Spartan-7 FPGAs
Logic Resources
Memory Resources
Clock Resources
I/O Resources
Embedded Hard IP
Resources
Speed Grades
Part Number
Logic Cells
Slices
CLB Flip-Flops
Max. Distributed RAM (Kb)
Block RAM/FIFO w/ ECC (36 Kb each)
Total Block RAM (Kb)
Clock Mgmt Tiles (1 MMCM + 1 PLL)
Max. Single-Ended I/O Pins
Max. Differential I/O Pairs
DSP Slices
Analog Mixed Signal (AMS) / XADC
Configuration AES / HMAC Blocks
Commercial Temp (C)
Industrial Temp (I)
Expanded Temp (Q)
Body Area
Ball Pitch
Package(1)
CPGA196
CSGA225
CSGA324
FTGB196
FGGA484
FGGA676
(mm)
8x8
13x13
15x15
15x15
23x23
27x27
(mm)
0.5
0.8
0.8
1.0
1.0
1.0
I/O Optimization at the Lowest Cost and Highest Performance-per-Watt
(1.0V, 0.95V)
XC7S6
6,000
938
7,500
70
5
180
2
100
48
10
0
0
XC7S15
12,800
2,000
16,000
150
10
360
2
100
48
20
0
0
XC7S25
23,360
3,650
29,200
313
45
1,620
3
150
72
80
1
1
XC7S50
52,160
8,150
65,200
600
75
2,700
5
250
120
120
1
1
XC7S75
76,800
12,000
96,000
832
90
3,240
8
400
192
140
1
1
XC7S100
102,400
16,000
128,000
1,100
120
4,320
8
400
192
160
1
1
-1,-2
-1,-2,-1L
-1
-1,-2
-1,-2,-1L
-1
-1,-2
-1,-2,-1L
-1
-1,-2
-1,-2,-1L
-1
-1,-2
-1,-2,-1L
-1
-1,-2
-1,-2,-1L
-1
Available User I/O: 3.3V SelectIO™ HR I/O
100
100
100
100
100
100
150
150
100
210
100
250
338
400
338
400
Notes:
1.
Packages with the same last letter and number sequence, e.g., A484, are footprint compatible with all other Spartan-7 devices with the same sequence. The footprint compatible devices within this family are outlined.
Page 2
Artix-7 FPGAs
Transceiver Optimization at the Lowest Cost and Highest DSP Bandwidth
(1.0V, 0.95V, 0.9V)
Logic
Resources
Memory
Resources
Clock Resources
I/O Resources
Embedded
Hard IP
Resources
Speed Grades
Footprint
Compatible
Footprint
Compatible
Page 3
Part Number XC7A12T
12,800
2,000
16,000
Logic Cells
Slices
CLB Flip-Flops
Maximum Distributed RAM (Kb)
Block RAM/FIFO w/ ECC (36 Kb each)
Total Block RAM (Kb)
CMTs (1 MMCM + 1 PLL)
Maximum Single-Ended I/O
Maximum Differential I/O Pairs
DSP Slices
PCIe® Gen2(1)
Analog Mixed Signal (AMS) / XADC
Configuration AES / HMAC Blocks
GTP Transceivers (6.6 Gb/s Max
Rate)(2)
Commercial Temp (C)
Extended Temp (E)
Industrial Temp (I)
Package(3), (4)
Dimensions
Ball Pitch
(mm)
171
20
720
3
150
72
40
1
1
1
2
XC7A15T
16,640
2,600
20,800
200
25
900
5
250
120
45
1
1
1
4
XC7A25T
23,360
3,650
29,200
313
45
1,620
XC7A35T
33,280
5,200
41,600
400
50
1,800
3
150
72
80
1
1
1
4
5
250
120
90
1
1
1
4
XC7A50T
52,160
8,150
65,200
XC7A75T
75,520
11,800
94,400
XC7A100T
101,440
15,850
126,800
600
75
2,700
5
250
120
120
1
1
1
4
892
105
3,780
6
300
144
180
1
1
1
8
1,188
135
4,860
6
300
144
240
1
1
1
8
XC7A200T
215,360
33,650
269,200
2,888
365
13,140
10
500
240
740
1
1
1
16
-1, -2
-2L, -3
-1, -2
-2L, -3
-1, -2
-2L, -3
-1, -2
-2L, -3
-1, -2
-2L, -3
-1, -2
-2L, -3
-1, -2
-2L, -3
-1, -2
-2L, -3
-1, -2, -1L
-1, -2, -1L
-1, -2, -1L
-1, -2, -1L
-1, -2, -1L
-1, -2, -1L
-1, -2, -1L
-1, -2, -1L
Available User I/O: 3.3V SelectIO™ HR I/O (GTP Transceivers)
(mm)
0.5
0.5
0.8
0.8
1.0
0.8
1.0
1.0
1.0
1.0
1.0
106 (2)
112 (2)
150 (2)
112 (2)
150 (4)
106 (2)
106 (2)
210 (0)
150 (4)
170 (0)
10 x 10
10 x 10
15 x 15
15 x 15
17 x 17
19 x 19
23 x 23
23 x 23
27 x 27
27 x 27
35 x 35
CPG236
CPG238
CSG324
CSG325
FTG256
SBG484
FGG484(5)
FBG484(5)
FGG676(6)
FBG676(6)
FFG1156
Notes:
