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PCap官方数据手册.pdf
General Description
Key Benefits & Features
Applications MEMS Sensors
Block Diagram
Pin Assignments
Pin Description
Pad Coordinates
Absolute Maximum Ratings
Electrical Characteristics
CDC Characteristics
RDC Characteristics
Timing Characteristics
Detailed Description
Register Description
Configuration Registers
Register Overview
Detailed Configuration Register Description
Configuration Register 0 (Address 0x0)
Configuration Register 1 (Address 0x1)
Configuration Register 2 (Address 0x2)
Configuration Register 3 (Address 0x3)
Configuration Register 4 (Address 0x4)
Configuration Register 5 (Address 0x5)
Configuration Register 6 (Address 0x6)
Configuration Register 7:8 (Address 0x7, 0x8)
Configuration Register 11:9 (Address 0x9;0xA;0xB)
Configuration Register 12 (Address 0xC)
Configuration Register 13 (Address 0xD)
Configuration Register 14 (Address 0xE)
Configuration Register 15 (Address 0xF)
Configuration Register 16 (Address 0x10)
Configuration Register 17 (Address 0x11)
Configuration Register 18 (Address 0x12)
Configuration Register 19 (Address 0x13)
Configuration Register 20 (Address 0x14)
Configuration Register 21 (Address 0x15)
Configuration Register 22(Address 0x16)
Configuration Register 23 (Address 0x17)
Configuration Register 24 (Address 0x18)
Configuration Register 25 (Address 0x19)
Configuration Register 26 (Address 0x1A)
Configuration Register 27 (Address 0x1B)
Configuration Register 28 (Address 0x1C)
Configuration Register 29 (Address 0x1D)
Configuration Register 30 (Address 0x1E)
Configuration Register 31 (Address 0x1F)
Configuration Register 32 (Address 0x20)
Configuration Register 33 (Address 0x21)
Configuration Register 34 (Address 0x22)
Configuration Register 35 (Address 0x23)
Configuration Register 36 (Address 0x24)
Configuration Register 37 (Address 0x25)
Configuration Register 38 (Address 0x26)
Configuration Register 39 (Address 0x27)
Configuration Register 40 (Address 0x28)
Configuration Register 41 (Address 0x29)
Configuration Register 42 (Address 0x30)
Configuration Register 47 (Address 0x2F)
Configuration Register 48 (Address 0x30)
Configuration Register 49 (Address 0x31)
Configuration Register 50 (Address 0x32)
Configuration Register 51 to 53: ams internal Registers, 0x00 mandatory
Configuration Register 54 (Address 0x36)
Configuration Register 55 to 61: ams internal Registers, 0x00 mandatory
Configuration Register 62 (Address 0x3e)
Configuration Register 63 (Address 0x3f)
Read Registers
Result Registers
Status Registers
Principles of Operation
Converter Frontend
Capacitance-to-Digital Converter (CDC)
CDC Compensation Options
CDC Important Parameters
Guarding
RDC Resistance-to-Digital Converter
RDC Important Parameters
Interfaces (Serial & PDM/PWM)
Serial Interfaces (SIF)
I²C Compatible Interface
SPI Interface
GPIO and PDM/PWM
Oscillators
DSP & Memory
DSP & Environment
RAM Structure
NVRAM and ROM
DSP Configuration
Instruction Set
Instruction Details
ROM Routines
Assembly Programs
Directives
Sample Code
“for” Loop
“while” Loop
“do - while” Loop
“do - while” with 2 pointers
Rotate Right A to B
Libraries
pcap_standard.h
PCap04_ROM_addresses_standard.h
pcap_config.h
Application Information
Schematic
Minimized Bonding
Package Drawings & Markings
PCB Pad Layout
Tape & Reel Information
Soldering & Storage Information
Ordering & Contact Information
RoHS Compliant & ams Green Statement
Copyrights & Disclaimer
Document Status
Revision Information
Content Guide
General Description
PCap04
Capacitance-to-Digital Converter
PCap04 is a capacitance-to-digital converter (CDC) with
integrated digital signal processor (DSP) for on-chip data
post-processing. Its front end is based on ams PICOCAP
principle.
