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ZTEWelink+Hardware+Development+Guide+of+ME3620+Module+Product_V1....pdf
Revision History
Contents
Figures
Tables
1 About This Document
1.1 Application Range
1.2 Purpose
1.3 Abbreviations
2 Product Overview
2.1 Mechanic Features
2.2 Technical Parameters
2.3 Function Overview
2.3.1 Baseband Function
2.3.2 Radio Frequency Function
3 Interfaces
3.1 Definition of PINs
3.1.1 PIN Configuration Diagram
3.1.2 PIN Description
3.2 Feature of Digital Power Level
3.3 Power Interface
3.3.1 Description of Power PINs
3.3.2 Requirement of Power Supply
3.4 (U)SIM Card Interface
3.4.1 Description of PINs
3.4.2 Electric Feature
3.4.3 Application of (U)SIM Card Interface
3.5 USB2.0 Interface
3.5.1 Description of PINs
3.5.2 Electric Feature
3.5.3 Application of USB Interface
3.6 UART Interface
3.6.1 8-wire UART Interface
3.6.2 Electric Feature
3.7 Power-on/Power-off & Reset Signal
3.7.1 Power-on/Power-off Signal
3.7.2 Power-on/Power-off Flow
3.7.3 Resetting Flow
3.8 LED Indicator Interface
3.9 PCM Interface (Optional)
3.10 I2C Bus
3.10.1 Description of PINs
3.10.2 Electric Feature
4 Power Interface Design Guideline
4.1 General Design Rules
4.2 Power Supply Requirement
4.3 Circuit Requirements of Power Supply Output
4.4 Recommended Power Reference Circuit
4.5 PCB Layout Guideline of Power Supply
5 RF Antenna Design Guide
5.1 Design of Antenna
5.1.1 Preliminary Antenna Evaluation
5.1.2 Suggested Antenna Location
5.1.3 Matching Circuit of Antenna
5.2 PCB line guidelines
5.3 Suggestions for EMC & ESD Design
5.3.1 EMC Design Requirements
5.3.2 ESD Design Requirements
5.4 Test Methods for Whole-Set Antenna OTA
6 Electric Feature
6.1 Power Supply
6.2 Working Current
7 Technical Index of Radio Frequency
7.1 Index of RF under UMTS Mode
7.1.1 Maximum Transmission Power
7.1.2 Receiving Sensibility
7.1.3 Spurious Emission Index
7.2 Index of RF under GPRS/GSM/EDGE Mode
7.2.1 Output Transmission Power
7.2.2 Receiving Sensibility
7.2.3 Spurious Emission Index
7.3 Index of RF under TD-SCDMA Mode
7.3.1 Maximum Transmission Power
7.3.2 Receiving Sensibility
7.3.3 Spurious Emission Index
7.4 Index of RF under LTE Mode
7.4.1 Maximum Transmission Power
7.4.2 Receiving Sensitivity
7.4.3 Spurious Specification
8 Related Test & Test Standard
8.1 Testing Reference
8.2 Description of Testing Environment
8.3 Reliability Testing Environment
9 SMT Process and Baking Guide
9.1 Storage Requirements
9.2 Module’s Position Requirements on Main board
9.3 Module Planeness Standard
9.4 Process Routing Selection
9.4.1 Solder Paste Selection
9.4.2 Design of module PAD’s steel mesh opening on main board
9.4.3 Module Board’s SMT process
9.4.4 Module Soldering Reflow Curve
9.4.5 Reflow method
9.4.6 Maintenance of defects
9.5 Module’s Baking Requirements
9.5.1 Module’s Baking Environment
9.5.2 Baking device and operation procedure
9.5.3 Module Baking Conditions
10 Safety Information
2048530378 @ qq.com 14.127.28.239 2015-8-31 10:03:15
Hardware Development Guide of
Module Product
Version V1.0, 2015-06-04
ME3620
ME3620
Hardware Development Guide of Module Product
Legal Information
By receiving the document from Shenzhen ZTEWelink Technology Co., Ltd (shortly referred to as
ZTEWelink), you are deemed to have agreed to the following terms. If you don’t agree to the following
terms, please stop using the document.
read this document.
Copyright © 2015 Shenzhen ZTEWelink Technology Co., Ltd. All rights reserved. The document contains
ZTEWelink’s proprietary information. Without the prior written permission of ZTEWelink, no entity or
individual is allowed to reproduce, transfer, distribute, use and disclose this document or any image, table,
data or other information contained in this document.
As the wholly-owned subsidiaries of ZTE, ZTEWelink is the professional company engaging in R&D,
manufacture and sales of wireless module product.
is the registered trademark of
ZTEWelink. The name and logo of ZTEWelink are ZTEWelink’s trademark or registered trademark.
