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qcc3026_wlcsp_data_sheet.pdf
General description
Ordering information
QCC3026 WLCSP Development Kit ordering information
QTIL contacts
Device details
QCC3026 WLCSP functional block diagram
Revision history
Status information
Device implementation
Life support policy and use in safety-critical applications
QTIL environmental and RoHS compliance
Contents
Tables
Figures
1 Package information
1.1 QCC3026 WLCSP package dimensions diagram
1.2 QCC3026 WLCSP pin allocations
1.3 QCC3026 WLCSP device terminal functions
1.3.1 QCC3026 WLCSP device terminal functions (Radio)
1.3.2 QCC3026 WLCSP device terminal functions (Clock)
1.3.3 QCC3026 WLCSP device terminal functions (USB)
1.3.4 QCC3026 WLCSP device terminal functions (QSPI)
1.3.5 QCC3026 WLCSP device terminal functions (PIO)
1.3.6 QCC3026 WLCSP device terminal functions (Audio)
1.3.7 QCC3026 WLCSP device terminal functions (AIO/LED drivers)
1.3.8 QCC3026 WLCSP device terminal functions (SMPS)
1.3.9 QCC3026 WLCSP device terminal functions (Power supplies and control)
1.3.10 QCC3026 WLCSP device terminal functions (Ground)
1.3.11 QCC3026 WLCSP device terminal functions (Not connected)
1.4 QCC3026 WLCSP PCB design and assembly considerations
1.4.1 Typical solder reflow profile
1.5 Moisture sensitivity level
2 Bluetooth subsystem
2.1 Bluetooth v5.0
2.2 Bluetooth radio
2.2.1 Receiver
2.2.2 Transmitter
3 Crystal oscillator
3.1 Crystal specification
4 System power states
4.1 No Power state
4.2 Active state
4.3 Shallow Sleep state
4.4 Deep Sleep state
4.5 Dormant state
4.6 Off state
4.7 Transition between static power states
4.8 Power islands
5 Host Interfaces subsystem
5.1 Host Interfaces subsystem features
6 Applications subsystem
6.1 Application subsystem features
7 Audio subsystem
7.1 Audio subsystem features
7.2 Kalimba core
7.3 Program ROM
7.4 Program RAM and caches
7.5 Data RAM
7.6 Buffer Access Controller
7.7 Audio engine
8 Audio interfaces
8.1 Analog audio interfaces
8.1.1 Line/Mic inputs
8.1.2 Line/Headphone output
8.2 Digital audio interfaces
8.2.1 Digital microphone inputs
8.2.2 Standard I²S/PCM interface (Input only)
8.2.3 I²S/PCM master mode timing diagram
8.2.4 I²S/PCM slave mode timing diagram
8.3 Simultaneous audio routing
8.3.1 Codec inputs
8.3.2 Codec output
8.3.3 Audio slots
9 Peripheral interfaces
9.1 PIO
9.2 PIO pad allocation
9.3 Standard I/O
9.4 Pad multiplexing
9.5 RESET# reset pin
9.6 SYS_CTRL pin
9.7 LED pads
9.8 LED controllers
9.9 USB interface
9.10 USB device port
9.11 USB charger detection
10 Transaction bridge
11 Boot Manager
11.1 OTP memory
12 System Manager
12.1 System timer
13 PMU subsystem
13.1 Li-ion charger
13.2 General charger operation
13.2.1 Battery protection
13.2.2 Temperature measurement during charging
13.3 Charging modes
13.4 Power regulation
13.4.1 Switch mode regulators
13.4.2 Bypass LDO regulator
13.4.3 KA regulator
14 QCC3026 WLCSP example application schematic
15 Electrical characteristics
15.1 Absolute maximum ratings
15.2 Recommended operating conditions
15.3 Battery input pin specification
15.4 Charger input pin specification
15.5 Battery charger
15.6 Regulator enable
15.7 Bypass LDO
15.8 1.8 V SMPS
15.9 Digital SMPS
15.10 10‑bit auxiliary ADC
15.11 Digital terminals
15.12 LED driver pads
15.13 ESD protection
16 Audio performance
16.1 Digital-to-analog converter
16.1.1 Class-D DAC audio output
16.2 Analog-to-digital converters
16.2.1 High-quality (HQADC) single-ended audio input
16.2.2 High-quality (HQADC) differential audio input
16.3 Microphone bias
17 Bluetooth performance
18 Power consumption
19 Environmental declaration statement for QTIL semiconductor products
