Section 1. Signal Description
1.1 Pin Description
1.1.1 Pin Type Definitions
1.2 88E1149 176-Pin TQFP Package
1.3 88E1149 196-Pin TFBGA Package
Section 2. Functional Specifications
2.1 Copper Media Interface
2.2 MAC Interface
2.3 Loopback
2.3.1 MAC Interface Loopback
2.3.2 Line Loopback
2.3.3 External Loopback
2.4 Synchronizing FIFO
2.5 Copper Media Transmit and Receive Function
2.5.1 Transmit Side Network Interface
2.5.1.1 Multi-mode TX Digital to Analog Converter
2.5.1.2 Slew Rate Control and Waveshaping
2.5.2 Encoder
2.5.2.1 1000BASE-T
2.5.2.2 100BASE-TX
2.5.2.3 10BASE-T
2.5.3 Receive Side Network Interface
2.5.3.1 Analog to Digital Converter
2.5.3.2 Active Hybrid
2.5.3.3 Echo Canceller
2.5.3.4 NEXT Canceller
2.5.3.5 Baseline Wander Canceller
2.5.3.6 Digital Adaptive Equalizer
2.5.3.7 Digital Phase Lock Loop
2.5.3.8 Link Monitor
2.5.3.9 Signal Detection
2.5.4 Decoder
2.5.4.1 1000BASE-T
2.5.4.2 100BASE-TX
2.5.4.3 10BASE-T
2.6 Power Supplies
2.6.1 AVDDH
2.6.2 VDDC
2.6.3 AVDDT
2.6.4 DVDD
2.6.5 VDDO
2.6.6 Power Supply Sequencing
2.7 Power Management
2.7.1 Low Power Modes
2.7.2 Low Power Operating Modes
2.7.2.1 IEEE Power Down Mode
2.7.2.2 Energy Detect Power Down Modes
2.7.2.3 Energy Detect (Mode 1)
2.7.2.4 Energy Detect +TM (Mode 2)
2.7.2.5 Normal 10/100/1000 Mbps Operation
2.7.3 SGMII Effect on Low Power Modes
2.8 Auto-Negotiation
2.8.1 10/100/1000BASE-T Auto-Negotiation
2.8.2 SGMII Auto-Negotiation
2.8.2.1 Flow control Enhancement to SGMII Auto-Negotiation
2.8.2.2 Serial Interface Auto-Negotiation Bypass Mode
2.9 Downshift Feature
2.10 Virtual Cable Tester™ (VCT™)
2.11 Data Terminal Equipment (DTE) Detect
2.12 CRC Error Counter and Frame Counter
2.12.1 Enabling The CRC Error Counter and Frame Counter
2.13 Packet Generator
2.14 MDI/MDIX Crossover
2.15 Polarity Correction
2.16 LED
2.16.1 LED Polarity
2.16.2 Pulse Stretching and Blinking
2.16.3 Bi-Color LED Mixing
2.16.4 Modes of Operation
2.16.4.1 Compound LED Modes
2.16.4.2 Speed Blink
2.16.4.3 Manual Override
2.16.4.4 MODE 1, MODE 2, MODE 3, MODE 4
2.17 IEEE 1149.1 and 1149.6 Controller
2.17.1 BYPASS Instruction
2.17.2 SAMPLE/PRELOAD Instruction
2.17.2.1 Boundary Scan Chain Order
2.17.2.2 Boundary Scan Chain Order
2.17.2.3 Boundary Scan Exclusion List
2.17.3 EXTEST Instruction
2.17.4 The CLAMP Instruction
2.17.5 The HIGH-Z Instruction
2.17.6 ID CODE Instruction
2.17.7 EXTEST_PULSE Instruction
2.17.8 EXTEST_TRAIN Instruction
2.17.9 PROG_HYST Instruction
2.17.10 AC-JTAG Fault Detection
2.18 Interrupt
2.19 Configuring the 88E1149 Device
2.19.1 Hardware Configuration
2.19.2 Software Configuration - Management Interface
2.19.2.1 Extended Register Access
2.19.2.2 Preamble Suppression
Section 3. Register Description
Section 4. Electrical Specifications
4.1. Absolute Maximum Ratings
4.2. Recommended Operating Conditions
4.3. Package Thermal Information
4.3.1 Thermal Conditions for 176-pin, TQFP Package
4.3.2 Thermal Conditions for 196-pin, TFBGA Package
4.4. Current Consumption (TBD)
4.4.1 Current Consumption AVDDH
4.4.2 Current Consumption VDDC
4.4.3 Current Consumption AVDDT
4.4.4 Current Consumption DVDD
4.4.5 Current Consumption VDDO
4.4.6 Current Consumption Center_Tap
4.5. DC Operating Conditions
4.5.0.1 Digital Pins (TBD)
4.5.1 Internal Resistor Description
4.5.2 IEEE DC Transceiver Parameters
4.5.3 SGMII Interface
4.5.3.1 Transmitter DC Characteristics
4.5.3.2 Common Mode Voltage (Voffset) Calculations
4.5.3.3 Receiver DC Characteristics
4.6. AC Electrical Specifications
4.6.1 Reset Timing
4.6.2 XTAL1/XTAL2 Timing
4.6.3 LED to CONFIG Timing
4.7. SGMII Interface Timing
4.7.1 SGMII Output AC Characteristics
4.7.2 SGMII Input AC Characteristics
4.8. MDC/MDIO Timing
4.8.1 JTAG Timing
4.9. IEEE AC Transceiver Parameters
4.10. Latency Timing
4.10.1 SGMII to 10/100/1000BASE-T Transmit Latency Timing
4.10.2 10/100/1000BASE-T to SGMII Receive Latency Timing
Section 5. Mechanical Drawings
5.1 88E1149 176-Pin TQFP Package Drawing
5.2 88E1149 196-Pin TFBGA Package Drawing
Section 6. Order Information
6.1 Ordering Part Numbers and Package Markings