第1页 / 共62页
第2页 / 共62页
第3页 / 共62页
第4页 / 共62页
第5页 / 共62页
第6页 / 共62页
第7页 / 共62页
第8页 / 共62页
UBLOX-GPS模块设计指南-GPS模组官方资料.pdf
Preface
Contents
1 Hardware description
1.1 Overview
1.2 Architecture
1.3 Power management
1.3.1.1 VCC - main power
1.3.1.2 V_BCKP - backup battery
1.3.1.3 VDD_USB - USB interface power supply
1.3.2.1 Maximum Performance mode
1.3.2.2 Eco mode
1.3.2.3 Power Save mode
1.4 Antenna supply - V_ANT (LEA-6)
1.5 System functions
1.6 Interfaces
1.6.2.1 USB external components
1.6.3.1 Communicating to an I2C EEPROM with the GPS receiver as I2C master
1.6.4.1 Connecting SPI FLASH memory
1.6.4.2 SPI communication (connecting to an SPI master)
1.6.4.3 Pin configuration with module as one of several slaves
1.7 I/O pins
2 Design-in
2.1 Design-in checklist
2.2 LEA-6 design
2.2.2.1 Second time pulse for LEA-6T
2.2.2.2 LEA-6R considerations
2.3 NEO-6 design
2.4 Layout
2.4.2 Placement
2.4.3 Antenna connection and grounding plane design
2.5 Antenna and antenna supervisor
2.5.3 Active antenna
2.5.4.1 Short circuit protection
2.5.5.1 Short and open circuit active antenna supervisor
3 Product handling
3.1 Packaging, shipping, storage and moisture preconditioning
3.2 Soldering
3.3 EOS/ESD/EMI Precautions
3.3.8.1 Isolation between GPS and GSM antenna
3.3.8.2 Increasing jamming immunity
3.3.8.3 In-band jamming
3.3.8.4 Out-band jamming
4 Product testing
4.1 u-blox in-series production test
4.2 Test parameters for OEM manufacturer
4.3 System sensitivity test
Appendix
A Abbreviations
B Migration to u-blox-6 receivers
B.1 Checklist for migration
B.2 Software migration
B.3 Hardware Migration
B.3.1 Hardware Migration: ANTARIS 4 ( u-blox 6
B.3.2 Hardware Migration: u-blox 5 ( u-blox 6
B.4 Migration of LEA modules
B.4.1 Migration from LEA-4 to LEA-6
B.4.2 Migration from LEA-5 to LEA-6
B.5 Migration of NEO modules
B.5.1 Migration from NEO-4S to NEO-6
B.5.2 Migration from NEO-5 to NEO-6
C Interface Backgrounder
C.1 DDC Interface
C.1.1 Addresses, roles and modes
C.1.2 DDC troubleshooting
C.2 SPI Interface
C.2.1 SPI basics
Related documents
Revision history
Revision history (Internal)
Contact
e
t
a
r
e
e
c
c
a
,
e
t
a
c
n
u
m
m
o
c
,
e
t
a
c
o
i
l
l
LEA-6 / NEO-6
u-blox 6 GPS Modules
Hardware Integration Manual
Abstract
This document describes the features and specifications of the cost
effective and high-performance LEA-6 and NEO-6 GPS modules
featuring the u-blox 6 positioning engine.
These compact, easy to integrate stand-alone GPS receiver modules
combine exceptional GPS performance with highly flexible power,
design, and connectivity options. Their compact form factors and
SMT pads allow fully automated assembly with standard pick &
place and reflow soldering equipment for cost-efficient, high-
volume production enabling short time-to-market.
www.u-blox.com
LEA-6 / NEO-6 - Hardware Integration Manual
Document Information
Title
LEA-6 / NEO-6
Subtitle
u-blox 6 GPS Modules
Document type
Hardware Integration Manual
Document number
GPS.G6-HW-09007-A
Document status
Preliminary
Document status information
Objective
Specification
Advance
Information
Preliminary
This document contains target values. Revised and supplementary data will be published
later.
This document contains data based on early testing. Revised and supplementary data will
be published later.
This document contains data from product verification. Revised and supplementary data
may be published later.
This document contains the final product specification.
