PMC规范(IEEE Std 1386.1 2001).pdf

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IEEE Std 1386.1-2001 IEEE Standard Physical and Environmental Layers for PCI Mezzanine Cards (PMC) Sponsor Microprocessor and Microcomputer Standards Committee (MMSC) of the IEEE Computer Society Approved 14 June 2001 IEEE-SA Standards Board Abstract: This standard, in conjunction with IEEE Std 1386-2001, IEEE Standard for a Common Mezzanine Card (CMC) Family, defines the physical and environmental layers of a PCI mezzanine card (PMC) family to be usable on (but not limited to) single slot VME, VME64 and VME64x boards, CompactPCI boards, Multibus I and Multibus II boards, desktop computers, portable computers, servers, and similar types of applications. The electrical and logical layers are based on the PCI specification from the PCI Special Interest Group. The PCI mezzanine cards allow for a variety of optional function expansions for the host system. lío functionality from the PMC may be either through the mezzanine front panel, or via the backplane by routing the lío signals through the mezzanine connector to the host. Keywords: backplane lío, bezel, board, card, CompactPCI, face plate, front panel lío, metric, host computer, lío, local bus, mezzanine, module, modular lío, PCI, Multibus I, Multibus Il, VME, VME64, VME64x, VMEbus The Institute of Electrical and Electronics Engineers, Inc 3 Park Avenue, New York, NY 10016-5997, USA Copyright O 2001 by the Institute of Electrical and Electronics Engineers, Inc. All rights reserved. Published 20 August 2001. Printed in the United States of America. Print: PDF: ISBN 0-7381 -2830-9 SH94923 ISBN 0-7381 -2831 -7 SS94923 No part of this publication may be reproduced in any form, in an electronic retrieval system or otherwise, without the prior written permission of the publisher. Copyright The Institute of Electrical and Electronics Engineers, Inc. Provided by IHS under license with IEEELicensee=IHS Employees/1111111001, User=Wing, BernieNot for Resale, 07/11/2007 00:20:19 MDTNo reproduction or networking permitted without license from IHS--`,,`,,`,,,,,`,,,```,,`,,,,``-`-`,,`,,`,`,,`---

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Provided by IHS under license with IEEELicensee=IHS Employees/1111111001, User=Wing, BernieNot for Resale, 07/11/2007 00:20:19 MDTNo reproduction or networking permitted without license from IHS--`,,`,,`,,,,,`,,,```,,`,,,,``-`-`,,`,,`,`,,`---

In trod uct ion [This introduction is not part of IEEE Std 1386.1-2001, IEEE Standard Physical and Environmental Layers for PCI Mezzanine Cards (PMC).] This standard provides the specifications for implementing the PCI local bus between a host and mezzanine card, based on IEEE Std 1386-2001, for usage on VME64x boards, CompactPC1 boards, and Multibus I and Multibus II boards. PCI boards defined for the general personal computer market will not fit on these boards since they mount perpendicular on the host computer. This standard provides the necessary mechanical and environmental requirements for the use of PCI-based mezzanine cards in a large variety of low-profile appli- cations. PCI mezzanine cards can provide front bezel I/O, backplane I/O via the host, additional local host functions, or a combination of the three. Special thanks are due to Dave Moore, original P1386.1 Working Group Draft Editor, for the generation of the many drafts, and Rick Spratt, Cliff Lupien, Harry Parkinson, Chau Pham and Heinz Horstmeier for their contribution to development of this standard. Participants At the time this standard was completed, the Working Group for IEEE Std 1386.1-2001 had the following membership: Malcolm Airst Harry Andreas James Barnette Juergen Baumann Martin Blake Hans Brand Dave Brearley Gorky Chin Dick DeBock Ian Dobson Mike Hasenfratz Ryuji Hayasaka Roger Hinsdale Heinz Horstmeier Wayne Fischer, Chair Chau Pham, Vice Chair Dave Horton Anoto1 Kaganovich Gary Kidwell Jing Kowk Tom Kuleza Dees Lambreshtse Sang Dae Lee Cliff Lupien Knstian Martinson Jim Medeiros Robert McKee Dave Mendenhall David Moore Rob Noffke Joseph Norris The following members of the balloting committee voted on this standard: Malcolm Airst Edmund H. Baulsir Tom Bertram Janos Bin Michael L. Bradley John L. Cole Dante Del Corso Sourav K. Dutta Roger D. Edwards Wayne Fischer Clay E. Hudgins Lawrence Lamers Joseph R. Marshall Klaus-Dieter Mueller Joseph Norris Elwood Parsons Dave A. Perez Harry Parkinson Elwood Parsons Dave Rios John Rynearson Richard Spratt Nobuaki Sugiura Dennis Terry Russ Tuck Jim Turley Mark Vorenkannp Eike Waltz Dave Wickliff Bob Widlicka David Wright Gary S . Robinson Malcolm Rush John Rynearson Thomas J. Schaal Gary K. Sloane Hermann H. Strass Fred J. Strauss Michael G. Thompson Don Wright Copyright O 2001 IEEE. All rights reserved. ... 111 Copyright The Institute of Electrical and Electronics Engineers, Inc. Provided by IHS under license with IEEELicensee=IHS Employees/1111111001, User=Wing, BernieNot for Resale, 07/11/2007 00:20:19 MDTNo reproduction or networking permitted without license from IHS--`,,`,,`,,,,,`,,,```,,`,,,,``-`-`,,`,,`,`,,`---

