qcc5121_wlcsp_data_sheet.pdf

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QCC5121 WLCSP Production Information Data Sheet 80-CF193-1 Rev. AB April 20, 2018 Applications ■ Wireless speakers ■ Wired/wireless stereo headsets/headphones ■ Qualcomm TrueWireless™ stereo earbuds System architecture Device description ■ Quad-core processor architecture ■ High-performance Bluetooth® Audio SoC ■ ■ Flexible flash programmable platform Low power for extended battery life ■ Serial interfaces: UART, Bit Serializer (I²C/SPI), USB 2.0 Integrated PMU: Dual SMPS for system/digital circuits, Integrated Li-ion battery charger 15 PIOs, 5 LED pads with PWM 81-ball 3.9798 x 4.0184 x 0.54 mm WLCSP ■ ■ ■ Features ■ Qualified to Bluetooth® v5.0 specification ■ Dual 120 MHz Qualcomm® Kalimba™ audio DSPs 32/80 MHz Developer Processor for applications ■ ■ Firmware Processor for system ■ Flexible QSPI flash programmable platform ■ Advanced audio algorithms ■ High-performance 24‑bit stereo audio interface ■ Digital and analog microphone interfaces ■ Active Noise Cancellation: Feedforward, Feedback, Hybrid Confidential and Proprietary – Qualcomm Technologies International, Ltd. NO PUBLIC DISCLOSURE PERMITTED: Please report postings of this document on public servers or websites to DocCtrlAgent@qualcomm.com. Restricted Distribution: Not to be distributed to anyone who is not an employee of either Qualcomm Technologies International, Ltd. or its affiliated companies without the express approval of Qualcomm Configuration Management. Not to be used, copied, reproduced, or modified in whole or in part, nor its contents revealed in any manner to others without the express written permission of Qualcomm Technologies International, Ltd. All Qualcomm products mentioned herein are products of Qualcomm Technologies, Inc. and/or its subsidiaries. All Qualcomm products mentioned herein are products of Qualcomm Technologies, Inc. and/or its subsidiaries. Qualcomm and Qualcomm TrueWireless are trademarks of Qualcomm Incorporated, registered in the United States and other countries. Kalimba and Kymera are trademarks of Qualcomm Technologies International, Ltd. Other product and brand names may be trademarks or registered trademarks of their respective owners. This technical data may be subject to U.S. and international export, re-export, or transfer ("export") laws. Diversion contrary to U.S. and international law is strictly prohibited. Qualcomm Technologies International, Ltd. (formerly known as Cambridge Silicon Radio Limited) is a company registered in England and Wales with a registered office at: Churchill House, Cambridge Business Park, Cowley Road, Cambridge, CB4 0WZ, United Kingdom. Registered Number: 3665875 | VAT number: GB787433096 © 2017, 2018 Qualcomm Technologies International, Ltd. and/or its subsidiaries. All rights reserved. XTALExt MemoryBluetooth RadioDigital Audio InterfaceQualcomm® Kalimba™ DSPI/O andUSBQualcomm® Kalimba™ DSPApps Developer Processor Apps Firmware ProcessorUART/USBPIOI²C/SPIStereo HQ ADCStereo Class-D or Class-AB Headphonesor Line OutLED Driver with PWMSMPSLDOsLi-Ion ChargerLine In / DualAnalog Mic InORANCHeadphonesLine OutI²S/PCMSPDIFBatteryLEDDigMic