20 Software development and tools
20.1 Qualcomm® MultiCore Development Environment
20.2 Audio Development Kit
Document references
Glossary
QCC3026 WLCSP
Production Information Data Sheet
80-CF475-1 Rev. AD
June 1, 2018
Applications
■ Qualcomm TrueWireless™ stereo earbuds
System architecture
Device description
■
■ High-performance Bluetooth® Audio SoC
Tri-core processor architecture
■
Low power for extended battery life
Features
■ Qualified to Bluetooth® v5.0
specification
120 MHz Qualcomm®
Kalimba™ audio DSP
32 MHz Developer
Processor for applications
■ Firmware Processor for
system
■ Flexible QSPI flash
programmable platform
■ Advanced audio algorithms
■ High-performance 24‑bit
audio interface
1 or 2 mic Qualcomm®
cVc™ headset speech
processing
■
■
■
■ Serial interfaces: UART, Bit
■
■
■
Serializer (I²C/SPI),
USB 2.0
Integrated PMU: Dual
SMPS for system/digital
circuits, Integrated Li-ion
battery charger
15 PIOs, 5 LED pads with
PWM
81-ball 3.9798 x 4.0184 x
0.54 mm, 0.4 mm pitch
WLCSP
Confidential and Proprietary – Qualcomm Technologies International, Ltd.
NO PUBLIC DISCLOSURE PERMITTED: Please report postings of this document on public servers or websites to DocCtrlAgent@qualcomm.com.
Restricted Distribution: Not to be distributed to anyone who is not an employee of either Qualcomm Technologies International, Ltd. or its affiliated companies
without the express approval of Qualcomm Configuration Management.
Not to be used, copied, reproduced, or modified in whole or in part, nor its contents revealed in any manner to others without the express written permission of
Qualcomm Technologies International, Ltd.
All Qualcomm products mentioned herein are products of Qualcomm Technologies, Inc. and/or its subsidiaries. All Qualcomm products mentioned herein are
products of Qualcomm Technologies, Inc. and/or its subsidiaries.
Qualcomm and Qualcomm TrueWireless are trademarks of Qualcomm Incorporated, registered in the United States and other countries. Kalimba and Kymera are
trademarks of Qualcomm Technologies International, Ltd. cVc is a trademark of Qualcomm Technologies International, Ltd., registered in the United States and
other countries. Other product and brand names may be trademarks or registered trademarks of their respective owners.
This technical data may be subject to U.S. and international export, re-export, or transfer ("export") laws. Diversion contrary to U.S. and international law is strictly
prohibited.
Qualcomm Technologies International, Ltd. (formerly known as Cambridge Silicon Radio Limited) is a company registered in England and Wales with a registered
office at: Churchill House, Cambridge Business Park, Cowley Road, Cambridge, CB4 0WZ, United Kingdom.
Registered Number: 3665875 | VAT number: GB787433096
© 2017, 2018 Qualcomm Technologies, Inc. and/or its subsidiaries. All rights reserved.
XTALExt MemoryBluetooth RadioDigital Audio InterfaceI/O andUSBQualcomm® Kalimba™ DSPApps Developer Processor Apps Firmware ProcessorUART/USBPIOI²C/SPIStereo HQ ADCClass-D Earphone SpeakerOutputLED Driver with PWMSMPSLDOsLi-Ion ChargerLine In / DualAnalog Mic InEarphoneBatteryLEDDigMicI²S/PCM
General description
QCC3026 WLCSP is a system on-chip (SoC) with on-chip Bluetooth, audio and programmable application
processor. It includes high-performance, analog, and digital audio codecs, Class-D earphone speaker driver,
advanced power management, Li-ion battery charger, light-emitting diode (LED) drivers, and flexible interfaces
including inter-integrated circuit sound (I²S) input, inter-integrated circuit interface (I²C), universal asynchronous
receiver transmitter (UART), and programmable input/output (PIO).