When the IEEE-SA Standards Board approved this standard on 14 June 2001, it had the following membership: Donald N. Heirman, Chair James T. Carlo, Vice Chair Judith Gorman, Secretary James H. Gurney Richard J. Holleman Lowell G. Johnson Robert J. Kennelly Joseph L. Koepfinger* Peter H. Lips L. Bruce McClung Daleep C. Mohla James W. Moore Robert F. Munzner Ronald C. Petersen Gerald H. Peterson John B. Posey Gary S . Robinson Akio Tojo Donald W. Zipse Satish K. Aggarwal Mark D. Bowman Gary R. Engmann Harold E. Epstein H. Landis Floyd Jay Forster* Howard M. Frazier Ruben D. Garzon *Member Emeritus Also included is the following nonvoting IEEE-SA Standards Board liaison: Alan Cookson, NIST Representative Donald R. Volzka, TAB Representative Andrew D. Ickowicz IEEE Standards Project Editor CompactPCI@ and PICMG@ are registered trademarks of the PCI Industrial Computers Manufacturers Group. Multibus@ is a registered trademark of Intel Corporation. iv Copyright O 2001 IEEE. All rights reserved. Copyright The Institute of Electrical and Electronics Engineers, Inc. Provided by IHS under license with IEEELicensee=IHS Employees/1111111001, User=Wing, BernieNot for Resale, 07/11/2007 00:20:19 MDTNo reproduction or networking permitted without license from IHS--`,,`,,`,,,,,`,,,```,,`,,,,``-`-`,,`,,`,`,,`---

Contents 1 . Overview .............................................................................................................................................. 1.1 Scope ............................................................................................................................................ 1.2 Purpose ......................................................................................................................................... 1.3 General arrangement .................................................................................................................... 1.4 Dimensions .................................................................................................................................. 2 . 3 . References ............................................................................................................................................ Definitions ............................................................................................................................................ 3.1 Special word usage ...................................................................................................................... 4 . Mechanics and compliance .................................................................................................................. 1 1 1 1 2 2 3 3 3 4.1 4.2 4.3 4.4 4.5 4.6 4.7 4.8 Conformance ................................................................................................................................ 3 PMC voltage keying .................................................................................................................... 3 Connector configurations ............................................................................................................. 3 Power consumption. heat dissipation. and air flow ..................................................................... 3 Electromagnetic compatibility ..................................................................................................... 3 Shock and vibration ..................................................................................................................... 4 Environmental .............................................................................................................................. 4 Mean-time-between-failure (MTBF) ........................................................................................... 4 5 . Electrical and logical layer ................................................................................................................... 4 5.1 Connector utilization .................................................................................................................... 4 5.2 PMC connector pin assignment ................................................................................................... 4 5.3 Comparison of pin usage. PCI to PMC ........................................................................................ 7 5.4 Mapping of PCI reserve pins ....................................................................................................... 7 Copyright O 2001 IEEE . All rights reserved . V Copyright The Institute of Electrical and Electronics Engineers, Inc. Provided by IHS under license with IEEELicensee=IHS Employees/1111111001, User=Wing, BernieNot for Resale, 07/11/2007 00:20:19 MDTNo reproduction or networking permitted without license from IHS--`,,`,,`,,,,,`,,,```,,`,,,,``-`-`,,`,,`,`,,`---

