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GD32F170xx Datasheet V2.0.pdf
Table of Contents
List of Figures
List of Tables
1. General description
2. Device overview
2.1. Device information
2.2. Block diagram
2.3. Pinouts and pin assignment
2.4. Memory map
2.5. Clock tree
2.6. Pin definitions
2.6.1. GD32F170R8 LQFP64 pin definitions
2.6.2. GD32F170Cx LQFP48 pin definitions
2.6.3. GD32F170Tx QFN36 pin definitions
2.6.4. GD32F170xx pin alternate functions
3. Functional description
3.1. ARM® Cortex®-M3 core
3.2. On-chip memory
3.3. Clock, reset and supply management
3.4. Boot modes
3.5. Power saving modes
3.6. Analog to digital converter (ADC)
3.7. DMA
3.8. General-purpose inputs/outputs (GPIOs)
3.9. Timers and PWM generation
3.10. Real time clock (RTC)
3.11. Inter-integrated circuit (I2C)
3.12. Serial peripheral interface (SPI)
3.13. Universal synchronous asynchronous receiver transmitter (USART)
3.14. Controller area network (CAN)
3.15. Debug mode
3.16. Package and operation temperature
4. Electrical characteristics
4.1. Absolute maximum ratings
4.2. Recommended DC characteristics
4.3. Power consumption
4.4. EMC characteristics
4.5. Power supply supervisor characteristics
4.6. Electrical sensitivity
4.7. External clock characteristics
4.8. Internal clock characteristics
4.9. PLL characteristics
4.10. Memory characteristics
4.11. GPIO characteristics
4.12. ADC characteristics
4.13. SPI characteristics
4.14. I2C characteristics
4.15. USART characteristics
5. Package information
5.1. QFN package outline dimensions
5.2. LQFP package outline dimensions
6. Ordering Information
7. Revision History
GigaDevice Semiconductor Inc.
GD32F170xx
ARM® Cortex®-M3 32-bit MCU
Datasheet
GD32F170xx Datasheet
Table of Contents
Table of Contents ........................................................................................................... 1
List of Figures ................................................................................................................ 3
List of Tables .................................................................................................................. 4
1. General description ................................................................................................. 5
2. Device overview ....................................................................................................... 6
2.1. Device information ...................................................................................................... 6
2.2. Block diagram .............................................................................................................. 7
2.3. Pinouts and pin assignment ....................................................................................... 8
2.4. Memory map .............................................................................................................. 10
2.5. Clock tree ................................................................................................................... 12
2.6. Pin definitions ............................................................................................................ 13
2.6.1. GD32F170R8 LQFP64 pin definitions .................................................................................. 13
2.6.2. GD32F170Cx LQFP48 pin definitions .................................................................................. 18
2.6.3. GD32F170Tx QFN36 pin definitions .................................................................................... 22
2.6.4. GD32F170xx pin alternate functions .................................................................................... 25
3. Functional description .......................................................................................... 28
3.1. ARM® Cortex®-M3 core .............................................................................................. 28
3.2. On-chip memory ........................................................................................................ 28
3.3. Clock, reset and supply management ...................................................................... 29
3.4. Boot modes ................................................................................................................ 29
3.5. Power saving modes ................................................................................................. 30
3.6. Analog to digital converter (ADC) ............................................................................ 30
3.7. DMA ............................................................................................................................ 31
3.8. General-purpose inputs/outputs (GPIOs) ................................................................ 31
3.9. Timers and PWM generation ..................................................................................... 31
3.10. Real time clock (RTC) ............................................................................................ 32
3.11.
Inter-integrated circuit (I2C) .................................................................................. 33
3.12.
Serial peripheral interface (SPI) ............................................................................ 33
3.13. Universal synchronous asynchronous receiver transmitter (USART) ............... 34
3.14. Controller area network (CAN) .............................................................................. 34
1
GD32F170xx Datasheet
3.15. Debug mode ........................................................................................................... 34
3.16.
Package and operation temperature ..................................................................... 34
4. Electrical characteristics ....................................................................................... 35
4.1. Absolute maximum ratings ....................................................................................... 35
4.2. Recommended DC characteristics ........................................................................... 35
4.3. Power consumption .................................................................................................. 35
4.4. EMC characteristics .................................................................................................. 37
4.5. Power supply supervisor characteristics ................................................................ 37
4.6. Electrical sensitivity .................................................................................................. 38
4.7. External clock characteristics .................................................................................. 38
4.8.