1. Supports PCI Express Base 2.1 specification at Gen1 and Gen2 data rates.
2. Represents the maximum number of transceivers available. Note that the majority of devices are available without transceivers. See the Package section of this table for details.
3. Leaded package option available for all packages. See DS180, 7 Series FPGAs Overview for package details.
4. Device migration is available within the Artix-7 family for like packages but is not supported between other 7 series families.
5. Devices in FGG484 and FBG484 are footprint compatible.
6. Devices in FGG676 and FBG676 are footprint compatible.
210 (0)
150 (4)
170 (0)
210 (0)
150 (4)
170 (0)
250 (4)
250 (4)
250 (4)
285 (4)
210 (0)
170 (0)
300 (8)
210 (0)
170 (0)
285 (4)
300 (8)
285 (4)
285 (4)
400 (8)
500 (16)
Kintex-7 FPGAs
Optimized for Best Price-Performance
(1.0V, 0.95V, 0.9V)
—
10,250
65,600
82,000
838
135
4,860
6
300
144
240
1
1
1
8
-1, -2
-2L, -3
-1, -2
Part Number
EasyPath™ Cost Reduction Solutions(1)
Slices
Logic Cells
CLB Flip-Flops
Maximum Distributed RAM (Kb)
Block RAM/FIFO w/ ECC (36 Kb each)
Total Block RAM (Kb)
CMTs (1 MMCM + 1 PLL)
Maximum Single-Ended I/O
Maximum Differential I/O Pairs
DSP48 Slices
PCIe® Gen2(2)
Analog Mixed Signal (AMS) / XADC
Configuration AES / HMAC Blocks
GTX Transceivers (12.5 Gb/s Max Rate)
Commercial Temp (C)
Extended Temp (E)
Industrial Temp (I)
Package(3)
FBG484(4)
FBG676(4)
FFG676
FBG900(4)
FFG900
FFG901
FFG1156
Dimensions
Ball Pitch
(mm)
23 x 23
27 x 27
27 x 27
31 x 31
31 x 31
31 x 31
35 x 35
(mm)
1.0
1.0
1.0
1.0
1.0
1.0
1.0
Logic Resources
Memory
Resources
Clock Resources
I/O Resources
Integrated IP
Resources
Speed Grades
Footprint
Compatible
Footprint
Compatible
Page 4
XC7K70T
XC7K160T
XC7K325T
XCE7K325T
XC7K355T
XCE7K355T
XC7K410T
XCE7K410T
XC7K420T
XCE7K420T
XC7K480T
XCE7K480T
—
25,350
162,240
202,800
2,188
325
11,700
8
400
192
600
1
1
1
8
50,950
326,080
407,600
4,000
445
16,020
10
500
240
840
1
1
1
16
-1, -2
-2L, -3
-1, -2
-2L, -3
55,650
356,160
445,200
5,088
715
25,740
6
300
144
1,440
1
1
1
24
-1, -2
-2L, -3
63,550
406,720
508,400
5,663
795
28,620
10
500
240
1,540
1
1
1
16
-1, -2
-2L, -3
65,150
416,960
521,200
5,938
835
30,060
8
400
192
1,680
1
1
1
32
-1, -2
-2L, -3
74,650
477,760
597,200
6,788
955
34,380
8
400
192
1,920
1
1
1
32
-1, -2
-2L, -3
-1, -2, -2L
-1, -2, -2L
-1, -2, -2L
-1, -2, -2L
-1, -2, -2L
-1, -2, -2L
185, 100 (4)
200, 100 (8)
185, 100 (4)
250, 150 (8)
250, 150 (8)
Available User I/O: 3.3V HR I/O, 1.8V HP I/Os (GTX)
250, 150 (8)
250, 150 (8)
350, 150 (16)
350, 150 (16)
250, 150 (8)
250, 150 (8)
350, 150 (16)
350, 150 (16)
300, 0 (24)
380, 0 (28)
400, 0 (32)
380, 0 (28)
400, 0 (32)
Notes:
1.