General description QCC5121 WLCSP is a system on-chip (SoC) with on-chip Bluetooth, audio and programmable application processor. It includes high-performance, analog, and digital audio codecs, Class-AB and Class-D headphone drivers, advanced power management, Li-ion battery charger, light-emitting diode (LED) drivers, and flexible interfaces including inter-integrated circuit sound (I²S), inter-integrated circuit interface (I²C), universal asynchronous receiver transmitter (UART), and programmable input/output (PIO). An application-dedicated Developer Processor and a system Firmware Processor run code from an external quad serial peripheral interface (QSPI) flash. Both processors have tightly coupled memory (TCM) and an on-chip cache for performance while executing from external flash memory. The system Firmware Processor provides functions developed by Qualcomm Technologies International, Ltd. (QTIL). The Developer processor provides flexibility to the product designer to customize their product. The Audio subsystem contains two programmable Kalimba cores running Qualcomm® Kymera™ system DSP architecture framework from read only memory (ROM). A range of audio processing capabilities are provided from ROM which are configurable in fully flexible audio graphs. In built capabilities in ROM, may be complimented or replaced by capabilities run from random access memory (RAM), including those provided by QTIL, the product designer or third parties. The flexibility provided by the fully programmable applications processor plus the ability to configure and program the audio processors enables manufacturers to easily differentiate products with new features. QCC5121 WLCSP is driven by a flexible, software platform with powerful integrated development environment (IDE) support. This enables rapid time-to-market deployment for a broad range of consumer electronic products, including headphones, headsets, speakers, and Qualcomm TrueWireless stereo earbuds. For more information on development tools and audio development kit (ADK)s for the QCC5121 WLCSP, including information on Bluetooth and other features supported, see createpoint.qti.qualcomm.com. 80-CF193-1 Rev. AB Confidential and Proprietary – Qualcomm Technologies International, Ltd. MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 2

Ordering information Device QCC5121 WLCSP Type WLCSP 81-ball (Pb free) Package Size 3.9798 x 4.0184 x 0.54 mm 0.4 mm pitch Shipment method Order number Tape and reel QCC5121-0-81WLNSP NOTE Your attention is drawn to QTIL’s Terms of Supply, see http://www.qualcomm.com/salesterms or please request a copy), in particular the section covering Product Warranties & Disclaimers. Please note that the product warranty differs for production, pre-production, and other versions. Production status minimum order quantity is 2 kpcs. Supply chain: QTIL's manufacturing policy is to multisource volume products. For further details, contact your local sales account manager or representative. QCC5121 WLCSP Development Kit ordering information QTIL supplies QCC5121 WLCSP development equipment. Description Model QCC5121 WLCSP Development Kit TRBI200 Transaction Bridge Interface High- Speed Debug Adaptor and Programmer DK-5121-WLCSP-CF338-110 DK-TRBI200-CE684-1 Order number 65-CF989-210 65-CE684-1 The QCC5121 WLCSP Development Kit, includes a flexible development board that has a wide range of interconnects, and QCC5121 WLCSP mounted on a plug-in module. TRBI200 is a high-speed universal serial bus (USB) to transaction bus interface that supports high-speed debug and flash programming. NOTE TRBI200 use is not mandatory for flash programming or other manufacturing operations. Those actions are performable using direct USB connection to the QCC5121 WLCSP USB device interface. QTIL contacts General information Information on this product Customer support for this product Details of compliance and standards Help with this document www.qualcomm.com qcsales@qti.qualcomm.com createpoint.qti.qualcomm.com product.compliance@qti.qualcomm.com document.feedback@qti.qualcomm.com 80-CF193-1 Rev. AB Confidential and Proprietary – Qualcomm Technologies International, Ltd. MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 3

