWR_SEQ0
R41
0
R138 and R133 share one pad
The type and specification of the components refer to the BOM
DESIGNED
GUIDINGQIAN 299933
REVIEWED
LISI XXXXX
HI3516DV300DMEBPRO
00001234
NA
ECA NO
DATE
D
VER
PART_NUMBER
A
03030001
5
6
SHEET
HUAWEI TECH CO.,LTD.
OF
22
6
2
3
4
5
6
A
B
1
3V3-->1V8
Vout=0.8*(1+12k/9.53k)=1.8V
3V3
Imax=300mA
U9
1
VIN
5
VOUT
RT9078
3
EN
SNS/NC
4
2
GND
0
6
4
C
F
u
2
2
2
3
3
C
F
N
0
0
1
3
1
R
K
0
1
5
C
*
F
N
0
0
1
1V8
1V8_SOC
R168
0
7
9
C
*
C
N
/
F
N
0
0
1
3
R
K
2
1
4
2
R
K
3
5
.
9
8
9
1
C
F
U
2
2
4
5
4
C
*
C
N
/
F
U
2
2
DVDD_COM
DVDD
R20
0.005
3V3-->0V9 VDD
3V3
0
0
2
C
F
u
2
2
8
9
C
F
N
0
0
1
R308
51K/NC*
PWR_SEQ1
R53
0
3
2
4
C
*
C
N
/
F
n
0
0
1
U19
4 VIN
1
EN
4A 0.035ohm
L10
470NH
0.6V
R106
0
2
C
F
p
0
0
1
3
LX
5
FB
2
GND
VALUE=SY8032
SVB_PWM
R203
1K
R153
20K
R87
100K
7
2
C
F
U
2
.
2
SVB CIRCUIT
1
0
2
C
F
u
7
4
7
9
1
C
F
u
7
4
1%
1%
8
7
R
K
5
1
9
7
R
K
4
2
JUST FOR TEST
Vout(min)=0.64V
Vout(max)=1.05V
Note:Just for power test
I2C address:1001010
A1=SDA A0=SDA
R71
R72
R445
R446
10K
10K
0
0
I2C2_SDA
I2C2_SCL
U34
INA220AIDGSR
VIN+
VIN-
VBUS
GND
VS
1 A1
2
A0
3
NC
4
SDA
5
SCL
10
9
8
7
6
DVDD_COM
DVDD
1
3
2
R
0
1
0
3
2
R
4
4
4
R
3V3
C202
100NF
0 0
1
A
3
0
2
C
F
N
0
0
1
8
0
4
C
F
U
0
1
Note:Just for power test
I2C address:1000000
A1=GND A0=GND
DDRIO_1.5V/1.35V_R
DDRIO_1.5V/1.35V
1
4
2
R
0
1
C230
100NF
0
4
2
R
1
6
4
R
0
1
0
3V3
9
2
2
C
F
N
0
0
1
5
1
4
C
F
U
0
1
B
C
3V3
3V3
3V3
POWER_LED
UPDATE_LED
LED
D3
0
1
5
R226
C
3
WIFI_LED
LED
D9
0
1
5
R232
C
3
4
9
1
C
F
u
7
4
2
9
C
F
N
0
0
1
R164
R82
R463
R462
10K
10K
0
0
I2C2_SDA
I2C2_SCL
U40
INA220AIDGSR
VIN+
VIN-
VBUS
GND
VS
1 A1
2
A0
3
NC
4
SDA
5
SCL
10
9
8
7
6
DDRIO_1.5V/1.35V_R
R27
0.005
UPDATE_LED
R227
510
1B
NPN-BEC
Q6
2
E
WIFI_LED
R229
510
1B
NPN-BEC
Q7
2
E
C
3V3-->1V35/1V5 DDR
Vout=0.6*(1+30/20)=1.5V
Vout=0.6*(1+24.9/20)=1.35V
3V3
2
9
1
C
F
u
2
2
9
6
C
F
N
0
0
1
R170
22K
1
8
C
*
F
u
2
.
2
D
U10
4 VIN
3
LX
L4
1
2.2UH
2
SY8088
FB
5
0.6V
R107
0
1
EN
2
GND
DDRIO_PWM0
R80
1K
R77
30K
R81
100K/NC*
8
2
C
F
U
2
.
2
JUST FOR TEST
9
9
1
C
F
u
7
4
5
9
1
C
*
F
u
7
4
7
3
C
F
p
0
0
1
9
1
R
2
6
R
K
9
.