Internal clock characteristics ................................................................................... 39
4.9. PLL characteristics.................................................................................................... 40
4.10. Memory characteristics ......................................................................................... 40
4.11. GPIO characteristics .............................................................................................. 41
4.12. ADC characteristics ............................................................................................... 42
4.13.
SPI characteristics ................................................................................................. 43
4.14.
I2C characteristics ................................................................................................. 43
4.15. USART characteristics ........................................................................................... 43
5. Package information .............................................................................................. 44
5.1. QFN package outline dimensions ............................................................................ 44
5.2. LQFP package outline dimensions .......................................................................... 45
6. Ordering Information ............................................................................................. 47
7. Revision History..................................................................................................... 48
2
GD32F170xx Datasheet
List of Figures
Figure 2-1. GD32F170xx block diagram .................................................................................................... 7
Figure 2-2. GD32F170Rx LQFP64 pinouts ................................................................................................ 8
Figure 2-3. GD32F170Cx LQFP48 pinouts ................................................................................................ 8
Figure 2-4. GD32F170Tx QFN36 pinouts ................................................................................................... 9
Figure 2-5. GD32F170xx clock tree .......................................................................................................... 12
Figure 5-1. QFN package outline .............................................................................................................. 44
Figure 5-2. LQFP package outline ............................................................................................................ 45
3
GD32F170xx Datasheet
List of Tables
Table 2-1. GD32F170xx devices features and peripheral list .................................................................. 6
Table 2-2. GD32F170xx memory map ...................................................................................................... 10
Table 2-3. GD32F170R8 LQFP64 pin definitions .................................................................................... 13
Table 2-4. GD32F170R8 LQFP48 pin definitions ..................................................................................... 18
Table 2-5. GD32F170Tx QFN36 pin definitions ....................................................................................... 22
Table 2-6. Port A alternate functions summary ...................................................................................... 25
Table 2-7. Port B alternate functions summary ...................................................................................... 26
Table 2-8. Port C & D & F alternate functions summary ........................................................................ 27
Table 4-1. Absolute maximum ratings ..................................................................................................... 35
Table 4-2. DC operating conditions ......................................................................................................... 35
Table 4-3. Power consumption characteristics ...................................................................................... 35
Table 4-4. EMS characteristics ................................................................................................................. 37
Table 4-5. EMI characteristics .................................................................................................................. 37
Table 4-6. Power supply supervisor characteristics.............................................................................. 37
Table 4-7. ESD characteristics ................................................................................................................. 38
Table 4-8. Static latch-up characteristics ................................................................................................ 38
Table 4-9. High Speed Crystal oscillator (HXTAL) generated from a crystal/ceramic characteristics
..................................................................................................................................................................... 38
Table 4-10. Low speed crystal oscillator (LXTAL) generated from a crystal/ceramic characteristics
..................................................................................................................................................................... 39
Table 4-11. Internal 8M RC oscillators (IRC8M) characteristics ............................................................ 39
Table 4-12. Voltage values and corresponding IRC8M standard .......................................................... 39
Table 4-13. Low speed internal clock (IRC40K) characteristics ........................................................... 40
Table 4-14. PLL characteristics ................................................................................................................ 40
Table 4-15. Flash memory characteristics .............................................................................................. 40
Table 4-16. I/O port characteristics .......................................................................................................... 41
Table 4-17. ADC characteristics ............................................................................................................... 42
Table 4-18. ADC RAIN max for fADC=28MHz ................................................................................................. 42
Table 4-19. Standard SPI characteristics ................................................................................................ 43
Table 4-20. I2C characteristics ................................................................................................................. 43
Table 4-21. USART characteristics .......................................................................................................... 43
Table 5-1. QFN package dimensions ....................................................................................................... 44
Table 5-2. LQFP package dimensions ..................................................................................................... 46
Table 6-1. Part ordering code for GD32F170xx devices ........................................................................ 47
Table 7-1. Revision history ....................................................................................................................... 48
4
GD32F170xx Datasheet
1.