Meanwhile, ZTEWelink is granted to use ZTE Corporation’s registered trademark. The other products or
company names mentioned in this document are the trademark or registered trademark of their respective
owner. Without the prior written permission of ZTEWelink or the third-party oblige, no one is allowed to
2048530378 @ qq.com 14.127.28.239 2015-8-31 10:03:15
The product meets the design requirements of environmental protection and personal security. The storage,
use or disposal of products should abide by the product manual, relevant contract or the laws and
regulations of relevant country.
ZTEWelink reserves the right to make modifications on the product described in this document without
prior notice, and keeps the right to revise or retrieve the document any time.
If you have any question about the manual, please consult the company or its distributors promptly.
All Rights reserved, No Spreading abroad without Permission of ZTEWelink
I
ME3620
Hardware Development Guide of Module Product
Revision History
Version
Date
Description
1.0
2015-06-04
1st released version
2048530378 @ qq.com 14.127.28.239 2015-8-31 10:03:15
All Rights reserved, No Spreading abroad without Permission of ZTEWelink
II
ME3620
Hardware Development Guide of Module Product
Contents
1
About This Document ...................................................................................... 10
1.1
1.2
1.3
2.1
2.2
2.3
2
3
3.1
3.2
3.3
Application Range ............................................................................................................ 10
Purpose ............................................................................................................................ 10
Abbreviations ................................................................................................................... 10
Product Overview ............................................................................................ 13
Mechanic Features ............................................................................................................ 14
Technical Parameters ........................................................................................................ 15
Function Overview ........................................................................................................... 16
2048530378 @ qq.com 14.127.28.239 2015-8-31 10:03:15
Feature of Digital Power Level .......................................................................................... 21
Power Interface ................................................................................................................ 22
Interfaces ......................................................................................................... 18
Definition of PINs ............................................................................................................ 18
2.3.1 Baseband Function ........................................................................................................... 16
2.3.2 Radio Frequency Function ................................................................................................. 17
3.1.1 PIN Configuration Diagram ............................................................................................... 18
3.1.2 PIN Description ................................................................................................................ 19
3.3.1 Description of Power PINs ................................................................................................ 22
3.3.2 Requirement of Power Supply ........................................................................................... 22
3.4
(U)SIM Card Interface ...................................................................................................... 23
3.4.1 Description of PINs .......................................................................................................... 23
3.4.2 Electric Feature ................................................................................................................ 23
3.4.3 Application of (U)SIM Card Interface ................................................................................ 23
3.5
USB2.0 Interface .............................................................................................................. 24
3.5.1 Description of PINs .......................................................................................................... 24
3.5.2 Electric Feature ................................................................................................................ 24
3.5.3 Application of USB Interface............................................................................................. 25
All Rights reserved, No Spreading abroad without Permission of ZTEWelink
III
ME3620
3.6
UART Interface ................................................................................................................ 25
Hardware Development Guide of Module Product
3.6.1 8-wire UART Interface ..................................................................................................... 25
3.6.2 Electric Feature ................................................................................................................ 26
3.7
Power-on/Power-off & Reset Signal ................................................................................... 28
3.7.1 Power-on/Power-off Signal ............................................................................................... 28
3.7.2 Power-on/Power-off Flow ................................................................................................. 30
3.7.3 Resetting Flow ................................................................................................................. 31
3.10.1 Description of PINs .......................................................................................................... 33
3.10.2 Electric Feature ................................................................................................................ 33
LED Indicator Interface .................................................................................................... 31
PCM Interface (Optional) .................................................................................................. 32
I2C Bus ........................................................................................................................... 33
2048530378 @ qq.com 14.127.28.239 2015-8-31 10:03:15
Power Interface Design Guideline ..................................................................... 35
General Design Rules........................................................................................................ 35
Power Supply Requirement ............................................................................................... 35
Circuit Requirements of Power Supply Output .................................................................... 37
Recommended Power Reference Circuit ............................................................................. 37
RF Antenna Design Guide ................................................................................ 41
Design of Antenna ............................................................................................................ 41
PCB Layout Guideline of Power Supply ............................................................................. 39
3.8
3.9
3.10
4
4.1
4.2
4.3
4.4
4.5
5
5.1
5.2
5.3
5.1.1 Preliminary Antenna Evaluation ........................................................................................ 41
5.1.2 Suggested Antenna Location ............................................................................................. 41
5.1.3 Matching Circuit of Antenna ............................................................................................. 42
PCB line guidelines .......................................................................................................... 43
Suggestions for EMC & ESD Design ................................................................................. 44
5.3.1 EMC Design Requirements ............................................................................................... 44
5.3.2 ESD Design Requirements ................................................................................................ 45
5.4
Test Methods for Whole-Set Antenna OTA ........................................................................ 45
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IV
ME3620
6
6.1
6.2
Electric Feature ............................................................................................... 47
Power Supply ................................................................................................................... 47
Working Current .............................................................................................................. 47
Hardware Development Guide of Module Product
7