Device details Li-ion battery charger ■ Integrated battery charger supporting internal mode (up to 200 mA) and external mode (up to 1.8 A) ■ Variable float (or termination) voltage adjustable in 50 mV steps from 3.65 V to 4.4 V ■ Thermal monitoring and management are implementable in application software ■ Pre-charge to fast charge transition configurable at 2.5 V, 2.9 V, 3.0 V, and 3.1 V Power management ■ Integrated power management unit (PMU) to minimize external components ■ QCC5121 WLCSP runs directly from a Li-ion, USB, or external supply (2.8 V to 6.5 V) ■ Auto-switching between battery and USB (or other) charging source ■ Power islands employed to optimize power consumption for variety of use-cases ■ Dual switch-mode power supply (SMPS): □ Automatic mode selection to minimize power consumption □ 1.8 V SMPS generates power for both the device and off-chip circuits □ Dedicated digital SMPS (output voltage changes automatically to minimize device power consumption) Audio subsystem ■ Dual 32‑bit Kalimba audio digital signal processor (DSP) cores with flexible clocking from 2 MHz to 120 MHz to allow optimization and trade-off performance vs. power consumption ■ DSPs execute code from ROM and from program RAM, original equipment manufacturer (OEM) and third party developed features can run from program RAM ■ 80 KB program RAM ■ 256 KB data RAM ■ 5 Mb ROM Application subsystem ■ Dual-core application subsystem 32/80 MHz operation ■ 32‑bit Firmware Processor: □ Reserved for system use □ Runs Bluetooth upper stack, profiles, house-keeping code ■ 32‑bit Developer Processor: □ Runs developer applications ■ Both cores execute code from external flash memory using QSPI clocked at 32 MHz or 80 MHz ■ On-chip caches per core allow for optimized performance and power consumption Bluetooth subsystem ■ Qualified to Bluetooth v5.0 specification including 2 Mbps Bluetooth low energy (Production parts) ■ Single ended antenna connection with on-chip balun and Tx/Rx switch ■ Bluetooth, Bluetooth low energy, and mixed topologies supported ■ Class 1 support 80-CF193-1 Rev. AB Confidential and Proprietary – Qualcomm Technologies International, Ltd. MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 4

QCC5121 WLCSP Data Sheet Device details Audio engine and digital audio interfaces ■ 24-bit I²S interface with 1 input and 3 output channels ■ Programmable audio master clock (MCLK) ■ Sony/Philips digital interface (SPDIF): 2, configurable as input or output ■ Stereo analog outputs configurable as differential Class- AB headphone outputs or differential high efficiency Class- D outputs: □ A signal-to-noise ratio (SNR) differential: 98 dBA typ. □ A total harmonic distortion plus noise (THD+N) differential, 32 Ω load: -85 dB typ. ■ Dual analog inputs configurable as single ended line inputs or, unbalanced or balanced analog microphone inputs: □ SNR single-ended: 96 dBA typ. □ THD+N single-ended: -85 dB typ. ■ 1 microphone bias (single bias shared by the two channels): □ Crosstalk attenuation between two inputs using recommended application circuit: 65 dB ■ Digital microphone inputs with capability to interface up to 6 digital microphones ■ Both analog-to-digital converter (ADC)s and digital-to- analog converter (DAC)s support sample rates of 8, 16, 32, 44.1, 48, 96 kHz. DACs also support 192 kHz. Peripherals and physical interfaces ■ A UART interface ■ 2 x Bit Serializers (programmable serial peripheral interface (SPI) and I²C hardware accelerator) ■ 1 x USB interface: □ A full speed USB (USB-FS) Device (12 Mbps) – USB interface includes ESD protection to IEC-61000-4-2 (device level) ■ QSPI NOR flash interface □ QSPI encryption to protect developer code and data □ Encryption programmable with a 128‑bit security key of OEM choice stored in on-chip one-time programmable (OTP) memory ■ Up to 15 PIO and 5 open drain/digital input LED pads with pulse width modulation (PWM) Package and compliance ■ 81-ball 3.9798 x 4.0184 x 0.54 mm, 0.4 mm pitch WLCSP ■ Green (restriction of hazardous substances (RoHS) compliant and no antimony or halogenated flame retardants) 80-CF193-1 Rev. AB Confidential and Proprietary – Qualcomm Technologies International, Ltd. MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 5