This conversion principle offers outstanding flexibility with
respect to power consumption, resolution and speed. Further,
PCap04 covers a wide capacitance input range from a few
femtofarads up to several hundreds of nanofarads. It is easy to
configure the PCap04 for different capacitance measurement
tasks, i.e. single as well as differential sensors in both, grounded
or floating connection. The on-chip DSP allows to implement
sensor algorithms like linearization and temperature
compensation, with data output in a digital (SPI or IIC) or analog
(PDM/PWM) way.
Ordering Information and Content Guide appear at end of
datasheet.
Key Benefits & Features
The benefits and features of PCap04, Capacitance-to-Digital
Converter are listed below:
Figure 1:
Added Value of Using PCap04
Benefits
Features
• High flexibility: Easy adaption to various
applications - ultra low power, high resolution or
high speed - just by configuration
• High resolution or high speed
• Up to 6 capacitors grounded, 3 capacitors floating
• Capacitance range 1pF to 100nF
• Internal reference 1pF to 31pF
• Integrated guard driver
• Up to 8aF at 2.5Hz and 10pF base capacitance
• Up to 50kHz sample rate
• Up to 20-bit resolution
• On-chip DSP for sensor algorithms, signal
post-processing including linearization and
temperature compensation
• On-chip and external temperature measurement
capability
• 32-bit DSP
• 3k ROM code, 1k NVRAM
• 96 x 32 bit RAM
• SPI / IIC interface
• PDM / PWM outputs, GPIO
• Supply voltage 2.1/3.0V to 3.6V
• Operating current down to 3μA
• PCap04-Bxxx -40°C to 85°C
• PCap04-Axxx -40°C to 125°C
• QFN24 or die (1.588mm x 1.46mm)
ams Datasheet
[v1-03] 2018-Apr-04
Page 1
Document Feedback
PCap04 − General Description
Applications MEMS Sensors
The PCap04 applications include:
• Position sensors
• Pressure sensors
• Force sensors
• Proximity sensor
• Acceleration sensors
• Inclination sensors
• Humidity sensors
• Dewpoint sensors
• Tilt sensors
• Angle sensors
• Wireless applications
• Level sensors
Block Diagram
The functional blocks of this device are shown below:
Figure 2:
Functional Blocks of PCap04
PC0
PC1
PC2
PC3
PC4
PC5
PCAUX /
GUARD_OUT
PTOUT
PT0REF
PT1
CDC
Internal:
PC6
RDC
VDD33 VDD18 GND
Voltage
regulator
Data Memory
96 x 32 bit RAM
data
rad
c_add_ptr
start
stop
start
stop
TDC
tdc_start_value
tdc_stop_value
tdc_trig_dsp
r_add_ptr
DSP IO
PDM
data
rad
Result Registers
DSP
128 x 32bit
opcode
pc
Config Register
XROM
~ 3000 x
8bit
NVRAM
1024x 8bit
Boot
SIF
SPI /
I2C
internal
clocks
GPI
O
MUX
PG5
PG4
PG3
PG2
MISO_PG1
SSN_PG0
SCK_SCL
MOSI_SDA
IIC_EN
Page 2
Document Feedback
ams Datasheet
[v1-03] 2018-Apr-04
PCap04 − Pin Assignments
Pin Assignments
Figure 3:
Pin Diagram of PCap04 Die
PCap04 will be available in QFN24 package or as pure die.