Released
This document applies to the following products:
Name
LEA-6H
LEA-6S
Type number
All
All
ROM/FLASH version
FW6.02
ROM6.02
ROM6.02
ROM6.02
FW DR 1.0
ROM6.02
ROM6.02
ROM6.02
LEA-6A
LEA-6T
LEA-6R
NEO-6G
NEO-6Q
NEO-6M
All
All
All
All
All
All
This document and the use of any information contained therein, is subject to the acceptance of the u-blox terms and conditions. They
can be downloaded from www.u-blox.com.
u-blox makes no warranties based on the accuracy or completeness of the contents of this document and reserves the right to make
changes to specifications and product descriptions at any time without notice.
u-blox reserves all rights to this document and the information contained herein. Reproduction, use or disclosure to third parties without
express permission is strictly prohibited. Copyright © 2010, u-blox AG.
u-blox® is a registered trademark of u-blox Holding AG in the EU and other countries. ARM® is the registered trademark of ARM Limited in
the EU and other countries.
GPS.G6-HW-09007-A
Page 2 of 62
LEA-6 / NEO-6 - Hardware Integration Manual
Preface
u-blox Technical Documentation
As part of our commitment to customer support, u-blox maintains an extensive volume of technical
documentation for our products. In addition to our product-specific technical data sheets, the following manuals
are available to assist u-blox customers in product design and development.
• GPS Compendium: This document, also known as the GPS book, provides a wealth of information
regarding generic questions about GPS system functionalities and technology.
• Receiver Description including Protocol Specification: Messages, configuration and functionalities of
the u-blox 6 software releases and receivers are explained in this document.
• Hardware Integration Manual: This Manual provides hardware design instructions and information on
how to set up production and final product tests.
• Application Note: document provides general design instructions and information that applies to all u-blox
GPS receivers. See Section Related documents for a list of Application Notes related to your GPS receiver.
How to use this Manual
The LEA-6 / NEO-6 Hardware Integration Manual provides the necessary information to successfully design in
and configure these u-blox 6-based GPS receiver modules. For navigating this document please note the
following:
This manual has a modular structure. It is not necessary to read it from the beginning to the end. To help in
finding needed information, a brief section overview is provided below:
1. Hardware description: This chapter introduces the basics of function and architecture of the u-blox 6
modules.
2. Design-in: This chapter provides the Design-In information necessary for a successful design.
3. Product handling: This chapter defines packaging, handling, shipment, storage and soldering.
4. Product testing: This chapter provides information about testing of OEM receivers in production.
5. Appendix: The Appendix includes guidelines on how to successfully migrate to u-blox 6 designs, and useful
information about the different antenna types available on the market and how to reduce interference in
your GPS design.
The following symbols are used to highlight important information within the manual:
An index finger points out key information pertaining to module integration and performance.
A warning symbol indicates actions that could negatively impact or damage the module.
Questions
If you have any questions about u-blox 6 Hardware Integration, please:
• Read this manual carefully.
• Contact our information service on the homepage http://www.u-blox.com
• Read the questions and answers on our FAQ database on the homepage http://www.u-blox.com
GPS.G6-HW-09007-A
Preliminary
Preface
Page 3 of 62
LEA-6 / NEO-6 - Hardware Integration Manual
Technical Support
Worldwide Web
Our website (www.u-blox.com) is a rich pool of information. Product information, technical documents and
helpful FAQ can be accessed 24h a day.
By E-mail
If you have technical problems or cannot find the required information in the provided documents, contact the
nearest of the Technical Support offices by email. Use our service pool email addresses rather than any personal
email address of our staff. This makes sure that your request is processed as soon as possible. You will find the
contact details at the end of the document.
