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Xilinx7系列FPGA用户手册.pdf

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Spartan-7 FPGAs Logic Resources Memory Resources Clock Resources I/O Resources Embedded Hard IP Resources Speed Grades Part Number Logic Cells Slices CLB Flip-Flops Max. Distributed RAM (Kb) Block RAM/FIFO w/ ECC (36 Kb each) Total Block RAM (Kb) Clock Mgmt Tiles (1 MMCM + 1 PLL) Max. Single-Ended I/O Pins Max. Differential I/O Pairs DSP Slices Analog Mixed Signal (AMS) / XADC Configuration AES / HMAC Blocks Commercial Temp (C) Industrial Temp (I) Expanded Temp (Q) Body Area Ball Pitch Package(1) CPGA196 CSGA225 CSGA324 FTGB196 FGGA484 FGGA676 (mm) 8x8 13x13 15x15 15x15 23x23 27x27 (mm) 0.5 0.8 0.8 1.0 1.0 1.0 I/O Optimization at the Lowest Cost and Highest Performance-per-Watt (1.0V, 0.95V) XC7S6 6,000 938 7,500 70 5 180 2 100 48 10 0 0 XC7S15 12,800 2,000 16,000 150 10 360 2 100 48 20 0 0 XC7S25 23,360 3,650 29,200 313 45 1,620 3 150 72 80 1 1 XC7S50 52,160 8,150 65,200 600 75 2,700 5 250 120 120 1 1 XC7S75 76,800 12,000 96,000 832 90 3,240 8 400 192 140 1 1 XC7S100 102,400 16,000 128,000 1,100 120 4,320 8 400 192 160 1 1 -1,-2 -1,-2,-1L -1 -1,-2 -1,-2,-1L -1 -1,-2 -1,-2,-1L -1 -1,-2 -1,-2,-1L -1 -1,-2 -1,-2,-1L -1 -1,-2 -1,-2,-1L -1 Available User I/O: 3.3V SelectIO™ HR I/O 100 100 100 100 100 100 150 150 100 210 100 250 338 400 338 400 Notes: 1. Packages with the same last letter and number sequence, e.g., A484, are footprint compatible with all other Spartan-7 devices with the same sequence. The footprint compatible devices within this family are outlined. Page 2
Artix-7 FPGAs Transceiver Optimization at the Lowest Cost and Highest DSP Bandwidth (1.0V, 0.95V, 0.9V) Logic Resources Memory Resources Clock Resources I/O Resources Embedded Hard IP Resources Speed Grades Footprint Compatible Footprint Compatible Page 3 Part Number XC7A12T 12,800 2,000 16,000 Logic Cells Slices CLB Flip-Flops Maximum Distributed RAM (Kb) Block RAM/FIFO w/ ECC (36 Kb each) Total Block RAM (Kb) CMTs (1 MMCM + 1 PLL) Maximum Single-Ended I/O Maximum Differential I/O Pairs DSP Slices PCIe® Gen2(1) Analog Mixed Signal (AMS) / XADC Configuration AES / HMAC Blocks GTP Transceivers (6.6 Gb/s Max Rate)(2) Commercial Temp (C) Extended Temp (E) Industrial Temp (I) Package(3), (4) Dimensions Ball Pitch (mm) 171 20 720 3 150 72 40 1 1 1 2 XC7A15T 16,640 2,600 20,800 200 25 900 5 250 120 45 1 1 1 4 XC7A25T 23,360 3,650 29,200 313 45 1,620 XC7A35T 33,280 5,200 41,600 400 50 1,800 3 150 72 80 1 1 1 4 5 250 120 90 1 1 1 4 XC7A50T 52,160 8,150 65,200 XC7A75T 75,520 11,800 94,400 XC7A100T 101,440 15,850 126,800 600 75 2,700 5 250 120 120 1 1 1 4 892 105 3,780 6 300 144 180 1 1 1 8 1,188 135 4,860 6 300 144 240 1 1 1 8 XC7A200T 215,360 33,650 269,200 