D C B A 1 2 3 4 注：原理图中注释说明设计时需特别注意 设计注意事项： 1、主控所有电源的退耦 电容必须靠近芯片放置，退耦电容的回路地必须最短回到该电源地 2、蓝牙匹配电路参数以 调试结果为准 3、为保证产品的安全可 靠性，电池必须使用带保护 板的电池。 VBAT C20 106 C7 104 C18 220uF PVDD L2 6.8uH D1 SS54 C19 470uF C21 106 C8 104 USB预留测试点 USBDM USBDP C23 105/224 C22 105/224 SD_CLK SD_CMD SD_DAT MIC DACR DACL VCOMO DACVDD VCOM AGND +3.3V 1 2 3 4 5 6 7 8 9 10 11 12 U1 PC5/SD1CLK PC4/SD1CMD/ADC4 USBDM/PC3/SD1DAT/ADC10 USBDP PA0/MIC/PA3/AUX1L/ADC0 DACR DACL VCOMO DACVDD VCOM DACVSS VDDIO BT_OSCO 24 23 BT_OSCI VSSIO 22 BT_RF 21 BT_AVDD 20 19 ADC12/PR2 18 ADC12/PR1 RTCVDD 17 VBAT 16 15 14 13 ADC6/PB0 PWM3/ADC8/AUX0L/PB4 PWMH2H/ADC9/AUX0R/PB5 AC6925C_QSOP24 晶振选型： 封装：可兼容3225，M49S，HC49S等不同封装 要求：稳定性、一致性要好，频偏偏差：±10PPM以内 电容：晶振匹配电容位置请预留 Y1 24M BT_OSCO C1 NC BT_OSCI C2 NC BT_ANT BT_ANT C29 2.7P L5 NC BT_OSCO BT_OSCI GND BT_AVDD ADKEY MUTE RTCVDD VBAT LED LIN_L LIN_R L3 0R C25 105/225 C28 104/224 C26 105/225 C6 105 C9 DACL DACR 105 R2 22K R1 22K C12 104 R3 C14 22K 104 R4 22K C13 104 C16 104 C15 104 C17 104 R5 30K R6 30K R9 30K R10 30K R12 30K MUTE VBAT MCU C10 105 C11 105 U2 24 AVDD 6 7 4 5 19 17 18 3 8 LINP LINN RINP RINN ENB ENA MODE BYP BYP D N G A 0 2 2 2 3 1 9 W S D D V P D D V P FB 21 R7 56K 1% R8 12K 1% 1 0 9 3 X M I LOUTP 11 LOUTN 10 LSPK+ LSPK- ROUTP 14 ROUTN 15 COMP 1 SS 2 RSPK+ RSPK- R11 4.7K D N G P D N G P D N G P 2 1 6 1 3 2 C30 473 C31 472 MIX3901 C24 105/224 S1 P/P/POWER S2 MODE S3 PREV/V- S4 NEXT/V+ S5 TALK D2 BLUE R24 NC Q1 R25 1K 8850C/9015C RTCVDD ADKEY C27 NC/100P VIN VBAT R13 22K R14 24K R15 33K R16 51K R18 100K LED R22 10K 1 0V 1.7V 2.0V 2.3V 2.7V D4 RED Key、LED DACVDD C4 NC C3 NC R17 6.8K + M1 MIC C33 104 MIC +3.3V R19 4.7R C5 105/NC R20 3.3K SD_CMD SD_CLK SD_DAT 10 9 1 2 3 4 5 6 7 8 11 TF1 CD WP D2 D3/CS CMD VDD CLK VSS D0 D1 Sheet SD-TF LSPK+ LSPK- L6 FB L8 FB C34 1nF C36 1nF J2 SPK RSPK+ RSPK- L7 FB L9 FB C35 1nF C37 1nF J3 SPK PA J1 VIN 6 6 +5V 1 LIN_L 2 AGND 3 LIN_R 4 GND 5 C40 224/105 66 D3 IN5822 LIN_L LIN_R C41 224/105 VBAT R21 4.7R BT1 3.4V~4.2V MIC、TF-CARD GND、AGND在电源入口处短接在 一起！ Power 2 3 4 D C B A