Helpful Information when Contacting Technical Support
When contacting Technical Support please have the following information ready:
• Receiver type (e.g. LEA-6A-0-000), Datacode (e.g. 160200.0300.000) and firmware version (e.g. FW6.02)
• Receiver configuration
• Clear description of your question or the problem together with a u-center logfile
• A short description of the application
• Your complete contact details
GPS.G6-HW-09007-A
Preliminary
Preface
Page 4 of 62
LEA-6 / NEO-6 - Hardware Integration Manual
Contents
Preface ................................................................................................................................ 3
Contents .............................................................................................................................. 5
1.4
1.5
1.3.1
1.3.2
1.5.1
1.5.2
1 Hardware description .................................................................................................. 8
1.1 Overview .............................................................................................................................................. 8
1.2
Architecture .......................................................................................................................................... 8
Power management ............................................................................................................................. 9
1.3
Connecting power ........................................................................................................................ 9
Operating modes ........................................................................................................................ 10
Antenna supply - V_ANT (LEA-6) ....................................................................................................... 11
System functions ................................................................................................................................ 11
EXTINT - External interrupt pin ..................................................................................................... 11
System monitoring ...................................................................................................................... 11
Interfaces ............................................................................................................................................ 11
UART ........................................................................................................................................... 11
USB ............................................................................................................................................. 11
Display Data Channel (DDC) ........................................................................................................ 12
SPI (NEO-6) .................................................................................................................................. 14
I/O pins ............................................................................................................................................... 17
RESET_N ...................................................................................................................................... 17
EXTINT0 ...................................................................................................................................... 17
AADET_N (LEA-6) ........................................................................................................................ 17
Configuration pins (LEA-6S/6A, NEO-6) ....................................................................................... 17
1.7.1
1.7.2
1.7.3
1.7.4
1.6.1
1.6.2
1.6.3
1.6.4
1.6
1.7
2.2
2.1
2.2.1
2.2.2
2.1.1
2.1.2
2 Design-in ..................................................................................................................... 18
Design-in checklist .............................................................................................................................. 18
Layout design-in checklist ............................................................................................................ 18
Design considerations .................................................................................................................. 20
LEA-6 design ...................................................................................................................................... 21
LEA-6 passive antenna design ...................................................................................................... 21
Pin description for antenna designs (LEA-6) ................................................................................. 22
NEO-6 design ..................................................................................................................................... 24
Passive antenna design (NEO-6) ................................................................................................... 24
Layout ................................................................................................................................................ 25
Footprint and paste mask ............................................................................................................ 25
Placement ................................................................................................................................... 26
Antenna connection and grounding plane design ....................................................................... 28
Antenna micro strip ..................................................................................................................... 29
Antenna and antenna supervisor ........................................................................................................ 30
Passive antenna ........................................................................................................................... 31
2.4.1
2.4.2
2.4.3
2.4.4
2.3.1
2.5.1
2.3
2.4
2.5
GPS.G6-HW-09007-A
Preliminary
Contents
Page 5 of 62
LEA-6 / NEO-6 - Hardware Integration Manual
2.5.2
2.5.3
2.5.4
2.5.5
Active antenna (LEA-6) ................................................................................................................ 31
Active antenna (NEO-6) ............................................................................................................... 32
Active antenna bias power (LEA-6) .............................................................................................. 33
Active antenna supervisor (LEA-6)................................................................................................ 33
3.1
3.2
3 Product handling ........................................................................................................ 38
Packaging, shipping, storage and moisture preconditioning ............................................................... 38
Soldering ............................................................................................................................................ 38
Soldering paste............................................................................................................................ 38
3.2.1
Reflow soldering ......................................................................................................................... 38
3.2.2
Optical inspection ........................................................................................................................ 39
3.2.3
Cleaning ...................................................................................................................................... 40
3.2.4
Repeated reflow soldering ........................................................................................................... 40
3.2.5
3.2.6 Wave soldering............................................................................................................................ 40
Hand soldering ............................................................................................................................ 40
3.2.7
3.2.8
Rework ........................................................................................................................................ 40