A
D
S
_
S
O
cM
n
L
C
S
_
K
2
G
C
P
S
28 27 26 25 24 23 22 21 20
3
3
D
D
V
_
D
N
G
N
E
_
C
D
N
G
c
n
c
f
i
I
I
I
3
G
P
29
9
1
8
1
7
1
6
1
PG5
MISO_PG1
SSN_PG0
nc
nc
3
1
2
1
1
1
GND
nc
nc
PG4
0
3
nc
PCAUX
PC4
PC5
nc
PC0
PC1
3
3
4
3
5
3
6
3
7
3
8
3
PCap04
1.46 x 1.588 mm²
1
2 3 4 5 6 7 8 9 10
2
C
P
3
C
P
D
N
G
H
_
D
N
G
H
_
8
1
D
D
V
1
T
P
8
1
D
D
V
3
3
D
D
V
F
E
R
0
T
P
T
U
O
T
P
(Changed “GUARD” and “ROSZ” to “nc” at Image above)
Note(s):
1. Die dimensions: 1.588 mm x 1.46 mm (w/ seal) with pad pitch 120 μm, pad opening is 85 μm x 85 μm. Thickness 290μm.
Figure 4:
Pin Diagram of PCap04 QFN24
A
D
S
_
S
O
M
I
L
C
S
_
K
C
S
3
3
D
D
V
N
E
_
C
I
I
4
G
P
3
G
P
8
1
7
1
6
1
5
1
4
1
3
1
PCAUX
PC4
PC5
PC0
PC1
PC2
19
20
21
22
23
24
PCap04
12
11
10
9
8
7
PG2
PG5
MISO_PG1
SSN_PG0
GND
PTOUT
123456
3
C
P
D
N
G
1
T
P
8
1
D
D
V
3
3
D
D
V
F
E
R
0
T
P
ams Datasheet
[v1-03] 2018-Apr-04
Page 3
Document Feedback
PCap04 − Pin Assignments
Pin Description
Pin Name
Description
If Not Used
PC2
PC3
GND_H
GND
VDD18_H
VDD18 (1)
VDD33 (2)
CDC port
CDC port
Core supply voltage
I/O supply voltage
PT1
RDC port (temperature sensor)
PT0REF
RDC port (temperature sensor or external
reference)
PTOUT (3)
Discharge capacitor for RDC
n.c.
n.c.
GND
n.c.
n.c.
No pad
No pad
No pad
Always open
SSN_PG0
MISO_PG1
Serial select line. Otherwise, general
purpose I/O port
Master in/Slave out when SPI is used.
Otherwise, general purpose I/O port
General purpose I/O port
General purpose I/O port
Serial interface select, 0 = SPI enable
1 = IIC enable
PG5
PG2
GND
GND_ifc
IIC_EN
VDD33
open
open
GND
GND
VDD18
VDD18
VDD33
open
open
open
open
open
open
open
GND
GND
VDD33
Figure 5:
Pin Description of PCap04
Pin Number
Die
24-Pin QFN
1
2
3
4
5
6
7
8
9
10
11
12
13
14/15
16
17
18
19
20
21
22
23
24
24
1
2
3
4
5
6
7
8
9
10
11
12
13
14
Page 4
Document Feedback
ams Datasheet
[v1-03] 2018-Apr-04
PCap04 − Pin Assignments
Pin Number
Die
24-Pin QFN
Pin Name
Description
If Not Used
25
26
27
28
29
30
31/32
33
34
35
36
37
38
15
MOSI_SDA
Master out/Slave in when SPI is used.
Otherwise, serial data for IIC
n.c.
n.c.
Always open
Always open
SCK_SCL
Serial clock for SPI/IIC
PG3
PG4
n.c.
PCAUX
PC4
PC5
n.c.