2,888 365 13,140 10 500 240 740 1 1 1 16 -1, -2 -2L, -3 -1, -2 -2L, -3 -1, -2 -2L, -3 -1, -2 -2L, -3 -1, -2 -2L, -3 -1, -2 -2L, -3 -1, -2 -2L, -3 -1, -2 -2L, -3 -1, -2, -1L -1, -2, -1L -1, -2, -1L -1, -2, -1L -1, -2, -1L -1, -2, -1L -1, -2, -1L -1, -2, -1L Available User I/O: 3.3V SelectIO™ HR I/O (GTP Transceivers) (mm) 0.5 0.5 0.8 0.8 1.0 0.8 1.0 1.0 1.0 1.0 1.0 106 (2) 112 (2) 150 (2) 112 (2) 150 (4) 106 (2) 106 (2) 210 (0) 150 (4) 170 (0) 10 x 10 10 x 10 15 x 15 15 x 15 17 x 17 19 x 19 23 x 23 23 x 23 27 x 27 27 x 27 35 x 35 CPG236 CPG238 CSG324 CSG325 FTG256 SBG484 FGG484(5) FBG484(5) FGG676(6) FBG676(6) FFG1156 Notes: 1. Supports PCI Express Base 2.1 specification at Gen1 and Gen2 data rates. 2. Represents the maximum number of transceivers available. Note that the majority of devices are available without transceivers. See the Package section of this table for details. 3. Leaded package option available for all packages. See DS180, 7 Series FPGAs Overview for package details. 4. Device migration is available within the Artix-7 family for like packages but is not supported between other 7 series families. 5. Devices in FGG484 and FBG484 are footprint compatible. 6. Devices in FGG676 and FBG676 are footprint compatible. 210 (0) 150 (4) 170 (0) 210 (0) 150 (4) 170 (0) 250 (4) 250 (4) 250 (4) 285 (4) 210 (0) 170 (0) 300 (8) 210 (0) 170 (0) 285 (4) 300 (8) 285 (4) 285 (4) 400 (8) 500 (16)
Kintex-7 FPGAs Optimized for Best Price-Performance (1.0V, 0.95V, 0.9V) — 10,250 65,600 82,000 838 135 4,860 6 300 144 240 1 1 1 8 -1, -2 -2L, -3 -1, -2 Part Number EasyPath™ Cost Reduction Solutions(1) Slices Logic Cells CLB Flip-Flops Maximum Distributed RAM (Kb) Block RAM/FIFO w/ ECC (36 Kb each) Total Block RAM (Kb) CMTs (1 MMCM + 1 PLL) Maximum Single-Ended I/O Maximum Differential I/O Pairs DSP48 Slices PCIe® Gen2(2) Analog Mixed Signal (AMS) / XADC Configuration AES / HMAC Blocks GTX Transceivers (12.5 Gb/s Max Rate) Commercial Temp (C) Extended Temp (E) Industrial Temp (I) Package(3) FBG484(4) FBG676(4) FFG676 FBG900(4) FFG900 FFG901 FFG1156 Dimensions Ball Pitch (mm) 23 x 23 27 x 27 27 x 27 31 x 31 31 x 31 31 x 31 35 x 35 (mm) 1.0 1.0 1.0 1.0 1.0 1.0 1.0 Logic Resources Memory Resources Clock Resources I/O Resources Integrated IP Resources Speed Grades Footprint Compatible Footprint Compatible Page 4 XC7K70T XC7K160T XC7K325T XCE7K325T XC7K355T XCE7K355T XC7K410T XCE7K410T XC7K420T XCE7K420T XC7K480T XCE7K480T — 25,350 162,240 202,800 2,188 325 11,700 8 400 192 600 1 1 1 8 50,950 326,080 407,600 4,000 445 16,020 10 500 240 840 1 1 1 16 -1, -2 -2L, -3 -1, -2 -2L, -3 55,650 356,160 445,200 5,088 715 25,740 6 300 144 1,440 1 1 1 24 -1, -2 -2L, -3 63,550 406,720 508,400 5,663 795 28,620 10 500 240 1,540 1 1 1 16 -1, -2 -2L, -3 65,150 416,960 