2.
3.
4.
EasyPath™ solutions provide a fast and conversion-free path for cost reduction.
Hard block supports PCI Express Base 2.1 specification at Gen1 and Gen2 data rates. Gen3 supported with soft IP.
See DS180, 7 Series FPGAs Overview, for package details.
GTX transceivers in FB packages support the following maximum data rates: 10.3Gb/s in FBG484; 6.6Gb/s in FBG676 and FBG900. See DS182, Kintex-7 FPGAs Data Sheet: DC and AC
Switching Characteristics, for details.
Virtex-7 FPGAs
Optimized for Highest System Performance and Capacity
(1.0V)
XC7V585T
EasyPath™ Cost Reduction Solutions(1) XCE7V585T
Part Number
XC7VX330T
XCE7VX330T XCE7VX415T XCE7VX485T XCE7VX550T XCE7VX690T XCE7VX980T
XC7VX415T
XC7VX690T
XC7VX485T
XC7VX550T
XC7VX980T XC7VX1140T XC7VH580T
XC7V2000T
—
305,400
1,954,560
2,443,200
21,550
1,292
46,512
24
1,200
576
2,160
4
—
1
1
36
—
—
91,050
582,720
728,400
6,938
795
28,620
18
850
408
1,260
3
—
1
1
36
—
—
51,000
326,400
408,000
4,388
750
27,000
14
700
336
1,120
—
2
1
1
—
28
—
64,400
412,160
515,200
6,525
880
31,680
12
600
288
2,160
—
2
1
1
—
48
—
75,900
485,760
607,200
8,175
1,030
37,080
14
700
336
2,800
4
—
1
1
56
—
—
86,600
554,240
692,800
8,725
1,180
42,480
20
600
288
2,880
—
2
1
1
—
80
—
108,300
693,120
866,400
10,888
1,470
52,920
20
1,000
480
3,600
—
3
1
1
—
80
—
153,000
979,200
1,224,000
13,838
1,500
54,000
18
900
432
3,600
—
3
1
1
—
72
—
-1, -2
-2L
-1
—
178,000
1,139,200
1,424,000
17,700
1,880
67,680
24
1,100
528
3,360
—
4
1
1
—
96
—
-1, -2
-2L, -2G
-1
—
90,700
580,480
725,600
8,850
940
33,840
12
600
288
1,680
—
2
1
1
—
48
8
XC7VH870T
—
136,900
876,160
1,095,200
13,275
1,410
50,760
18
300
144
2,520
—
3
1
1
—
72
16
-1, -2
-2L, -2G
—
-1, -2
-2L, -2G
—
1.8V HP I/O (GTH, GTZ)
400 (24, 8)
600 (48, 8)
300 (72, 16)
Logic
Resources
Memory
Resources
Clocking
I/O
Resources
Integrated IP
Resources
Speed
Grades
Footprint
Compatible
Footprint
Compatible
Footprint
Compatible
Footprint
Compatible
Slices
Logic Cells
CLB Flip-Flops
Maximum Distributed RAM (Kb)
Block RAM/FIFO w/ ECC (36 Kb each)
Total Block RAM (Kb)
CMTs (1 MMCM + 1 PLL)
Maximum Single-Ended I/O
Maximum Differential I/O Pairs
DSP Slices
PCIe® Gen2(2)
PCIe Gen3
Analog Mixed Signal (AMS) / XADC
Configuration AES / HMAC Blocks
GTX Transceivers (12.5 Gb/s Max Rate)(3)
GTH Transceivers (13.1 Gb/s Max Rate)(4)
GTZ Transceivers ( 28.05 Gb/s Max Rate)
Commercial Temp (C)
Extended Temp (E)(5)
Industrial Temp (I)
Dimensions
Ball Pitch
Package(6)
(mm)
35 x 35
FFG1157(7)
FFG1761(7) 42.5 x 42.5
FHG1761
FLG1925
FFG1158(7)
FFG1926
FLG1926
FFG1927(7)
FFG1928
FLG1928
FFG1930
FLG1930
FLG1155
FLG1931
FLG1932
45 x 45
45 x 45
35 x 35
45 x 45
45 x 45