vi Copyright O 2001 IEEE. All rights reserved. Copyright The Institute of Electrical and Electronics Engineers, Inc. Provided by IHS under license with IEEELicensee=IHS Employees/1111111001, User=Wing, BernieNot for Resale, 07/11/2007 00:20:19 MDTNo reproduction or networking permitted without license from IHS--`,,`,,`,,,,,`,,,```,,`,,,,``-`-`,,`,,`,`,,`---

IEEE Standard Physical and Environmental Layers for PCI Mezzanine Cards (PMC) 1. Overview 1.1 Scope This standard defines a family of slim modular mezzanine cards for VME, VME64 and VME64x boards, CompactPCIB boards, MultibusB I and II boards, desktop computers, portable computers, servers, and other computer systems with the logical and electrical layers based on the Peripheral Component Interface (PCI) specification from the PCI Special Interest Group. The complete physical (mechanical) and environmental layers are specified within IEEE Std 1386-2001 .l 1.2 Purpose PCI is a high-speed local bus being used by a variety of microprocessors. The PCI specification defines mul- tiple board sizes that plug into computer mother boards in a perpendicular fashion. These perpendicular boards are not usable for low-profile computer applications. This standard defines the mechanics of a slim, modular, parallel mezzanine card family that uses the logical and electrical layers of the PCI specification for the local bus. I/O can be via the front bezel and/or through the connector to the host computer for back- plane I/O. Additional local functionality also can be provided by these mezzanine cards. 1.3 General arrangement PCI mezzanine cards (PMC) are intended to be used where slim, parallel board mounting is required such as in single board computer host modules with the addition of expander cards or option cards, as illustrated in Figure 1. The PMC may be mounted with instruments and panels that comply with the requirements of IEEE Std 1386-2001. For maximum utilization of component space, the mezzanine card is typically placed such that the major component side of the mezzanine card faces the major component side of the host board. 'Information on references can be found in Clause 2. Copyright O 2001 IEEE. All rights reserved. 1 Copyright The Institute of Electrical and Electronics Engineers, Inc. Provided by IHS under license with IEEELicensee=IHS Employees/1111111001, User=Wing, BernieNot for Resale, 07/11/2007 00:20:19 MDTNo reproduction or networking permitted without license from IHS--`,,`,,`,,,,,`,,,```,,`,,,,``-`-`,,`,,`,`,,`---

IEEE Std 1386.1-2001 1.4 Dimensions IEEE STANDARD PHYSICAL AND ENVIRONMENTAL All mechanical dimensions are specified in 1386-2001. All dimensions are in millimeters (mm). -FRONT PANEL Figure 1 -Typical PMC mounted to a host module 2. References The following publications are used in conjunction with this standard. When any of the referenced specifica- tions are superseded by an approved revision, that revision shall apply. IEEE Std 1386-2001, IEEE Standard Mechanics for a Common Mezzanine Card (CMC) Family2 PCI Local Bus Specification, Revision 2.2, 199S3 21EEE publications are available from the Institute of Electrical and Electronics Engineers, 445 Hoes Lane, P.O. Box 1331, Piscataway, NJ 08855-1331, USA (http://standards.ieee.org/). 3PCI specifications are available from PCI Special Interest Group (http://www.pcisig.com/). 2 Copyright O 2001 IEEE. All rights reserved. Copyright The Institute of Electrical and Electronics Engineers, Inc. Provided by IHS under license with IEEELicensee=IHS Employees/1111111001, User=Wing, BernieNot for Resale, 07/11/2007 00:20:19 MDTNo reproduction or networking permitted without license from IHS--`,,`,,`,,,,,`,,,```,,`,,,,``-`-`,,`,,`,`,,`---

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