521,200 5,938 835 30,060 8 400 192 1,680 1 1 1 32 -1, -2 -2L, -3 74,650 477,760 597,200 6,788 955 34,380 8 400 192 1,920 1 1 1 32 -1, -2 -2L, -3 -1, -2, -2L -1, -2, -2L -1, -2, -2L -1, -2, -2L -1, -2, -2L -1, -2, -2L 185, 100 (4) 200, 100 (8) 185, 100 (4) 250, 150 (8) 250, 150 (8) Available User I/O: 3.3V HR I/O, 1.8V HP I/Os (GTX) 250, 150 (8) 250, 150 (8) 350, 150 (16) 350, 150 (16) 250, 150 (8) 250, 150 (8) 350, 150 (16) 350, 150 (16) 300, 0 (24) 380, 0 (28) 400, 0 (32) 380, 0 (28) 400, 0 (32) Notes: 1. 2. 3. 4. EasyPath™ solutions provide a fast and conversion-free path for cost reduction. Hard block supports PCI Express Base 2.1 specification at Gen1 and Gen2 data rates. Gen3 supported with soft IP. See DS180, 7 Series FPGAs Overview, for package details. GTX transceivers in FB packages support the following maximum data rates: 10.3Gb/s in FBG484; 6.6Gb/s in FBG676 and FBG900. See DS182, Kintex-7 FPGAs Data Sheet: DC and AC Switching Characteristics, for details.
Virtex-7 FPGAs Optimized for Highest System Performance and Capacity (1.0V) XC7V585T EasyPath™ Cost Reduction Solutions(1) XCE7V585T Part Number XC7VX330T XCE7VX330T XCE7VX415T XCE7VX485T XCE7VX550T XCE7VX690T XCE7VX980T XC7VX415T XC7VX690T XC7VX485T XC7VX550T XC7VX980T XC7VX1140T XC7VH580T XC7V2000T — 305,400 1,954,560 2,443,200 21,550 1,292 46,512 24 1,200 576 2,160 4 — 1 1 36 — — 91,050 582,720 728,400 6,938 795 28,620 18 850 408 1,260 3 — 1 1 36 — — 51,000 326,400 408,000 4,388 750 27,000 14 700 336 1,120 — 2 1 1 — 28 — 64,400 412,160 515,200 6,525 880 31,680 12 600 288 2,160 — 2 1 1 — 48 — 75,900 485,760 607,200 8,175 1,030 37,080 14 700 336 2,800 4 — 1 1 56 — — 86,600 554,240 692,800 8,725 1,180 42,480 20 600 288 2,880 — 2 1 1 — 80 — 108,300 693,120 866,400 10,888 1,470 52,920 20 1,000 480 3,600 — 3 1 1 — 80 — 153,000 979,200 1,224,000 13,838 1,500 54,000 18 900 432 3,600 — 3 1 1 — 72 — -1, -2 -2L -1 — 178,000 1,139,200 1,424,000 17,700 1,880 67,680 24 1,100 528 3,360 — 4 1 1 — 96 — -1, -2 -2L, -2G -1 — 90,700 580,480 725,600 8,850 940 33,840 12 600 288 1,680 — 2 1 1 — 48 8 XC7VH870T — 136,900 876,160 1,095,200 13,275 1,410 50,760 18 300 144 2,520 — 3 1 1 — 72 16 -1, -2 -2L, -2G — -1, -2 -2L, -2G — 1.8V HP I/O (GTH, GTZ) 400 (24, 8) 600 (48, 8) 300 (72, 16) Logic Resources Memory Resources Clocking I/O Resources Integrated IP Resources Speed Grades Footprint Compatible Footprint Compatible Footprint Compatible Footprint Compatible Slices Logic Cells CLB Flip-Flops Maximum Distributed RAM (Kb) Block RAM/FIFO w/ ECC (36 Kb each) Total Block RAM (Kb) CMTs (1 MMCM + 1 PLL) Maximum Single-Ended I/O Maximum Differential I/O Pairs DSP Slices PCIe® Gen2(2) PCIe Gen3 Analog Mixed Signal (AMS) / XADC Configuration AES / HMAC Blocks GTX Transceivers (12.5 Gb/s Max Rate)(3) GTH