3.2.9
Conformal coating ...................................................................................................................... 40
3.2.10 Casting ........................................................................................................................................ 40
3.2.11 Grounding metal covers .............................................................................................................. 41
3.2.12 Use of ultrasonic processes .......................................................................................................... 41
EOS/ESD/EMI Precautions .................................................................................................................... 41
Abbreviations .............................................................................................................................. 41
Electrostatic discharge (ESD) ........................................................................................................ 41
ESD handling precautions ............................................................................................................ 41
ESD protection measures ............................................................................................................. 42
Electrical Overstress (EOS) ............................................................................................................ 43
EOS protection measures ............................................................................................................. 43
Electromagnetic interference (EMI) .............................................................................................. 43
GSM applications ........................................................................................................................ 44
Recommended parts ................................................................................................................... 46
3.3.1
3.3.2
3.3.3
3.3.4
3.3.5
3.3.6
3.3.7
3.3.8
3.3.9
3.3
4.1
4.2
4.3
4 Product testing ........................................................................................................... 47
u-blox in-series production test ........................................................................................................... 47
Test parameters for OEM manufacturer .............................................................................................. 47
System sensitivity test ......................................................................................................................... 48
Guidelines for sensitivity tests ...................................................................................................... 48
‘Go/No go’ tests for integrated devices ........................................................................................ 48
4.3.1
4.3.2
Appendix .......................................................................................................................... 49
A Abbreviations ............................................................................................................. 49
B Migration to u-blox-6 receivers ................................................................................. 49
Checklist for migration ....................................................................................................................... 49
Software migration ............................................................................................................................. 51
B.1
B.2
GPS.G6-HW-09007-A
Preliminary
Contents
Page 6 of 62
C
LEA-6 / NEO-6 - Hardware Integration Manual
B.3
B.3.1
B.3.2
Hardware Migration ........................................................................................................................... 52
Hardware Migration: ANTARIS 4 u-blox 6 ............................................................................... 52
Hardware Migration: u-blox 5 u-blox 6 ................................................................................... 52
B.4 Migration of LEA modules .................................................................................................................. 52
B.4.1 Migration from LEA-4 to LEA-6 ................................................................................................... 52
B.4.2 Migration from LEA-5 to LEA-6 ................................................................................................... 54
B.5 Migration of NEO modules ................................................................................................................. 54
B.5.1 Migration from NEO-4S to NEO-6................................................................................................ 54
B.5.2 Migration from NEO-5 to NEO-6 ................................................................................................. 55
Interface Backgrounder ............................................................................................. 56
C.1 DDC Interface ..................................................................................................................................... 56
Addresses, roles and modes ........................................................................................................ 56
DDC troubleshooting .................................................................................................................. 57
SPI Interface ........................................................................................................................................ 58
SPI basics ..................................................................................................................................... 58
C.1.1
C.1.2
C.2.1
C.2
Related documents........................................................................................................... 61
Revision history ................................................................................................................ 61
Contact .............................................................................................................................. 62
GPS.G6-HW-09007-A
Preliminary
Contents
Page 7 of 62
LEA-6 / NEO-6 - Hardware Integration Manual
1 Hardware description
1.1 Overview
The LEA-6 and NEO-6 modules are standalone GPS receivers featuring the high performance u-blox-6 positioning
engine. These compact, easy to integrate modules combine exceptional GPS performance with highly flexible
power, design, and connectivity options. Their compact form factors and SMT pads allow fully automated
assembly with standard pick & place and reflow-soldering equipment for cost-efficient, high-volume production
enabling short time-to-market.
u-blox GPS modules are not designed for life saving or supporting devices or for aviation and should not be used
in products that could in any way negatively impact the security or health of the user or third parties or that
could cause damage to goods.
1.2 Architecture
LEA-6 and NEO-6 modules consist of two functional parts - the RF and the Baseband sections. See Figure 1 and
Figure 2 for block diagrams of the modules.
The RF Front-End includes the input matching elements, the SAW bandpass filter, the u-blox 6 RF-IC (with
integrated LNA) and the frequency source.
The Baseband section contains the u-blox 6 Baseband processor, the RTC crystal and additional elements such as
the optional FLASH Memory for enhanced programmability and flexibility.
SAW
Filter
RF Front-End
with
Integrated LNA
Antenna
Supervision
& Supply
TCXO or
Crystal (optional)
Power Control
RF_IN
V_ANT
AADET_N
VCC_RF
VCC_OUT
VCC
V_BCKP
G ND
Figure 1: LEA-6 block diagram
Baseband Processor
Digital
IF Filter
SRAM
Power
Management
GPS/GALILEO
Engine
ROM Code
Backup
RAM
ARM7TDMI-S®
RTC
FLASH EPROM
(optional)
RTC
Crystal
USB V2.0
RESET_N
CFG
UART
EXTINT
TIMEPULSE
DDC
GPS.G6-HW-09007-A
Preliminary
Hardware description
Page 8 of 62
相关推荐
FX系列微型可编程控制器用户手册（通信篇）.pdf
FX2N系列PLC培训教程.pdf
Modbus协议资料.pdf
WM8978中文资料(芯片资料).doc
5-1.【Codelab】HarmonyOS基于图像模块实现图库图片的四种常见操作.pdf
GX Developer 编程软件使用说明.pdf
uCOS-III的任务调度算法研究.pdf
STM32F407ZGT6(芯片资料).pdf
ModBus通讯规约-0701中文版.pdf
ATK-NEO-6M GPS模块常见问题汇总_201400721.pdf
STM32F103x8B_DS_CH_V10(7STM32中文数据手册).pdf
MR-E伺服与FX3G接线图.pdf