PC0
PC1
General purpose I/O port
General purpose I/O port
No pad
Auxiliary port
- For external compensation capacitance
or
- External discharge resistor
- Guarding output
CDC port
CDC port
Always open
CDC port
CDC port
open
open
open
open
open
open
open
open
16
17
17
19
20
21
22
23
Note(s):
1. Connect buffer capacitor ≥ 4.7μF
2. Connect buffer capacitor ≥ 10μF
3. Connect 10nF C0G
4. Center pad is internally connected to GND. No wires other than GND are allowed underneath.
5. It is recommended to not use the center pad. Too much solder paste could reduce solder quality.
6. Suitable socket: e.g. Plastronics 32QN50S15050D.
ams Datasheet
[v1-03] 2018-Apr-04
Page 5
Document Feedback
PCap04 − Pin Assignments
Pad Coordinates
Figure 6:
Pad Coordinates of PCap04
Pad Number
Description
X-POS (µm)
Y-POS (µm)
1
2
3
4
5
6
7
8
9
10
11
12
13
14/15
16
17
18
19
20
21
22
23
24
25
26
27
28
PC2
PC3
GND_H
GND
VDD18_H
VDD18
VDD33
PT1
PT0REF
PTOUT
n.c.
n.c.
GND
n.c.
n.c.
SSN_PG0
MICO_PG1
PG5
PG2
GND
GND_ifc
IIC_EN
VDD33
MOSI_SDA
n.c.
n.c.
SCK_SCL
260.0
380.0
488.0
608.0
728.0
848.0
968.0
1088.0
1208.0
1328.0
No pad
No pad
1528.5
No pad
No pad
1528.5
1528.5
1528.5
1333.0
1213.0
1093.0
973.0
853.0
733.0
No pad
No pad
374.7
59.5
59.5
59.5
59.5
59.5
59.5
59.5
59.5
59.5
59.5
No pad
No pad
501.0
No pad
No pad
965.0
1085.0
1205.0
1400.5
1400.5
1400.5
1400.5
1400.5
1400.5
No pad
No pad
1400.5
Page 6
Document Feedback
ams Datasheet
[v1-03] 2018-Apr-04
PCap04 − Pin Assignments
Pad Number
Description
X-POS (µm)
Y-POS (µm)
29
30
31/32
33
34
35
36
37
38
PG3
PG4
n.c.
PCAUX
PC4
PC5
n.c.
PC0
PC1
254.7
59.5
No pad
59.5
59.5
59.5
No pad
59.5
59.5
1400.5
1205.0
No pad
859.9
739.8
619.8
No pad
379.8
259.8
Note(s):
1. Pad coordinates are center/center (x/y-direction), relative to die origin die dimensions: 1.588mm x 1.46mm (with seal, 15μm each
side) with pad pitch 120 μm, pad opening is 85μm x 85μm
ams Datasheet
[v1-03] 2018-Apr-04
Page 7
Document Feedback
PCap04 − Absolute Maximum Ratings
Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. These are stress
ratings only. Functional operation of the device at these or any
other conditions beyond those indicated under Electrical
Characteristics is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device
reliability.
Absolute Maximum Ratings
Figure 7:
Absolute Maximum Ratings
Symbol
Parameter
Min
Max
Units
Comments
VDD / VGND
Supply Voltage to
Ground
Input Pin Voltage to
Ground
Input Current (latch-up
immunity) @125°C
Electrical Parameters
- 0.3
-0.3
4.0
4.0
V
V
±100
mA
JEDEC JESD78D Nov 2011
VIN
ISCR
PT
Continuous Power Dissipation (TA = 70°C)
Continuous Power
Dissipation
1.44
mW
Electrostatic Discharge
ESDHBM
Electrostatic Discharge
HBM
± 1000
V
JS-001-2014
Temperature Ranges and Storage Conditions
TA
RTHJA
TJ
TSTRG
-40
- 40
Operating Ambient
Temperature
PCap04-Bxxx
PCap04-Axxx
Junction to Ambient
Thermal Resistance
Operating Junction
Temperature
PCap04-Bxxx
PCap04-Axxx
Storage Temperature
Range
-55
85
125
28
85
125
150
°C
°C
°C/W
°C
°C
°C
Page 8
Document Feedback
ams Datasheet
[v1-03] 2018-Apr-04
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