Transceivers (13.1 Gb/s Max Rate)(4) GTZ Transceivers ( 28.05 Gb/s Max Rate) Commercial Temp (C) Extended Temp (E)(5) Industrial Temp (I) Dimensions Ball Pitch Package(6) (mm) 35 x 35 FFG1157(7) FFG1761(7) 42.5 x 42.5 FHG1761 FLG1925 FFG1158(7) FFG1926 FLG1926 FFG1927(7) FFG1928 FLG1928 FFG1930 FLG1930 FLG1155 FLG1931 FLG1932 45 x 45 45 x 45 35 x 35 45 x 45 45 x 45 45 x 45 45 x 45 45 x 45 45 x 45 45 x 45 35 x 35 45 x 45 45 x 45 (mm) 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 -1, -2 -2L, -3 -1, -2 -1, -2 -2L, -2G -1 -1, -2 -2L, -3 -1, -2 -1, -2 -2L, -3 -1, -2 -1, -2 -2L, -3 -1, -2 -1, -2 -2L, -3 -1, -2 -1, -2 -2L, -3 -1, -2 Available User I/O: 3.3V HR I/O, 1.8V HP I/Os (GTX, GTH) 0, 600 (20, 0) 100, 750 (36, 0) 0, 600 (0, 20) 0, 600 (0, 20) 0, 600 (20, 0) 50, 650 (0, 28) 0, 700 (28, 0) 0, 600 (0, 20) 0, 850 (0, 36) 0, 850 (36, 0) 0, 1200 (16, 0) 0, 350 (0, 48) 0, 350 (48, 0) 0, 350 (0, 48) 0, 350 (0, 48) 0, 720 (0, 64) 0, 720 (0, 64) 0, 600 (0, 48) 0, 600 (56, 0) 0, 600 (0, 80) 0, 600 (0, 80) 0, 480 (0, 72) 0, 700 (24, 0) 0, 1000 (0, 24) 0, 900 (0, 24) 0, 720 (0, 64) 0, 480 (0, 96) 0, 1100 (0, 24) Notes: 1. EasyPath™ solutions provide a fast and conversion-free path for cost reduction. 2. Hard block supports PCI Express Base 2.1 specification at Gen1 and Gen2 data rates. Gen3 supported with soft IP. 3. 12.5 Gb/s support in "-3E", "-2GE" speed/temperature grade; 10.3125 Gb/s support in "2C", "-2LE", and "-2I" speed grade. 4. 13.1 Gb/s support in "-3E". "-2GE" speed grade; 11.3 Gb/s support in "2C" , "-2LE" and "-2I" speed/temperature grades. 5. -2G only applies to Stacked Silicon Interconnect devices and supports 12.5G GTX, 13.1G GTH, 28.05G GTZ with -2 fabric. 6. Leaded package options ("FFxxxx"/"FLxxxx"/"FHxxxx") available for all packages. "HCxxxx" is not offered in a leaded option. 7. See DS180, 7 Series FPGAs Overview for package details. Page 5
Device Ordering Information XC 7 S ### -1 FG G A 484 C Commercial Generation Family Xilinx Logic Cells In 1K units Speed Grade -1 = Slowest -L1 = Low Power -2 = Mid Package Type G: RoHS 6/6 CP: Wire-bond (.5 mm) CS: Wire-bond (.8 mm) FG: Wire-bond (1 mm) FT: Wire-bond (1 mm) Package Designator Package Pin Count Temperature Grade (C, I, Q) XC 7 A ### -1 FB G 484 C Xilinx Generation Family Commercial Logic Cells in 1K Units Speed Grade -1 = Slowest -L1 = Low Power -L2 = Low Power -2 = Mid -3 = Highest Package Type CP: Wire-bond (.5 mm) CS: Wire-bond (.8 mm) V: RoHS 6/6 G: RoHS 6/6 w/Exemption 15 Nominal Package Pin Count Temperature Grade (C, E, I) FB: Bare-Die Flip-Chip (1 mm) FF: Flip-Chip (1 mm) FG: Wire-bond (1 mm) FT: Wire-bond (1 mm) SB: Bare-Die Flip-Chip (.8 mm) XC 7 K ### -1 FF G Xilinx Generation Family Commercial Logic Cells in 1K Units Package Type FB: Bare-Die Flip-Chip (1 