Technical Index of Radio Frequency ................................................................. 50
7.1
Index of RF under UMTS Mode ........................................................................................ 50
Index of RF under GPRS/GSM/EDGE Mode ...................................................................... 51
7.1.3 Spurious Emission Index ................................................................................................... 51
7.1.1 Maximum Transmission Power .......................................................................................... 50
7.1.2 Receiving Sensibility ........................................................................................................ 50
7.2.1 Output Transmission Power ............................................................................................... 51
7.2.2 Receiving Sensibility ........................................................................................................ 52
7.2.3 Spurious Emission Index ................................................................................................... 52
2048530378 @ qq.com 14.127.28.239 2015-8-31 10:03:15
7.4.1 Maximum Transmission Power .......................................................................................... 53
7.4.2 Receiving Sensitivity ........................................................................................................ 54
7.4.3 Spurious Specification ...................................................................................................... 55
Index of RF under TD-SCDMA Mode ............................................................................... 52
7.3.1 Maximum Transmission Power .......................................................................................... 52
7.3.2 Receiving Sensibility ........................................................................................................ 52
7.3.3 Spurious Emission Index ................................................................................................... 53
Index of RF under LTE Mode ............................................................................................ 53
7.2
7.3
7.4
8
Related Test & Test Standard ........................................................................... 58
8.1
8.2
8.3
Testing Reference ............................................................................................................. 58
Description of Testing Environment ................................................................................... 59
Reliability Testing Environment ........................................................................................ 60
9
SMT Process and Baking Guide ....................................................................... 61
9.1
9.2
9.3
Storage Requirements ....................................................................................................... 61
Module’s Position Requirements on Main board ................................................................. 61
Module Planeness Standard ............................................................................................... 62
All Rights reserved, No Spreading abroad without Permission of ZTEWelink
V
ME3620
9.4
Process Routing Selection ................................................................................................. 62
Hardware Development Guide of Module Product
9.4.1 Solder Paste Selection ....................................................................................................... 62
9.4.2 Design of module PAD’s steel mesh opening on main board ................................................ 63
9.4.3 Module Board’s SMT process............................................................................................ 64
9.4.4 Module Soldering Reflow Curve ........................................................................................ 65
9.4.5 Reflow method ................................................................................................................. 66
9.4.6 Maintenance of defects...................................................................................................... 66
Module’s Baking Requirements ......................................................................................... 66
9.5
10
Safety Information ........................................................................................... 68
9.5.1 Module’s Baking Environment .......................................................................................... 66
9.5.2 Baking device and operation procedure .............................................................................. 67
9.5.3 Module Baking Conditions ................................................................................................ 67
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All Rights reserved, No Spreading abroad without Permission of ZTEWelink
VI
ME3620
Hardware Development Guide of Module Product
Figures
Figure 2–1 Product Illustration ................................................................................................................ 13
Figure 2–2 Module Dimensions ............................................................................................................... 14
Figure 2–3 Recommended PAD dimensions on corresponding main board ........................................... 15
Figure 3–11 Timing of Resetting Module ................................................................................................ 31
Figure 3–12 Reference Circuit of Status Indicator ................................................................................... 32
Figure 3–13 Generic PCM Connections .................................................................................................. 33
Figure 3–14 I2C Reference Circuit Diagram ........................................................................................... 34
Figure 4–1 Power Supply Current and Voltage Change under EDGE/GPRS ......................................... 36
Figure 2–4 System Connection Structure ................................................................................................ 16
Figure 3–1 PIN Configuration Diagram .................................................................................................. 18
Figure 3–2 (U)SIM Card Signal Connection Circuit ............................................................................... 23
Figure 3–3 USB Typical Circuit Application .......................................................................................... 25
Figure 3–4 Module Serial Port & AP Application Processor .................................................................. 26
Figure 3–5 The connection of UART and Standard RS-232-C interface ................................................ 27
Figure 3–6 UART level shifter from 1.8V to 3.3V .................................................................................. 28
Figure 3–7 Turn on the Module Using Driving Circuit ........................................................................... 29
2048530378 @ qq.com 14.127.28.239 2015-8-31 10:03:15
Figure 3–8 Resetting the Module Using Driving Circuit ......................................................................... 29
Figure 3–9 Power-on Sequence Chart of Module .................................................................................... 30
Figure 3–10 Power-off Sequence Chart of Module ................................................................................. 30
Figure 4–2 Add storage capacitor to Module power supply terminal ...................................................... 37
Figure 4–3 DC/DC Switching Power Supply .......................................................................................... 38
Figure 4–4 LDO Power Supply ............................................................................................................... 39
Figure 5–1 Main Antenna & Diversity Antenna Transition Circuit ........................................................ 42
Figure 5–2 GPS Antenna Transition Circuit ............................................................................................ 43
Figure 5–3 The OTA test system of CTIA ............................................................................................... 46
Figure 9–1 Green oil and white oil at module’s position on main board ................................................. 62
Figure 9–2 Module Board’s Steel Mesh Diagram ................................................................................... 64
Figure 9–3 Material Module Pallet .......................................................................................................... 64
Figure 9–4 Module Furnace Temperature Curve Diagram ...................................................................... 66
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VII
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