45 x 45
45 x 45
45 x 45
45 x 45
45 x 45
35 x 35
45 x 45
45 x 45
(mm)
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
-1, -2
-2L, -3
-1, -2
-1, -2
-2L, -2G
-1
-1, -2
-2L, -3
-1, -2
-1, -2
-2L, -3
-1, -2
-1, -2
-2L, -3
-1, -2
-1, -2
-2L, -3
-1, -2
-1, -2
-2L, -3
-1, -2
Available User I/O: 3.3V HR I/O, 1.8V HP I/Os (GTX, GTH)
0, 600 (20, 0)
100, 750 (36, 0)
0, 600 (0, 20) 0, 600 (0, 20) 0, 600 (20, 0)
50, 650 (0, 28)
0, 700 (28, 0)
0, 600 (0, 20)
0, 850 (0, 36)
0, 850 (36, 0)
0, 1200 (16, 0)
0, 350 (0, 48) 0, 350 (48, 0) 0, 350 (0, 48) 0, 350 (0, 48)
0, 720 (0, 64) 0, 720 (0, 64)
0, 600 (0, 48) 0, 600 (56, 0) 0, 600 (0, 80) 0, 600 (0, 80)
0, 480 (0, 72)
0, 700 (24, 0)
0, 1000 (0, 24) 0, 900 (0, 24)
0, 720 (0, 64)
0, 480 (0, 96)
0, 1100 (0, 24)
Notes:
1. EasyPath™ solutions provide a fast and conversion-free path for cost reduction.
2. Hard block supports PCI Express Base 2.1 specification at Gen1 and Gen2 data rates. Gen3 supported with soft IP.
3. 12.5 Gb/s support in "-3E", "-2GE" speed/temperature grade; 10.3125 Gb/s support in "2C", "-2LE", and "-2I" speed grade.
4. 13.1 Gb/s support in "-3E". "-2GE" speed grade; 11.3 Gb/s support in "2C" , "-2LE" and "-2I" speed/temperature grades.
5. -2G only applies to Stacked Silicon Interconnect devices and supports 12.5G GTX,
13.1G GTH, 28.05G GTZ with -2 fabric.
6. Leaded package options ("FFxxxx"/"FLxxxx"/"FHxxxx") available for all packages.
"HCxxxx" is not offered in a leaded option.
7. See DS180, 7 Series FPGAs Overview for package details.
Page 5
Device Ordering Information
XC
7
S
###
-1
FG
G
A
484
C
Commercial
Generation
Family
Xilinx
Logic Cells
In 1K units
Speed Grade
-1 = Slowest
-L1 = Low Power
-2 = Mid
Package Type
G: RoHS 6/6
CP: Wire-bond (.5 mm)
CS: Wire-bond (.8 mm)
FG: Wire-bond (1 mm)
FT: Wire-bond (1 mm)
Package
Designator
Package
Pin Count
Temperature
Grade
(C, I, Q)
XC
7
A
###
-1
FB
G
484
C
Xilinx
Generation
Family
Commercial
Logic Cells
in 1K Units
Speed Grade
-1 = Slowest
-L1 = Low Power
-L2 = Low Power
-2 = Mid
-3 = Highest
Package Type
CP: Wire-bond (.5 mm)
CS: Wire-bond (.8 mm)
V: RoHS 6/6
G: RoHS 6/6
w/Exemption 15
Nominal
Package
Pin Count
Temperature
Grade
(C, E, I)
FB: Bare-Die Flip-Chip (1 mm)
FF: Flip-Chip (1 mm)
FG: Wire-bond (1 mm)
FT: Wire-bond (1 mm)
SB: Bare-Die Flip-Chip (.8 mm)
XC
7
K
###
-1
FF
G
Xilinx
Generation
Family
Commercial
Logic Cells
in 1K Units
Package Type
FB: Bare-Die Flip-Chip (1 mm)
V: RoHS 6/6
G: RoHS 6/6
FF: Flip-Chip (1 mm)
w/Exemption 15
Speed Grade
-1 = Slowest
-L2 = Low Power
-2 = Mid
-3 = Highest
XC
7
V
###
-1
FF
G
Notes:
-L1 is the ordering code for the lower power, -1L speed grade.