4
2
2
5
R
*
C
N
/
0
1%
K
0
3
K
0
2
1%
9
4
R
2
2
D
D
E
L
0
1
5
5
2
2
R
DDRIO_1.5V/1.35V
6
9
1
C
F
u
7
4
0
7
C
*
C
N
/
F
N
0
0
1
1
2
3
4
The type and specification of the components refer to the BOM
JUST FOR TEST
NA
ECA NO
DATE
D
DESIGNED
GUIDINGQIAN 299933
REVIEWED
LISI XXXXX
HI3516DV300DMEBPRO
00001234
VER
PART_NUMBER
A
03030001
5
7
22
SHEET
HUAWEI TECH CO.,LTD.
OF
6
1
2
3
4
5
6
POWER
DVDD
3V3_SOC
LB17
LB16
1
1
2
2
AVDD09_PLL
AVDD33_PLL
M15
N18
AVDD09_PLL
AVDD33_PLL
3V3_SOC
DDRIO_1.5V/1.35V
LB19
LB20
1
1
2
2
1
0
1
C
F
U
2
.
2
N15
AVSS_PLL
AVDD33_DDR_PLL
J8
VDDIO_DDR_CK
G8
AVDD33_DDR_PLL
VDDIO_DDR_CK
2
0
1
C
F
U
2
.
2
4
0
1
C
F
U
2
.
2
3
2
C
F
u
7
.
4
6
0
1
C
F
U
2
.
2
2
1
C
F
u
7
.
4
DDRIO_1.5V/1.35V
9
C
F
u
7
.
4
9
0
1
C
F
U
7
.
4
DVDD
1
2
1
C
F
U
7
.
4
7
0
1
C
F
U
7
.
4
8
0
1
C
F
n
0
2
2
7
C
F
n
0
2
2
3
C
F
n
0
2
2
3V3_SOC
3
9
C
F
U
7
.
4
4
9
C
F
N
0
2
2
3
7
C
F
N
0
2
2
2
1
1
C
F
N
0
2
2
9
1
1
C
F
N
0
2
2
5
1
1
C
F
N
0
2
2
1
1
1
C
F
N
0
0
1
5
9
C
F
N
0
2
2
3
1
1
C
F
N
0
0
1
J9
E6
E8
E9
E11
E12
F5
G5
J5
L5
V8
P17
H17
H10
H11
H12
J14
J15
K14
K15
L8
M8
N8
N12
N13
P8
P12
P13
P14
P15
AVSS_DDR_PLL
VDDIO_DDR1
VDDIO_DDR2
VDDIO_DDR3
VDDIO_DDR4
VDDIO_DDR5
VDDIO_DDR6
VDDIO_DDR7
VDDIO_DDR8
VDDIO_DDR9
DVDD33_1
DVDD33_2
DVDD33_3
VDD1
VDD2
VDD3
VDD4
VDD5
VDD6
VDD7
VDD8
VDD9
VDD10
VDD11
VDD12
VDD13
VDD14
VDD15
VDD16
VDD17
A
B
C
D
U1
HI3516
5
f
o
4
e
c
a
f
r
e
t
n
I
R
W
P
VSS1
VSS2
VSS3
VSS4
VSS5
VSS6
VSS7
VSS8
VSS9
VSS10
VSS11
VSS12
VSS13
VSS14
VSS15
VSS16
VSS17
VSS18
VSS19
VSS20
VSS21
VSS22
VSS23
VSS24
VSS25
VSS26
VSS27
VSS28
VSS29
VSS30
VSS31
VSS32
VSS33
VSS34
VSS35
VSS36
VSS37
VSS38
VSS39
VSS40
VSS41
VSS42
VSS43
VSS44
VSS45
VSS46
VSS47
VSS48
VSS49
VSS50
VSS51
VSS52
VSS53
VSS54
VSS55
VSS56
VSS57
VSS58
VSS59
VSS60
VSS61
VSS62
VSS63
VSS64
VSS65
VSS66
VSS67
VSS68
VSS69
VSS70
VSS71
VSS72
VSS73
VSS74
VSS75
VSS76
VSS77
VSS78
A1
A3
A12
A21
B3
D1
D5
D6
D8
D9
D11
D13
D14
E4
E7
E10
G4
G9
G10
G11
G12
G13
H5
H8
H9
H13
H14
H15
J10
J11
J12
J13
J19
K4
K5
K8
K9
K10
K11
K12
K13
L1
L9
L10
L11
L12
L13
L14
L15
M5
M9
M10
M11
M12
M13
M14
M21
N9
N10
N11
N14
N19
P9
P11
P20
R1
R3
R4
R8
R9
R12
R13
T4
U3
V3
V5
W17
AA1
A
B
C
The type and specification of the components refer to the BOM
DESIGNED
GUIDINGQIAN 299933
REVIEWED
LISI XXXXX
HI3516DV300DMEBPRO
00001234
NA
ECA NO
DATE
D
1
2
3
4
VER
PART_NUMBER
A
03030001
5
8
22
SHEET
HUAWEI TECH CO.,LTD.
OF
6
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