mm) V: RoHS 6/6 G: RoHS 6/6 FF: Flip-Chip (1 mm) w/Exemption 15 Speed Grade -1 = Slowest -L2 = Low Power -2 = Mid -3 = Highest XC 7 V ### -1 FF G Notes: -L1 is the ordering code for the lower power, -1L speed grade. -L2 is the ordering code for the lower power, -2L speed grade. Commercial Xilinx Generation Family Logic Cells in 1K Units Speed Grade -1 = Slowest -2 = Mid -L2 = Low Power -3 = Highest Package Type FF: Flip-Chip (1 mm) FH: Flip-Chip (1 mm) FL: Flip-Chip (1 mm) V: RoHS 6/6 G: RoHS 6/6 w/Exemption 15 HC: Ceramic Flip-Chip (1 mm) C = Commercial (Tj = 0°C to +85°C) E = Extended (Tj = 0°C to +100°C) I = Industrial (Tj = –40°C to +100°C) Q = Expanded (Tj = –40°C to +125°C) Page 6 900 Nominal Package Pin Count C Temperature Grade (C, E, I) 1156 Nominal Package Pin Count C Temperature Grade (C, E, I)
Digital Signal Processing Metrics DSP Slice Count 10 20 80 120 140 160 40 45 80 90 120 180 240 240 740 600 840 XC7S6 XC7S15 XC7S25 XC7S50 XC7S75 XC7S100 XC7A12T XC7A15T XC7A25T XC7A35T XC7A50T XC7A75T XC7A100T XC7A200T XC7K70T XC7K160T XC7K325T XC7K355T XC7K410T XC7K420T XC7K480T XC7V585T XC7V2000T XC7VX330T XC7VX415T XC7VX485T XC7VX550T XC7VX690T XC7VX980T XC7VX1140T XC7VH580T XC7VH870T Spartan®-7 FPGAs Speed grade FMAX [MHz] Max GMAC/s Artix®-7 FPGAs Speed grade FMAX [MHz] Max GMAC/s Kintex®-7 FPGAs Speed grade FMAX [MHz] Max GMAC/s Virtex®-7 FPGAs Speed grade FMAX [MHz] Max GMAC/s -1 464 148 -1 464 686 -2 550 176 -2 550 814 -3 628 929 -1 464 1,781 -2 550 2,112 -3 741 2,845 -1 547 2,756 -2 650 3,276 -3 741 3,734 1440 1540 1680 1920 1260 1120 2160 2160 2800 5760 3600 3600 3360 1680 2520 For more information, refer to: UG479, 7 Series FPGAs DSP48E1 Slice User Guide Important: Verify all data in this document with the device data sheets found at www.xilinx.com Page 7
Block RAM Metrics XC7S6 XC7S15 XC7S25 XC7S50 XC7S75 XC7S100 XC7A12T XC7A15T XC7A25T XC7A35T XC7A50T XC7A75T XC7A100T XC7A200T XC7K70T XC7K160T XC7K325T XC7K355T XC7K410T XC7K420T XC7K480T XC7V585T XC7V2000T XC7VX330T XC7VX415T XC7VX485T XC7VX550T XC7VX690T XC7VX980T XC7VX1140T XC7VH580T XC7VH870T Block RAM Capacity (Mb) 180 360 1620 2700 3240 4320 720 900 1620 1800 2700 3780 4860 4860 13140 11700 16020 Spartan-7 FPGAs Speed grade True dual-port Block RAM FMAX [MHz] Artix-7 FPGAs Speed grade True dual-port Block RAM FMAX [MHz] Kintex-7 and Virtex-7 FPGAs -1 388 -1 388 -2 461 -2 461 -3 509 Speed grade True dual-port Block RAM FMAX [MHz] -1 458 -2 544 -3 601 25740 28620 30060 34380 28620 27000 46512 31680 37080 42480 33840 52920 54000 67680 50760 Page 8 For more information, refer to: UG473, 7 Series FPGAs Memory Resources User Guide Important: Verify all data in this document with the device data sheets found at www.xilinx.com
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