-L2 is the ordering code for the lower power, -2L speed grade.
Commercial
Xilinx
Generation
Family
Logic Cells
in 1K Units
Speed Grade
-1 = Slowest
-2 = Mid
-L2 = Low Power
-3 = Highest
Package Type
FF: Flip-Chip (1 mm)
FH: Flip-Chip (1 mm)
FL: Flip-Chip (1 mm)
V: RoHS 6/6
G: RoHS 6/6
w/Exemption 15
HC: Ceramic Flip-Chip (1 mm)
C = Commercial (Tj = 0°C to +85°C) E = Extended (Tj = 0°C to +100°C) I = Industrial (Tj = –40°C to +100°C) Q = Expanded (Tj = –40°C to +125°C)
Page 6
900
Nominal
Package
Pin Count
C
Temperature
Grade
(C, E, I)
1156
Nominal
Package
Pin Count
C
Temperature
Grade
(C, E, I)
Digital Signal Processing Metrics
DSP Slice Count
10
20
80
120
140
160
40
45
80
90
120
180
240
240
740
600
840
XC7S6
XC7S15
XC7S25
XC7S50
XC7S75
XC7S100
XC7A12T
XC7A15T
XC7A25T
XC7A35T
XC7A50T
XC7A75T
XC7A100T
XC7A200T
XC7K70T
XC7K160T
XC7K325T
XC7K355T
XC7K410T
XC7K420T
XC7K480T
XC7V585T
XC7V2000T
XC7VX330T
XC7VX415T
XC7VX485T
XC7VX550T
XC7VX690T
XC7VX980T
XC7VX1140T
XC7VH580T
XC7VH870T
Spartan®-7 FPGAs
Speed grade
FMAX [MHz]
Max GMAC/s
Artix®-7 FPGAs
Speed grade
FMAX [MHz]
Max GMAC/s
Kintex®-7 FPGAs
Speed grade
FMAX [MHz]
Max GMAC/s
Virtex®-7 FPGAs
Speed grade
FMAX [MHz]
Max GMAC/s
-1
464
148
-1
464
686
-2
550
176
-2
550
814
-3
628
929
-1
464
1,781
-2
550
2,112
-3
741
2,845
-1
547
2,756
-2
650
3,276
-3
741
3,734
1440
1540
1680
1920
1260
1120
2160
2160
2800
5760
3600
3600
3360
1680
2520
For more information, refer to: UG479, 7 Series FPGAs DSP48E1 Slice User Guide
Important: Verify all data in this document with the device data sheets found at www.xilinx.com
Page 7
Block RAM Metrics
XC7S6
XC7S15
XC7S25
XC7S50
XC7S75
XC7S100
XC7A12T
XC7A15T
XC7A25T
XC7A35T
XC7A50T
XC7A75T
XC7A100T
XC7A200T
XC7K70T
XC7K160T
XC7K325T
XC7K355T
XC7K410T
XC7K420T
XC7K480T
XC7V585T
XC7V2000T
XC7VX330T
XC7VX415T
XC7VX485T
XC7VX550T
XC7VX690T
XC7VX980T
XC7VX1140T
XC7VH580T
XC7VH870T
Block RAM Capacity (Mb)
180
360
1620
2700
3240
4320
720
900
1620
1800
2700
3780
4860
4860
13140
11700
16020
Spartan-7 FPGAs
Speed grade
True dual-port Block RAM FMAX [MHz]
Artix-7 FPGAs
Speed grade
True dual-port Block RAM FMAX [MHz]
Kintex-7 and Virtex-7 FPGAs
-1
388
-1
388
-2
461
-2
461
-3
509
Speed grade
True dual-port Block RAM FMAX [MHz]
-1
458
-2
544
-3
601
25740
28620
30060
34380
28620
27000
46512
31680
37080
42480
33840
52920
54000
67680
50760
Page 8
For more information, refer to: UG473, 7 Series FPGAs Memory Resources User Guide
Important: Verify all data in this document with the device data sheets found at www.xilinx.com