QCC5121 WLCSP functional block diagram QCC5121 WLCSP functional block diagram 80-CF193-1 Rev. AB Confidential and Proprietary – Qualcomm Technologies International, Ltd. MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 6 bdu1512740137732.1PMU SubsystemReference OscillatorCrystalBoot ManagerUSB FS DeviceGeneral Purpose InterfacesHost Interfaces SubsystemUSB DeviceUARTFS PHYSystem ManagerPIOPIOsDebug InterfaceLi-ion Battery (3.7 V) and chargeI²C / SPII/O MUXProcessorLi-ion Battery ChargerSMPSs and LDOsFirmwarePIO ControllerLED / PWMLED I/OsOTP MemoryDeveloper/QTIL FirmwareApplications SubsystemQSPI Flash ControllerSerial FlashDeveloper ProcessorCache 0DMA ControllerCache 1Qualcomm® Stacks and LibrariesFirmware ProcessorDeveloper CodeTCM 0Data RAM 0TCM 1Data RAM 1Shared RAMEncryption AcceleratorBluetooth SubsystemBluetooth RadioDigital BasebandAntennaPacket Processing EngineRadio InterfaceDigital ModemTransmitterProcessor SubsystemFirmware ProcessorRAMProgram ROMReceiverModulatorMixerADCLOAudio SubsystemLine/Mic InDigital MicsI²S/PCM Input/OutputSPDIF Input/OutputLine/Headphone OutAnalogue AudioDigital AudioInterfaces Qualcomm® Kalimba™ DSPQualcomm® Kymera™ system DSP architecture, QTIL, and Developer AlgorithmsQualcomm® Kalimba™ DSPQualcomm® Kymera™ system DSP architecture, QTIL, and Developer AlgorithmsAudio Engine6 x Codec Inputs2 x Codec OutputsANCBufferAccess ControllerProgram RAM/CacheProgram ROMData RAMSubsystem ClockingAuxiliary ADC

Revision history Revision Date Change reason AA AB December 2017 April 2018 Initial release. Alternative document number CS-00405666-DS. Updated to Production Information. 80-CF193-1 Rev. AB Confidential and Proprietary – Qualcomm Technologies International, Ltd. MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 7

Status information QTIL Product Data Sheets progress according to the following formats: Advance Information, Engineering Sample, Pre-production Information, and Production Information. The status of this document is Production Information. Advance Information Information for designers concerning QTIL product in development. All values specified are the target values of the design. Minimum and maximum values specified are only given as guidance to the final specification limits and must not be considered as the final values. Engineering Sample Information about initial devices. Devices are untested or partially tested prototypes, their status is described in an Engineering Sample Release Note. All values specified are the target values of the design. Minimum and maximum values specified are only given as guidance to the final specification limits and must not be considered as the final values. All detailed specifications including pinouts and electrical specifications may be changed by QTIL without notice. Pre-production Information Pinout and mechanical dimension specifications finalized. All values specified are the target values of the design. Minimum and maximum values specified are only given as guidance to the final specification limits and must not be considered as the final values. All electrical specifications may be changed by QTIL without notice. Production Information Final Data Sheet including the guaranteed minimum and maximum limits for the electrical specifications. Production Data Sheets supersede all previous document versions. Device implementation As the feature-set of the QCC5121 WLCSP is firmware build-specific, see the relevant software release note for the exact implementation of features on the QCC5121 WLCSP. Life support policy and use in safety-critical applications QTIL products are not authorized for use in life-support or safety-critical applications. Use in such applications is done at the sole discretion of the customer. QTIL will not warrant the use of its devices in such applications. QTIL environmental and RoHS compliance QCC5121 WLCSP devices meet the requirements of Directive 2011/65/EU of the European Parliament and of the Council on the Restriction of Hazardous Substance (RoHS). QCC5121 WLCSP devices are free from halogenated or antimony trioxide-based flame retardants and other hazardous chemicals. For more information, see QTIL Environmental declaration statement for QTIL semiconductor products. 80-CF193-1 Rev. AB Confidential and Proprietary – Qualcomm Technologies International, Ltd. MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 8

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