General description
The GD32F170xx device belongs to the 5V value line of GD32 MCU family. It is a 32-bit
general-purpose microcontroller based on the high performance ARM® Cortex®-M3 RISC
core with best ratio in terms of processing power, reduced power consumption and peripheral
set. The Cortex®-M3 is a next generation processor core which is tightly coupled with a Nested
Vectored Interrupt Controller (NVIC), SysTick timer and advanced debug support.
The GD32F170xx device incorporates the ARM® Cortex®-M3 32-bit processor core operating
at 72 MHz frequency with Flash accesses zero wait states to obtain maximum efficiency. It
provides up to 64 KB on-chip Flash memory and up to 8 KB SRAM memory. An extensive
range of enhanced I/Os and peripherals connected to two APB buses. The device offer one
12-bit ADC, up to five general 16-bit timers, a general 32-bit timer, a PWM advanced timer,
as well as standard and advanced communication interfaces: up to three SPIs, three I2Cs
and two USARTs, two CANs with a CAN PHY.
The device operates from a 2.5 to 5.5V power supply and available in –40 to +85 °C
temperature range. Several power saving modes provide the flexibility for maximum
optimization between wakeup latency and power consumption, an especially important
consideration in low power applications.
The above features make the GD32F170xx devices suitable for a wide range of applications,
especially in areas such as industrial control, motor drives, user interface, power monitor and
alarm systems, consumer and handheld equipment, home appliances, E-bike and so on.
5
GD32F170xx Datasheet
2.
Device overview
2.1.
Device information
Table 2-1. GD32F170xx devices features and peripheral list
Part Number
Flash (KB)
SRAM (KB)
General
timer(32-
bit)
General
timer(16-
bit)
Advanced
timer(16-
bit)
SysTick
Watchdog
RTC
USART
I2C
SPI
CAN
GPIO
EXTI
Units
Channels
(External)
Channels
(Internal)
s
r
e
m
T
i
y
t
i
v
i
t
c
e
n
n
o
C
C
D
A
T4
16
T6
32
4
1
(1)
4
1
(0)
1
2
1
1
(0)
1
(0)
1
(0)
2
(0-1)
28
16
1
10
3
4
1
(1)
4
1
(0)
1
2
1
2
(0-1)
1
(0)
1
(0)
2
(0-1)
28
16
1
10
3
T8
64
8
1
(1)
5
(2,13-16)
1
(0)
1
2
1
2
(0-1)
3
(0-2)
3
(0-2)
2
(0-1)
28
16
1
10
3
GD32F170xx
C4
16
C6
32
4
1
(1)
4
1
(0)
1
2
1
1
(0)
1
(0)
1
(0)
2
(0-1)
39
16
1
10
3
4
1
(1)
4
1
(0)
1
2
1
2
(0-1)
1
(0)
1
(0)
2
(0-1)
39
16
1
10
3
C8
64
8
1
(1)
R8
64
8
1
(1)
5
(2,13-16)
5
(2,13-16)
1
(0)
1
2
1
2
(0-1)
3
(0-2)
3
(0-2)
2
(0-1)
39
16
1
10
3
1
(0)
1
2
1
2
(0-1)
3
(0-2)
3
(0-2)
2
(0-1)
55
16
1
16
3
Package
QFN36
LQFP48
LQFP64
6
GD32F170xx Datasheet
2.2.
Block diagram
Figure 2-1. GD32F170xx block diagram
7
ICodeDCodeSystemNVICTPIUSWFlashMemory ControllerFlashMemoryAHB MatrixSRAMControllerSRAMAHB to APB Bridge 2GP DMA 7chsUSART0SPI0ADCTIMER1612-bitSAR ADCIBusARM Cortex-M3 ProcessorFmax: 72MHzPOR/PDRPLLFmax: 72MHzLDO1.8VIRC8M8MHzHXTAL4-32MHzLVDEXTIPowered by VDD/VDDATIMER0AHB1: Fmax = 72MHzAHB to APB Bridge 1CRCRST/CLK ControllerDBusTouchSensingInterfaceAHB2: Fmax = 72MHzGPIO PortsA, B, C, D, FIRC28M28MHzSYS ConfigTIMER14TIMER15APB2: Fmax = 72MHzIRC40K40KHzPowered by LDO (1.8V)WWDGTAPB1: Fmax = 72MHzSPI1USART1I2C0~2CAN1RTCFWDGTCAN SRAMPMUTIMER13TIMER2TIMER1CAN0SPI2
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