An application-dedicated Developer Processor and a system Firmware Processor run code from an external quad
serial peripheral interface (QSPI) flash. Both processors have tightly coupled memory (TCM) and an on-chip cache
for performance while executing from external flash memory. The system Firmware Processor provides functions
developed by Qualcomm Technologies International, Ltd. (QTIL). The Developer processor provides flexibility to the
product designer to customize their product.
The Audio subsystem contains a programmable Kalimba core running Qualcomm® Kymera™ system DSP
architecture framework from read only memory (ROM). A range of audio processing capabilities are provided from
ROM which are configurable in fully flexible audio graphs.
The flexibility provided by the programmable applications processor plus the ability to configure the audio processor
enables manufacturers to easily differentiate products with new features.
QCC3026 WLCSP is driven by a flexible, software platform with powerful integrated development environment (IDE)
support. This enables rapid time-to-market.
For more information on development tools and audio development kit (ADK)s for the QCC3026 WLCSP, including
information on Bluetooth and other features supported, see createpoint.qti.qualcomm.com.
80-CF475-1 Rev. AD
Confidential and Proprietary – Qualcomm Technologies International, Ltd.
MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION
2
Ordering information
Device
QCC3026 WLCSP
Type
WLCSP 81-ball
(Pb free)
Package
Size
3.9798 x 4.0184 x
0.54 mm 0.4 mm
pitch
Shipment method
Order number
Tape and reel
QCC3026-0-81WLNSP
NOTE
Your attention is drawn to QTIL’s Terms of Supply, see http://www.qualcomm.com/salesterms or please
request a copy), in particular the section covering Product Warranties & Disclaimers. Please note that
the product warranty differs for production, pre-production, and other versions.
Production status minimum order quantity is 2 kpcs.
Supply chain: QTIL's manufacturing policy is to multisource volume products. For further details,
contact your local sales account manager or representative.
QCC3026 WLCSP Development Kit ordering information
QTIL supplies QCC3026 WLCSP development equipment.
Description
Model
QCC3026 WLCSP Development Kit
TRBI200 Transaction Bridge Interface High-
Speed Debug Adaptor and Programmer
DK-QCC3026-WLCSP81-A-0
DK-TRBI200-CE684-1
Order number
65-CF988-260
65-CE684-1
The QCC3026 WLCSP Development Kit, includes a flexible development board that has a wide range of
interconnects, and QCC3026 WLCSP mounted on a plug-in module.
TRBI200 is a high-speed universal serial bus (USB) to transaction bus interface that supports high-speed debug and
flash programming.
NOTE
TRBI200 use is not mandatory for flash programming or other manufacturing operations. Those actions
are performable using direct USB connection to the QCC3026 WLCSP USB device interface.
QTIL contacts
General information
Information on this product
Customer support for this product
Details of compliance and standards
Help with this document
www.qualcomm.com
qcsales@qti.qualcomm.com
createpoint.qti.qualcomm.com
product.compliance@qti.qualcomm.com
document.feedback@qti.qualcomm.com
80-CF475-1 Rev. AD
Confidential and Proprietary – Qualcomm Technologies International, Ltd.
MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION
3
Device details
Audio subsystem
■ 32‑bit Kalimba audio digital signal processor (DSP) core
with flexible clocking from 2 MHz to 120 MHz to allow
optimization and trade-off performance vs. power
consumption
■ DSP runs from ROM
■ 80 KB program random access memory (RAM)
■ 256 KB data RAM
■ 5 Mb ROM
Application subsystem
■ Dual core application subsystem 32 MHz operation
■ 32‑bit Firmware Processor:
□ Reserved for system use
□ Runs Bluetooth upper stack, profiles, house-keeping
code
■ 32‑bit Developer Processor:
□ Runs developer applications
■ Both cores execute code from external flash memory using
QSPI clocked at 32 MHz
■ On-chip caches per core allow for optimized performance
and power consumption
Bluetooth subsystem
■ Qualified to Bluetooth v5.0 specification including 2 Mbps
Bluetooth low energy (Production parts)
■ Single ended antenna connection with on-chip balun and
Tx/Rx switch
■ Bluetooth, Bluetooth low energy, and mixed topologies
supported
■ Class 1 support
Li-ion battery charger
■ Integrated battery charger supporting up to 200 mA charge
current
■ Variable float (or termination) voltage adjustable in 50 mV
steps from 3.65 V to 4.4 V
■ Thermal monitoring and management are implementable
in application software
■ Pre-charge to fast charge transition configurable at 2.5 V,
2.9 V, 3.0 V, and 3.1 V
Power management
■ Integrated power management unit (PMU) to minimize
external components
■ QCC3026 WLCSP runs directly from a Li-ion, USB, or
external supply (2.8 V to 6.5 V)
■ Auto-switching between battery and USB (or other)
charging source
■ Power islands employed to optimize power consumption
for variety of use-cases
■ Dual switch-mode power supply (SMPS):
□ Automatic mode selection to minimize power
consumption
□ 1.8 V SMPS generates power for both the device and
off-chip circuits
□ Dedicated digital SMPS (output voltage changes
automatically to minimize device power consumption)
80-CF475-1 Rev. AD
Confidential and Proprietary – Qualcomm Technologies International, Ltd.
MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION
4
QCC3026 WLCSP Data Sheet
Device details
Audio engine and digital audio interfaces
■ 1 x unidirectional 24‑bit I²S input
■ Differential high efficiency Class-D earphone speaker
driver output:
□ Class-D signal-to-noise ratio (SNR): 98.3 dBA typ.
□ Class-D total harmonic distortion plus noise (THD
+N): -87.5 dB typ.
■ Dual analog inputs configurable as single ended line inputs
or, unbalanced or balanced analog microphone inputs:
□ SNR single-ended: 101 dBA typ.
□ THD+N single-ended: -85 dB typ.
■ 1 microphone bias (single bias shared by the two
channels):
□ Crosstalk attenuation between two inputs using
recommended application circuit: 65 dB
■ Digital microphone inputs with capability to interface up to
6 digital microphones
■ Both analog-to-digital converter (ADC)s and the digital-to-
analog converter (DAC) support sample rates of 8, 16, 32,
44.1, 48, 96 kHz. The DAC also supports 192 kHz.
Peripherals and physical interfaces
■ A UART interface
■ 2 x Bit Serializers (programmable serial peripheral
interface (SPI) and I²C hardware accelerator)
■ 1 x USB interface:
□ A full speed USB (USB-FS) Device (12 Mbps)
– USB interface includes ESD protection to
IEC-61000-4-2 (device level)
■ QSPI NOR flash interface
□ QSPI encryption to protect developer code and data
□ Encryption programmable with a 128‑bit security key of
original equipment manufacturer (OEM) choice stored in
on-chip one-time programmable (OTP) memory
■ Up to 15 PIO and 5 open drain/digital input LED pads with
pulse width modulation (PWM)
Package and compliance
■ 81-ball 3.9798 x 4.0184 x 0.54 mm, 0.4 mm pitch WLCSP
■ Green (restriction of hazardous substances (RoHS)
compliant and no antimony or halogenated flame
retardants)
80-CF475-1 Rev. AD
Confidential and Proprietary – Qualcomm Technologies International, Ltd.
MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION
5
QCC3026 WLCSP functional block diagram
QCC3026 WLCSP functional block diagram
80-CF475-1 Rev. AD
Confidential and Proprietary – Qualcomm Technologies International, Ltd.
MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION
6
pzt1509877797390.7PMU SubsystemReference OscillatorCrystalBoot ManagerUSB FS DeviceGeneral Purpose InterfacesHost Interfaces SubsystemUSB DeviceUARTFS PHYSystem ManagerPIOPIOsDebug InterfaceLi-ion Battery (3.7 V) and chargeI²C / SPII/O MUXProcessorLi-ion Battery ChargerSMPSs and LDOsFirmwarePIO ControllerLED / PWMLED I/OsOTP MemoryDeveloper/QTIL FirmwareApplications SubsystemQSPI Flash ControllerSerial FlashDeveloper ProcessorCache 0DMA ControllerCache 1Qualcomm® Stacks and LibrariesFirmware ProcessorDeveloper CodeTCM 0Data RAM 0TCM 1Data RAM 1Shared RAMEncryption AcceleratorBluetooth SubsystemBluetooth RadioDigital BasebandAntennaPacket Processing EngineRadio InterfaceDigital ModemTransmitterProcessor SubsystemFirmware ProcessorRAMProgram ROMReceiverModulatorMixerADCLOAudio SubsystemLine/Mic InEarphone OutAnalogue AudioDigital AudioInterfaces Qualcomm® Kalimba™ DSPQualcomm® Kymera™ system DSP architecture, QTIL, and Developer AlgorithmsAudio EngineAudio Codec InputAudio Codec OutputBufferAccess ControllerProgram RAM/CacheProgram ROMData RAMSubsystem ClockingAuxiliary ADCDigital MicsI²S/PCM Input
Revision history
Revision
Date
Change reason
AA
AB
AC
AD
November 2017
December 2017
April 2018
June 2018
Initial release. Alternative document number CS-00407113-DS.
Updated to Engineering Sample status.
Updated to Production Information.
Updates to:
■ Development Kit ordering information
■ Device details
■ Sections 7, 13, 14, 15, and 16
and other minor updates.
80-CF475-1 Rev. AD
Confidential and Proprietary – Qualcomm Technologies International, Ltd.
MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION
7
Status information
QTIL Product Data Sheets progress according to the following formats: Advance Information, Engineering Sample,
Pre-production Information, and Production Information. The status of this document is Production Information.
Advance Information
Information for designers concerning QTIL product in development. All values specified are the target values of the
design. Minimum and maximum values specified are only given as guidance to the final specification limits and must
not be considered as the final values.
Engineering Sample
Information about initial devices. Devices are untested or partially tested prototypes, their status is described in an
Engineering Sample Release Note. All values specified are the target values of the design. Minimum and maximum
values specified are only given as guidance to the final specification limits and must not be considered as the final
values.
All detailed specifications including pinouts and electrical specifications may be changed by QTIL without notice.
Pre-production Information
Pinout and mechanical dimension specifications finalized. All values specified are the target values of the design.
Minimum and maximum values specified are only given as guidance to the final specification limits and must not be
considered as the final values.
All electrical specifications may be changed by QTIL without notice.
Production Information
Final Data Sheet including the guaranteed minimum and maximum limits for the electrical specifications.
Production Data Sheets supersede all previous document versions.
Device implementation
As the feature-set of the QCC3026 WLCSP is firmware build-specific, see the relevant software release note for the
exact implementation of features on the QCC3026 WLCSP.
Life support policy and use in safety-critical applications
QTIL products are not authorized for use in life-support or safety-critical applications. Use in such applications is
done at the sole discretion of the customer. QTIL will not warrant the use of its devices in such applications.
QTIL environmental and RoHS compliance
QCC3026 WLCSP devices meet the requirements of Directive 2011/65/EU of the European Parliament and of the
Council on the Restriction of Hazardous Substance (RoHS).
QCC3026 WLCSP devices are free from halogenated or antimony trioxide-based flame retardants and other
hazardous chemicals. For more information, see QTIL Environmental declaration statement for QTIL semiconductor
products.
80-CF475-1 Rev. AD
Confidential and Proprietary – Qualcomm Technologies International, Ltd.
MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION
8
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